• 제목/요약/키워드: doping material

검색결과 789건 처리시간 0.029초

실험계획법을 적용한 X7R 적층 칩 커패시터의 희토류(Y2O3, Er2O3) 첨가에 따른 전기적 특성 (The Electrical Properties of Mutilayer Chip Capacitor with X7R by Addition of Rare-Earth Ions (Y2O3, Er2O3) using Design of Experiments)

  • 윤중락;문환;이헌용
    • 한국전기전자재료학회논문지
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    • 제23권3호
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    • pp.216-221
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    • 2010
  • Employing statistical design of experiments, the difference in doping behaviors of rare-earth ions and their effects on the dielectric property and microstructure of $BaTiO_3$-MgO-$MnO_2$-($Ba_{0.4}Ca_{0.6}$) $SiO_3-Re_2O_3$ (Re = $Y_2O_3$, $Er_2O_3$) system were investigated. Through the statistical analysis we have found that the amount of $Re_2O_3$ are significantly affecting on the dielectric properties. The $Re_2O_3$ improved the dielectric constant, dielectric loss and R*C constant, so the appropriate contents of $Y_2O_3$ and $Er_2O_3$ were 0.8 ~ 1.2 mol% and 0.8 ~ 1.3 mol%, respectively. The MLCC(mutilayer chip capacitor) with $2.0{\times}1.2{\times}1.2mm$ size and 475 nF was also suited for X7R with the above composition. It showed that the dielectric constant and RC constant were 2,839 and 3,675 ${\Omega}F$, respectively in the sintering condition at $1250^{\circ}C$ in $Po_2$ $10^{-7}$ Mpa.

SiGe-Si-SiGe 채널구조를 이용한 JFET 시뮬레이션 (Simulation of Junction Field Effect Transistor using SiGe-Si-SiGe Channel Structure)

  • 박병관;양하용;김택성;심규환
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.94-94
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    • 2008
  • We have performed simulation for Junction Field Effect Transistor(JFET) using Silvco to improve its electrical properties. The device structure and process conditions of Si-control JFET(Si-JFET) were determined to set its cut off voltage and drain current(at Vg=0V) to -0.5V and $300{\mu}A$, respectively. From electrical property obtained at various implantation energy, dose, and drive-in conditions of p-gate doping, we found that the drive in time of p-type gate was the most determinant factor due to severe diffusion. Therefore we newly designed SiGe-JFET, in which SiGe layer is to epitaxial layers placed above and underneath of the Si-channel. The presence of SiGe layer lessen the p-type dopants (Boron) into the n-type Si channel the phenomenon would be able to enhance the structural consistency of p-n-p junction. The influence of SiGe layer will be discussed in conjunction with boron diffusion and corresponding I-V characteristics in comparison with Si-control JFET.

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화학용액 증착법으로 제조한 Bi0.9A0.1Fe0.975V0.025O3+α(A=Nd, Tb) 박막의 구조와 전기적 특성 (Microstructural and Electrical Properties of Bi0.9A0.1Fe0.975V0.025O3+α(A=Nd, Tb) Thin Films by Chemical Solution Deposition Method)

  • 장성근;김윤장
    • 한국전기전자재료학회논문지
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    • 제30권10호
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    • pp.646-650
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    • 2017
  • We have evaluated the ferroelectric and electrical properties of pure $BiFeO_3$ (BFO) and $Bi_{0.9}A_{0.1}Fe_{0.975}V_{0.025}O_{3+{\alpha}}$ (A=Nd, Tb) thin films on $Pt(111)/Ti/SiO_2/Si(100)$ substrates by using a chemical solution deposition method. The remnant polarization ($2P_r$) of the $Bi_{0.9}Tb_{0.1}Fe_{0.975}V_{0.025}O_{3+{\alpha}}$ (BTFVO) thin film was approximately $65{\mu}C/cm^2$, with a maximum applied electric field of 950 kV/cm and a frequency of 10 kHz, where as that of the $Bi_{0.9}Nd_{0.1}Fe_{0.975}V_{0.025}O_{3+{\alpha}}$ (BNFVO) thin film was approximately $37{\mu}C/cm^2$ with a maximum applied electric field of 910 kV/cm. The leakage current density of the co-doped BNFVO thin film was four orders of magnitude lower than that of the pure BFO thin film, at $2.75{\times}10^{-7}A/cm^2$ with an applied electric field of 100 kV/cm. The grain size and uniformity of the co-doped BNFVO and BTFVO thin films were improved, in comparison to the pure BFO thin film, through structural modificationsdue to the co-doping with Nd and Tb.

