• 한국태양에너지학회:학술대회논문집
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• 2011.11a
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• pp.51-55
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• 2011

In this paper, the optimized doping condition of crystalline silicon solar cells with 156 ${\times}$ 156 mm2 area was studied. To optimize the drive-in condition in the doping process, the other conditions except drive-in temperature and time were fixed. After etching 7 ${\mu}m$ of the surface to form the pyramidal structure, the silicon nitride deposited by the PECVD had 75~80 nm thickness and 2 to 2.1 for a refractive index. The silver and aluminium electrodes for front and back sheet, respectively, were formed by screen-printing method, followed by firing in $400-425-450-550-850^{\circ}C$ five-zone temperature conditions to make the ohmic contact. Drive-in temperature was changed in range of $828^{\circ}C$ to $860^{\circ}C$ and time was from 3 min to 40 min. The sheet resistance of wafer was fixed to avoid its effect on solar cell. The solar cell fabricated with various conditions showed the similar conversion efficiency of 17.4%. This experimental result showed the drive-in temperatures and times little influence on solar cell characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.5
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• pp.441-448
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• 2002

The electrical properties of the GaN-based green light emitting diodes(LEDs) with the Mg-doped p-GaN layer activated in $N_2$ or $O_2$ ambient have been compared. For the $N_2$ -ambient activation the current-voltage behavior of LEDs has been found to be improved when the Mg dopants activation was performed in the higher temperature. However, for the $O_2$-ambient activation the current-voltage characteristic has been observed to be enhanced when the Mg dopants activation was carried out in the lower temperature. The minimum forward voltage at 20mA was obtained to be 4.8 V for LEDs with the p-GaN layer activated at $900^{\circ}C$ in the $N_2$ ambient and 4.5V for LEDs with the p-GaN layer treated at $700^{\circ}C$ in the $O_2$ambient, repectively. The forward voltage reduction of the LEDs treated in the $O_2$-ambient may be related to the oxygen co-doping of the p-GaN layer during the activation process. The $O_2$ -ambient activation process is useful for the enhancement of the LED performance as well as the fabrication process since this process can activate the Mg dopants in the low temperature.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.10
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• pp.665-669
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• 2015

We investigated and compared two methods of in-situ oxidation and chemical etching treatment (CET) to remove the boron rich layer (BRL). The BRL is generally formed during boron doping process. It has to be controlled in order not to degrade carrier lifetime and reduce electrical properties. A boron emitter is formed using $BBr_3$ liquid source at $930^{\circ}C$. After that, in-situ oxidation was followed by injecting oxygen of 1,000 sccm into the furnace during ramp down step and compared with CET using a mixture of acid solution for a short time. Then, we analyzed passivation effect by depositing $Al_2O_3$. The results gave a carrier lifetime of $110.9{\mu}s$, an open-circuit voltage ($V_{oc}$) of 635 mV at in-situ oxidation and a carrier lifetime of $188.5{\mu}s$, an $V_{oc}$ of 650 mV at CET. As a result, CET shows better properties than in-situ oxidation because of removing BRL uniformly.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.111-111
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• 2007

Further scaling the semiconductor devices down to low dozens of nanometer needs the extremely shallow depth in junction and the intentional counter-doping in the silicon gate. Conventional ion beam ion implantation has some disadvantages and limitations for the future applications. In order to solve them, therefore, plasma source ion implantation technique has been considered as a promising new method for the high throughputs at low energy and the fabrication of the ultra-shallow junctions. In this paper, we study about the effects of DC bias and base pressure as a process parameter. The diluted mixture gas (5% $PH_3/H_2$) was used as a precursor source and chamber is used for vacuum pressure conditions. After ion doping into the Si wafer(100), the samples were annealed via rapid thermal annealing, of which annealed temperature ranges above the $950^{\circ}C$. The junction depth, calculated at dose level of $1{\times}10^{18}/cm^3$, was measured by secondary ion mass spectroscopy(SIMS) and sheet resistance by contact and non-contact mode. Surface morphology of samples was analyzed by scanning electron microscopy. As a result, we could accomplish the process conditions better than in advance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.207-210
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• 2005

In order to investigate the influence of the homo buffer layer on the microstructure of the ZnO thin film, undoped ZnO buffer layer were deposited on sapphire (0001) substrates by ultra high vaccum pulsed laser deposition (UHV-PLD) and molecular beam eiptaxy (MBE). After high temperature annealing at $600^{\circ}C$ for 30min, undoped ZnO buffer layer was deposited with various oxygen pressure (35~350mtorr). On the grown layer of undoped ZnO, Arsenic-doped(l, 3wt%) ZnO layers were deposited by UHV-PLD. The optical property of the ZnO was analyzed by the photoluminescence (PL) measurement. From $\Theta-2\Theta$ XRD analysis, all the films showed strong (0002) diffraction peak, and this indicates that the grains grew uniformly with the c-axis perpendicular to the substrate surface. Field emission scanning electron microscope (FE-SEM) revealed that microstructures of the ZnO were varied with oxygen pressure, arsenic doping level, and the deposition method of undoped ZnO buffer layers. The films became denser and smoother in the cases of introducing MBE-buffer layer and lower oxygen pressure during As-doped ZnO deposition. Higher As-doping concentration enhanced the columnar-character of the films.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.6
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• pp.486-490
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• 2011

