• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.39-46
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• 2021

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1442-1444
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• 1995

In this study, we confirmed that the crystallinity and the mechanical properties of polycrystalline Silicon(poly-Si) deposited on the poly-oxide are better than those of poly-Si on the conventional sacrificial layers that is CVD oxide layer or PSG. But the etch rate of poly-oxide is poor than that of the CVD oxide layer or PSG. Therefore, to make the best use of small stress and fast etch rate, we fabricated the double oxide layer; 10%-thick poly-oxide on 90%-thick CVD oxide or PSG. To estimate structure deformation by stress, we fabricated the test structures; cantilever. bridge and ring/beam structure and estimated by SEM. As the results, all structure is expressed the deformed structure by residual stress(tensile stress) and the deformation of the structure layer on the double oxide layer is small compared with that of the structure layer on the CVD oxide layer or PSG. And, the etch rate of the double oxide layer is enhanced compared with that of the poly-oxide.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.63-69
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• 2012

Adhesion and mechanical reliability of silicon/epoxy/polyimide interfaces are critical issues for flexible electronics. Bonds between these interfaces are mainly hydrogen bonds, so their adhesion is weaker than cohesive fracture toughness and vulnerable to moisture. In order to enhance adhesion and suppress moisture-assisted debonding, UV/Ozone treatment and innovative sol-gel derived hybrid layers were applied to silicon/epoxy/polyimide interfaces. The fracture energy and subcritical crack growth rate were measured by using a double cantilever beam (DCB) fracture mechanics test. Results showed that UV/Ozone treatment increased the adhesion, but was not effective for improving reliability against humidity. However, by applying sol-gel derived hybrid layers, adhesion increase as well as suppresion of moisture-assisted cracking were achieved.

• Journal of the Korean Ceramic Society
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• v.31 no.10
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• pp.1099-1106
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• 1994

It is suggested that the microstructural toughening process in the initial rising portion of R-curves observed in polycrystalline alumina should be different from the grain bridging mechanism identified in the long crack regime. Microcracking in the advancing crack front seems to be a prerequisite for the development of unbroken bridging ligaments behind the crack tip. In order to test such a proposition, attempts were made to identify experimentally the presence of microcracks in the frontal zone of propagating cracks. In-situ observation is made of crack growth in a miniature double cantilever beam specimen of a average grain size of 10 ${\mu}{\textrm}{m}$ alumina. Presence of a few microcracks was identified in front of crack tip on the propagating crack plane. The R-curves were re-evaluated based on the observation.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.220-226
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• 1998

In this pater, a method of strength evaluation applying fracture mechanics in adhesively bonded joints of A1/A1 materials was investigated. Various adhesively bonded joints of double-cantilever beam with a interfacial crack in its adhesive layer were prepared for the fracture toughness test of comprehensive mixed mode conditions from nearly pure mode I to mode II. The experiment of fracture toughness was carried out under various mixed mode conditions with an interfacial crack and critical energy release rate, Gc by the experimental measurements of compliances was determined. From the results, fracture toughness on mixed mode with an interfacial crack is well characterized by strain energy release rate and a method of strength evaluation by the fracture toughness in adhesively bonded joints of A1/A1 materials was discussed.

• Transactions of the Korean Society of Automotive Engineers
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• v.14 no.2
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• pp.67-75
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• 2006

In this paper, the compensation of ultrasonic scattering on interface crack depending on thickness variations of A1/Epoxy bonded dissimilar components was applied to improve measuring accuracy by using ultrasonic attenuation coefficient. The optimum conditions of theoretical value and experimental measuring accuracy by the ultrasonic method in A1/Epoxy bonded dissimilar components have been investigated. From the experimental results, the measurement method of interfacial crack lengths by using ultrasonic attenuation coefficient was proposed and discussed. After the ultrasonic scattering compensation depending on thickness variations of bonded dissimilar components was carried out, the measuring accuracy of interfacial crack length was improved by 5%.

• Journal of the Korean Society of Safety
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• v.20 no.1 s.69
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• pp.49-54
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• 2005

Recently, many kinds of advanced composite materials have been used in various industry fields. Among them, fabric CFRP composites are being used as primary structural components in many applications because of their superior properties. However, the complexity of the fabric structure makes understanding of their failure behavior very difficult. The mechanical strength and crack propagation of plain woven carbon fiber fabric laminate composites are examined by acoustic emission(AE) method. AE signals are acquired during the tensile test and fracture tests. Thus, the relationship between AE signal and mechanical behavior curves and crack extension length are shown. Also the interlaminar fracture toughness in terms of AE characteristics are discussed in viewpoint of crack propagation behavior.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.25-30
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• 2004

In this paper, the compensation of interfacial scatter due to adhesive layer and adherend thickness ratio variation was applied to improve measuring precision by calculating ultrasonic attenuation coefficient in the Al/Epoxy dissimilar bonded components. The optimum condition of theoretical value and experimental measuring accuracy by the ultrasonic method in the Al/Epoxy dissimilar bonded components have been investigated. From the experimental results, we proposed a measurement method of the interfacial crack lengths by the ultrasonic attenuation coefficient and discussed it.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.3
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• pp.157-164
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• 2003

The pulse-echo method is one of the most widely used ultrasonic techniques for application of nondestructive evaluation. Particularly, quantitative nondestructive evaluation of defects has been considered more important to assure the reliability and the safety of structure. Frequency energy in adhesive joints is based on the ultrasonic wave analysis. The attenuation coefficient upon wave amplitude and the frequency energy that is expressed in the term of wave pressure amplitude were utilized for the primary wave experiment. By means of a control experiment, it was confirmed that the variation of the frequency energy in adhesive joints depends on transition by stress variation. In this paper, the ultrasonic characteristics were measured for single lap joint and Double Cantilever Beam specimen with different fracture modes that was subjected to stress. Consequently, the data that was obtained from the adhesive specimen was analytically compared to the fracture mechanics parameter

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.5
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• pp.474-481
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• 2009

Fracture models and criteria of adhesive with two parameters, namely $G_C$ and ${\sigma}_{max}$, have been developed to describe the fracture process of adhesive joints. Cohesive zone model(CZM) is a representative two parameter failure criteria approach. In CZM, ${\sigma}_{max}$ is a critical, limiting maximum value of the stress in the damage zone ahead of the crack and is assumed to have some physical significance in adhesive failure. Based on CZM and finite element analysis method, the relationship between fracture load and adhesive properties, as $G_{IC)$ and $({\sigma}_{max})_I$, was investigated in adhesively bonded joint tensile test and T-peel test. The two parameters in tensile mode loading were evaluated by using the relationship. The value of $G_{\IC}$ evaluated by proposed method showed close agreement with analytical solution for tapered double cantilever beam(TDCB) test which proposed in an ASTM standard.