고상법으로 합성한 YVO4:Eu3+ 적색 형광체의 비대칭비와 발광 특성 (Asymmetry Ratio and Emission Properties of YVO4:Eu3+ Red Phosphors Synthesized by Solid-state Reaction Method)

  • 장재영;안세혁;방준혁;마권도;김춘수;조신호
    • 한국전기전자재료학회논문지
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    • 제25권4호
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    • pp.298-303
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    • 2012
  • $Y_{1-x}VO_4:Eu_x^{3+}$ red phosphors were synthesized with changing the mol ratios of $Eu^{3+}$ ions by using the solid-state reaction method. The crystalline structure of phosphors was found to be a tetragonal system with the maximum diffraction intensity at $25.02^{\circ}$. The grain particles showed the truncated hexagonal patterns with a very homogeneous size distribution at 0.05 mol of $Eu^{3+}$ ion. The excitation spectra of the phosphor ceramics were composed of a broad band centered at 303 nm and weak narrow multilines peaked in the range of 360-420 nm. The dominant emission spectrum was the strong red emission centered at 619 nm due to the $^5D_0{\rightarrow}^7F_2$ electric dipole transition. The experimental results suggest that the optimum doping mol ratio of $Eu^{3+}$ ions for preparing the red phosphors is 0.10 mol with the asymmetry ratio of 5.21.

Dy2O3를 첨가한 (Ba,Sr,Ca)TiO3 후막의 구조 및 전기적 특성 연구 (Structural and Electrical Properties of (Ba,Sr,Ca)TiO3 Thick Films doped with Dy 2O3)

  • 노현지;박상만;윤상은;이성갑
    • 한국전기전자재료학회논문지
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    • 제20권8호
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    • pp.680-684
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    • 2007
  • In this study, we investigated the effects of structural and electrical properties of $(Ba_{0.6},\;Sr_{0.3},\;Ca_{0.1})TiO_3$ thick films with variation $Dy_2O_3$ contents. $(Ba_{0.6},\;Sr_{0.3},\;Ca_{0.1})TiO_3$ powders, prepared by the sol-gel method, were mixed organic vehicle. The BSCT thick films doped with 0.1, 0.3, 0.5, 0.7 mol% $Dy_2O_3$ were fabricated by the screen-printing techniques on the alumina substrates and the structural and dielectric properties were investigated with variation of $Dy_2O_3$ doping contents. All BSCT thick films were sintered at $1420^{\circ}C$, for 2hr. In the TG-DTA analysis, the formation of the polycrystalline perovskite phase was observed at around $670 ^{\circ}C$. In the XRD analysis, all BSCT thick films showed the cubic perovskite structure. The average thickness of BSCT thick films was approximately $65{\mu}m$. The Curie temperature decreased with increasing $Dy_2O_3$ amount. The relative dielectric constant and dielectric loss of BSCT thick films doped with $Dy_2O_3$ 0.1 mol% were 6267 and 2.6 %, respectively.

Ln0.7Ca0.3MnO3(Ln = Nd, Sm, La)의 자기적 전기적 특성 (Magnetic and Electrical Properties of Ln0.7Ca0.3MnO3 (Ln = Nd, Sm, La))

  • 전검배;임흥수;이찬규;구본흔;이상민;정명화;조영훈
    • 한국재료학회지
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    • 제17권4호
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    • pp.203-206
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    • 2007
  • Effects of doping rare earth elements on Ln site of $Ln_{0.7}Ca_{0.3}MnO_3$ (Ln = N d, Sm and La) were examined from structure, magnetic and electrical properties. Size of a-axis increased as following order of La < Nd < Sm, whereas c-axis was not much changed. Curie temperatures of 170 K for $Nd_{0.7}Ca_{0.3}MnO_3$, 110 K for $Sm_{0.7}Ca_{0.3}MnO_3$ and 250 K for $La_{0.7}Ca_{0.3}MnO_3$ were obtained. This result coincides with change of Mn-O bond length causing by a-axis lattice constant. The highest magnetroresistance ratios were 22% at 77 K for $Sm_{0.7}Ca_{0.3}MnO_3$, 32% at 110 K for $Nd_{0.7}Ca_{0.3}MnO_3$, and 33% at 180 K for $La_{0.7}Ca_{0.3}MnO_3$.

