• Journal of Korean Society of Environmental Engineers
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• v.33 no.12
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• pp.900-906
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• 2011

To investigate concentration and sources of PCDD/Fs and Co-PCBs in sediments, total 52 sediment samples were measured at 17 sites in Geum River. As a result of analysis, total concentrations of PCDD/Fs and Co-PCBs were ranged from not detected (N.D.)~193.47 pg/g-d.w. (mean value: 84.52 pg/g-d.w) and 0.34~359.19 pg/g-d.w (mean value: 114.65 pg/g-d.w.) respectively. Also, toxic equivalent (TEQ) concentration of PCDD/Fs and Co-PCBs were ranged from N.D.~5.12 (mean value: 0.88) pg I-TEQ/g-d.w and N.D.~0.58 (mean value: 0.09) $WHO_{2005}$-TEQ pg/g-d.w. respectively. The upstream indicate the highest concentration and as it goes to the downstream, it has tendency to decrease. Higher chlorinated compounds were dominant in most of site which detected PCDD/Fs. Occurrence of Co-PCBs isomer patterns appear similar to each sampling site was found. The isomer patterns showed similar between sediment and PCB products. The principal component analysis also showed that the samples contained the characteristics of PCBs products.

• Analytical Science and Technology
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• v.14 no.2
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• pp.147-158
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• 2001

Polychlorinated dibenzo-p-dioxins(PCDDs), dibenzofurans(PCDFs), and biphenyls(PCBs) were analyzed by HRGC/HRMS in human blood samples from the Siwha industrial area in Korea. The PCDD/F and PCB concentrations in workers were higher than those in residents. The average TEQ concentrations of PCDD/Fs in workers and residents were 40.3 pg I-TEQs/g lipid and 16.6 pg I-TEQs/g lipid, respectively, and the total PCB concentrations were 174.1 ng/g lipid and 151.0 ng/g lipid, respectively. When applied to principal component analysis, the PCDD/F congener distributions of workers were differentiated from those of residents. But, all of them were similar to the distribution in several Korean foods. Estimated daily intake(EDI) of each person was calculated, and then only 40% to the total people were within the tolerable daily intake range(1-4pg I-TEQ/kg bw/day) suggested by WHO(1997).

• Journal of Korean Society for Atmospheric Environment
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• v.19 no.5
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• pp.469-490
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• 2003

Atmospheric concentrations of persistent organic pollutants (POPs) were measured at Gosan, Jeju in November 2001 and spring 2002, each time for two weeks. Primary target pollutants were organochlorine pesticides, coplanar polychlorinated biphenyls (co- PCBs), and dioxin/furans listed in the Stockholm Convention adopted in May 2001. Polycyclic aromatic hydrocarbons (PAHs) were also measured in order to understand the overall characteristics of the POPs distribution as well as PM$_{2.5}$, a potent carrier of POPs. In the latter part of the measurement period of November 2001, almost every pollutant of combustion origin including dioxin/furans went high probably due to influence of emissions in the nearby area. The characteristics of atmospheric environment at Gosan in this period were rather close to urban areas far from those of a background area. A severe dust storm swept for three days at the end of the measurement period of spring 2002. However, changes in pollutant concentrations were relatively small except PM$_{10}$. Nevertheless, increases in particulate PAHs and OCDD (octachlorinated dibenzo-p-dioxins), mostly present in fine particles, were observed. Trends in organochlorine pesticide variations were mixed although possible volatilization of DDT residues from soil was inferred from the measurements of spring 2002.2.2.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.43-50
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• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.