• Title/Summary/Keyword: dry-etching

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Dry etching of pt thin film in inductive coupled BCl$_{3}$/Cl$_{2}$ plasmas (유도 결합 BCl$_{3}$/Cl$_{2}$ 플라즈마내에서 Pt 박막의 건식 식각)

  • 김남훈;김창일;권광호;장의구
    • Proceedings of the IEEK Conference
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    • 1998.06a
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    • pp.375-378
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    • 1998

  • Platinum thin film which hardly form volatile compounds with any reactive gas at normal process temperature was etched in inductive coupled BCl$_{3}$/Cl$_{2}$ plasma. The etch rate of platinum thin film increased with increasing Cl$_{2}$/(Cl$_{2}$ + BCl$_{3}$) ratio. That reasoned increasing of ion current density.

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The Silylation Photo Resist Process and the Enhanced-Inductively Coupled Plasma (E-ICP) (Silylation Photo resist 공정과 Enhanced-Inductively Coupled Plasma (E-ICP))

  • 정재성;박세근;오범환
    • Proceedings of the IEEK Conference
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    • 1999.06a
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    • pp.922-925
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    • 1999

  • The Silylation photo-resist etch process was tested by Enhanced-ICP dry etcher. The comparison of the two process results of micro pattern etching with 0.25${\mu}{\textrm}{m}$ CD by E-ICP and ICP reveals that E-ICP has better quality than ICP The etch rate and the microloading effect was improved in E-ICP Especially, the problem of the lateral etch was improved in E-ICP.

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A Silicon Micromachined Fluidic Amplifier and Performance Analysis with Computational Fluid Dynamics (실리콘 마이크로머시닝을 이용한 유체증폭기의 제작과 수치해석을 이용한 해석)

  • Kim, Tae-Hyun;Cho, Dong-Il
    • Proceedings of the KIEE Conference
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    • 1996.07c
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    • pp.1963-1967
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    • 1996

  • This paper describes the analysis, design, and silicon-fabrication of a fluidic proportional amplifier, which is the most important element of fluidic logic circuits. First, FEM(finite element method) analyses were performed, using the Fluent computational fluid dynamics program, and design geometries were optimized. Then, a $40\;{\mu}m$-deep amplifier was fabricated in silicon using anisotropic dry etching.

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The Characteristics of Magnetized Planar type Inductively Coupled Plasma and its Application to a Dry Etching Process (자화된 평판형 유도 결합 플라즈마의 특성 및 건식 식각에의 응용)

  • Lee, Soo-Boo;Park, Hun-Gun;Lee, Seok-Hyun
    • Proceedings of the KIEE Conference
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    • 1997.07d
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    • pp.1364-1366
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    • 1997

  • Planar type magnetized inductively coupled plasma etcher has been built. The density and temperature of Ar plasma are measured as a function of rf power, external magnetic field, and pressure. The oxide etch rate and selectivity to polysilicon are measured as the above mentioned conditions and self-bias voltage.

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Fabrication of Gallium Phosphide Tapered Nanostructures on Selective Surfaces

  • Song, Young Min;Park, Hyun Gi
    • Applied Science and Convergence Technology
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    • v.23 no.5
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    • pp.284-288
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    • 2014

  • We present tapered nanostructures fabricated on a selective area of gallium phosphide substrates for advanced optoelectronic device applications. A lithography-free fabrication process was accomplished by dry etching of metal nanoparticles. Thermal dewetting of micro-patterned metal thin films provides etch masks for tapered nanostructures. This simple process also allows the formation of plasmonic surfaces with corrugated shapes. Rigorous coupled-wave analysis calculations provide design guidelines for tapered nanostructures on gallium phosphide substrates.

  • https://doi.org/10.5757/ASCT.2014.23.5.265 인용 PDF