To investigate the effect of two-emission-layer structure on the emission characteristics of the phosphorescent white organic light-emitting diodes (PHWOLEDs), the PHWOLEDs with two different emission layers, blue EML(29 nm, FIrpic-doped mCP) and red EML(1 nm, Ir(pq)$_2$acac-doped CBP)), following host-guest system were fabricated. The bi-layered blue EML was composed of mCP:FIrpic (20 nm, 7 vol.%) and mCP:FIrpic (9 nm, 7, 10, 15, 20, and 25 vol.%, respectively). When the concentration of FIrpic was increased from 7 to 15 vol.%, light emission luminance, current efficiency, and external quantum efficiency were increased. On the contrary, when the concentration of FIrpic was increased to more than 20 vol.%, light emission luminance, current efficiency, and external quantum efficiency were decreased. The PHWOLEDs with the bi-layered blue EML structure of mCP:FIrpic (20 nm, 7 vol.%) and mCP:FIrpic (9 nm, 15 vol.%) showed current efficiency of 29.7 cd/A and external quantum efficiency (EQE) of 16.6% at 1,000 $cd/cm^2$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.3
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• pp.240-244
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• 2011

The high cost of crystalline silicon solar cells has been considered as one of the major obstacles to their terrestrial applications. Spin on doping (SOD) is presented as a useful process for the manufacturing of low cost solar cells. Phosphorus (P509) was used as an n-type emitters of solar cells. N-type emitters were formed on p-type EFG ribbon Si wafers by using a SOD at different spin speed (1,000~4,000 rpm), diffusion temperatures ($800^{\circ}C{\sim}950^{\circ}C$), and diffusion time (5~30 min) in $N_2+O_2$ atmosphere. With optimum condition, we were able to achieve cell efficiency of 14.1%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.10
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• pp.814-820
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• 2009

Antimony (Sb) doped ZnO thin films (0.1 at.%) were deposited on sapphire (0001) substrates at various temperatures (200 - 600$^{\circ}C$) by using pulsed laser deposition technique. All the thin films have been characterized by X-ray diffractometer, atomic force microscopy and spectrophotometer to investigate their structural, morphological and optical properties, respectively. Hall measurements were also carried out to identify the electrical properties of the thin films. These thin films were constituted in wurtzite structure with the preferential orientation of (002) diffraction plane and had as high as 80% optical transmission in the visible range. The bandgap energy also was determined by spectrophotometer which was around 3.28 eV. Hall measurements results revealed that the Sb dope ZnO thin film (0.1 at.%) grown at $500^{\circ}C$ exhibited p-type conduction with a carrier concentration of $8.633\times10^{16}\;cm^{-3}$, a mobility of $1.41\;cm^2/V{\cdot}s$ and a resistivity of $51.8\;\Omega{\cdot}cm$. We have successfully achieved p-type conduction in antimony doped ZnO thin films with low doping level even though the electrical properties are not favorable. This paper suggests the feasibility of p-type doping with large-size-mismatched dopant by using pulsed laser deposition.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.5
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• pp.513-519
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• 2023

It was reported that a tetragonal phase can be stabilized with maintaining good piezoelectric properties when Na_0.5K_0.5NbO₃ (KNN) is modified with 0.06 mol SrTiO₃. However, such a high amount of SrTiO₃ leads not only to poor sinterability but low Curie temperature (T_C). To maintain high TC with good piezoelectric properties in KNN-based lead-free piezoelectric ceramics, this study investigates the effect of Li-doping on the dielectric and piezoelectric properties of 0.96Na_0.5K_0.5NbO₃-0.04SrTiO₃ (KNN-4ST) ceramics. As a result, the orthorhombic-tetragonal phase transition was observed at 2 mol% Li₂CO₃ modified KNN-4ST ceramics, whose T_C, d₃₃ and k_p values are 328℃, 165pC/N and 0.33, respectively.

• Nuclear Engineering and Technology
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• v.55 no.5
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• pp.1763-1774
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• 2023

In this study, a series of flexible neutron/gamma shielding composites are fabricated through the doping of Gd₂O₃ into the matrix of SEBS with (M_Gd2O3: M_SEBS) % from 5% to 100%. Neutron transmittance test shows an exponential attenuation with the increase of areal density of Gd, in which the transmittance T ranges from 59.1440% to 35.3026%, with standard deviation less than 2.2743%, mass attenuation coefficient 𝜇_m from 0.3194 cm²/g to 0.4999 cm²/g, and half value layer-HVL value from 2.4530 mm to 1.1313 mm. Shielding efficiency of the Gd₂O₃/SEBS composites is basically improved in comparison with that of B₄C/SEBS. The transmittance T, mass/linear attenuation coefficient 𝜇_m and 𝜇, HVL and effective atomic number Z_eff for the shielding of γ rays (39 keV, 59 keV and 122 keV) are measured and calculated with XCOM as well as MCX programs. Finally, plots of the three dimensional relationships between transmittance, doping amount and thickness are provided to the guidance for engineering shielding design. In summary, the Gd₂O₃/SEBS composite is proved to be an effective flexible neutron/low energy γ rays shielding material, which could be of potential applications in the field of nuclear technology and nuclear engineering.