고전압 전력소자를 보호하기 위한 센스펫 설계방법 (A Design Method on Power Sensefet to Protect High Voltage Power Device)

  • 경신수;서준호;김요한;이종석;강이구;성만영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.6-7
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    • 2008
  • Current sensing in power semiconductors involves sensing of over-current in order to protect the device from harsh conditions. This technique is one of the most important functions in stabilizing power semiconductor device modules. The sense FET is very efficient method with low power consumption, fast sensing speed and accuracy. In this paper we have analyzed the characteristics of proposed sense FET and optimized its electrical characteristics to apply conventional 450V power MOSFET devices by numerical and simulation analysis. The proposed sense FET has the n-drift doping concentration $1.5\times10^{14}cm^{-3}$, size of $600{\mu}m^2$ with 4.5 $\Omega$, and off-state leakage current below 50 ${\mu}A$. We offer the layout of the proposed sense FET to process actually. The offerd design and optimization methods is meaningful, which the methods can be applied to the power devices having various breakdown voltages for protection.

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GaN 기반 LED구조의 p-GaN층 성장온도에 따른 광학적, 결정학적 특성 평가 (Optical and microstructural behaviors in the GaN-based LEDs structures with the p-GaN layers grown at different growth temperatures)

  • 공보현;김동찬;김영이;한원석;안철현;최미경;조형균;이주영;김홍승
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.144-144
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    • 2008
  • Blue light emitting diode structures consisting of the InGaN/GaN multiple quantum wells were grown by metalorganic chemical vapor deposition at different growth temperatures for the p-GaN contact layers and the influence of growth temperature on the emission and microstructural properties was investigated. The I-V and electroluminescence measurements showed that the sample with a p-GaN layer grown at $1084^{\circ}C$ had a lower electrical turn-on voltage and series resistance, andenhanced output power despite the low photoluminescence intensity. Transmission electron microscopy (TEM) revealed that the intense electro luminescence was due to the formation of a p-GaN layer with an even distribution of Mg dopants, which was confirmed by TEM image contrast and strain evaluations. These results suggest that the growth temperature should be optimized carefully to ensurethe homogeneous distribution of Mg as well as the total Mg contents in the growth of the p-type layer.

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RTA 방법에 의해 Zn 도핑된 InP의 오믹저항 특성연구 (Study on Ohmic resistance of Zn-doping InP using RTA method)

  • 김효진;김인성;김태언;김상택;김선훈;기현철;이경민;양명학;고항주;김회종
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.237-238
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    • 2008
  • 본 연구에서는 APD 소자 제작시 주로 쓰이는 RTA에 의한 Zn 확산방법에 사용할 경우 undoped InP의 V/III비율에 따른 Zn원자의 확산, 도핑, 오믹저항의 성장을 조사하였다. RTA에 의한 확산 및 활성화 열처리 시 도핑 농도의 프로파일은 확산열처리만 한 경우보다 활성화 처리한 경우 더 커짐을 볼 수 있었다. SIMS 결과 활성화 처리 후 표면쪽에 Zn원자의 약간의 결핍현상을 보이는 데 이는 표면쪽에 Zn원자의 탈착이 약간 이루어지는 것으로 보인다. 이 원인은 결과적으로 오믹저항의 증가를 가져왔다.

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이온주입 공정을 이용한 4H-SiC p-n diode에 관한 시뮬레이션 연구 (Simulation study of ion-implanted 4H-SiC p-n diodes)

  • 이재상;방욱;김상철;김남균;구상모
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.131-131
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    • 2008
  • Silicon carbide (SiC) has attracted significant attention for high frequency, high temperature and high power devices due to its superior properties such as the large band gap, high breakdown electric field, high saturation velocity and high thermal conductivity. We performed Al ion implantation processes on n-type 4H-SiC substrate using a SILVACO ATHENA numerical simulator. The ion implantation model used a Monte-Carlo method. We studied the effect of channeling by Al implantation simulation in both 0 off-axis and 8 off-axis n-type 4H-SiC substrate. We have investigated the Al distribution in 4H-SiC through the variation of the implantation energies and the corresponding ratio of the doses. The implantation energies controlled 40, 60, 80, 100 and 120 keV and the implantation doses varied from $2\times10^{14}$ to $1\times10^{15}cm^{-2}$. In the simulation results, the Al ion distribution was deeper as increasing implantation energy and the doping level increased as increasing implantation doses. After the post-implantation annealing, the electrical properties of Al-implanted p-n junction diode were investigated by SILV ACO ATLAS numerical simulator.

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