• Corrosion Science and Technology
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• 제22권2호
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• pp.108-114
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• 2023

In this study, anti-corrosion effect was investigated through various electrochemical experiments after applying Al thermal spraying technology to AA5083-H321. Open circuit potential and anodic polarization curves were analyzed through electrochemical experiments in natural seawater. The shape of the surface was observed using a scanning electron microscope (SEM) and a 3D microscope before and after the experiment. Component and crystal structure were analyzed through EDS and XRD. As a result, the surface roughness of AA5083-H321 and the Al thermal sprayed coating layer increased due to surface damage caused by anodic dissolution reaction during the anodic polarization experiment. The corrosion rate of AA5083-H321 was relatively low because the Al thermal spray coating layer contained structural defects such as pores and crevices. Nevertheless, the open circuit potential of the Al thermal spray coating layer in natural seawater was measured about 0.2 V lower than that of AA5083-H321. Thus, a sacrificial anode protection effect can be expected.

• Corrosion Science and Technology
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• 제22권6호
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• pp.478-483
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• 2023

This study examined the corrosion behavior of bimetal materials composed of Fe-Ni alloy and Fe-Ni-Mo alloy, both suitable for use in electromagnetic switches. Electrochemical polarization and weight loss measurements revealed that, in contrast to Fe-Ni alloy, which exhibited pseudo-passivity behavior, Fe-Ni-Mo alloy had higher anodic current density, displaying only active dissolution and greater weight loss. This indicated a lower corrosion resistance in the Fe-Ni-Mo alloy. Equilibrium calculations for the phase fraction of precipitates suggested that the addition of 1 wt% Mo may lead to the formation of second-phase precipitates, such as Laves and M₆C, in the γ matrix. These precipitates might degrade the homogeneity of the passive film formed on the surface, leading to localized attacks during the corrosion process. Therefore, considering the differences in corrosion kinetics between these bimetal materials, the early degradation caused by galvanic corrosion should be prevented by designing a new alloy, optimizing heat treatment, or implementing periodic in-service maintenance.

• Nuclear Engineering and Technology
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• 제56권2호
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• pp.688-706
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• 2024

Austenitic stainless steels (ASS) are extensively employed in various sectors such as nuclear, power, petrochemical, oil and gas because of their excellent structural strength and resistance to corrosion. SS304 and SS316 are the predominant choices for piping, pressure vessels, heat exchangers, nuclear reactor core components and support structures, but they are susceptible to stress corrosion cracking (SCC) in chloride-rich environments. Over the course of several decades, extensive research efforts have been directed towards evaluating SCC using diverse methodologies and models, albeit some uncertainties persist regarding the precise progression of cracks. This review paper focuses on the application of Acoustic Emission Technique (AET) for assessing SCC damage mechanism by monitoring the dynamic acoustic emissions or inelastic stress waves generated during the initiation and propagation of cracks. AET serves as a valuable non-destructive technique (NDT) for in-service evaluation of the structural integrity within operational conditions and early detection of critical flaws. By leveraging the time domain and time-frequency domain techniques, various Acoustic Emission (AE) parameters can be characterized and correlated with the multi-stage crack damage phenomena. Further theories of the SCC mechanisms are elucidated, with a focus on both the dissolution-based and cleavage-based damage models. Through the comprehensive insights provided here, this review stands to contribute to an enhanced understanding of SCC damage in stainless steels and the potential AET application in nuclear industry.

• 한국구조물진단유지관리공학회 논문집
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• 제23권2호
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• pp.51-59
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• 2019

철근의 대체보강재로서 섬유보강근에 대한 적용연구가 증가하고 있으며, 단기거동에 대한 많은 연구가 진행되어 왔다. 본 연구에서는 동결융해와 알칼리 환경하에서의 바살트와 유리섬유보강근의 미세구조와 인장거동 변화를 실험적으로 평가하였다. 100회까지의 동결융해에서 5% 내외의 강도와 탄성계수 저하가 발생하였다. 20일까지의 초기 미세구조변화의 경우 알칼리용액의 온도가 낮은 경우에는 손상이 거의 발생하지 않았으나, $60^{\circ}C$에서는 20일 경과시에도 수지 용해와 섬유 손상이 관찰되었으며, 수지계면의 섬유분리가 발견되었다. 알칼리 환경에서는 $20^{\circ}C$환경에서 100일까지는 10% 내외의 강도저하 현상이 발생하였으며, 500일 노출시 최대50%의 강도 저하가 발생하는 것으로 관찰되었다. $40^{\circ}C$와 $60^{\circ}C$ 환경에서는 50일과 100일에서 급격한 강도저하가 관찰되었으며, 바살트섬유보강근의 경우에는 알칼리에서 섬유부풀음에 의한 손상으로 강도저하가 더 크게 나타났다. 따라서 블레이디드된 섬유보강근의 장기성능을 향상시키기 위해서는 내알칼리성 확보를 위한 표면처리가 필요한 것으로 분석되었다.

• 전기화학회지
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• 제6권4호
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• pp.242-249
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• 2003

아연 전극은 고농도의 KOH전해질 용액의 알카리 전지용 양극재료로 폭넓게 이용되고 있다. 그러나 급속한 전기화학적 반응과 높은 용해도에 의한 수지상의 생성에 의해 사이클 수명이 현저하게 짧아지는 것으로 알려져 있다. 본 연구에서는 용액온도 $25^{\circ}C$의 $40wt.\%$ KOH 전해질에 $Ca(OH)_2$, Citrate, Tartrate 및 Gluconate 등의 첨가제를 첨가하고 그리고 $Pb_3O_4\;5wt\%$를 아연 전극에 혼합하였을 때 아연 전극의 전기화학적 거동에 미치는 Pb,04와 첨가제의 효과를 동전위 분극 곡선, 순환전위전해분석법, 가속수명시험 및 SEM사진 분석을 통하여 고찰하였다. $Pb_3O_4$의 첨가는 아연 전극의 부식 속도를 확실히 감소시키는 효과가 있었으며 그리고 $Pb_3O_4$의 첨가에 의한 아연 전극의 부식 전위는 순수아연 전극에 비하여 다소 높았으나 개로 전압에는 거의 영향이 없었다. 그리고 4가지 종류의 첨가제는 내식성과 가속 수명시험시의 사이클 수명을 향상시키는 데 중요한 역할을 하고 있는 것으로 확인되었다. 더욱이 Tartrate 첨가는 4가지 종류의 첨가제 중에서 상대적으로 충방전 특성을 개선할 뿐 아니라 양호한 내식성 효과가 확인되었다.

• 공업화학
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• 제16권2호
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• pp.250-256
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• 2005

자동차 산업에서의 도장 외관은 아주 중요하다. 이러한 도장외관의 향상을 위해서 기본적으로 도막의 내식성과 밀착성이 해결되어야 한다. 도막의 물성의 향상을 위해서 금속의 화성피막은 매우 중요한 요소가 되고 있다. 전착도장 중 음극에서의 pH는 12 정도까지 증가하고, 이 같은 강알카리 조건에서 금속과 화성피막의 용해가 일어난다. 이 같은 현상의 화성피막과 소재사이의 결합력을 감소시키게 된다. 일반적으로 인산염 피막구조는 hopeite 및 phosphphylife 구조를 갖지만 hopeite 피막 구조보다는 phosphophyllite 피막구조가 내식성이 보다 우수하고, 양이온 전착도료에 의한 전착도장에서 강알카리화된 계면에서 피막의 알카리 용해성이 적어 내수밀착성의 향상을 보인다. Ni, Mn 등의 보조금속의 첨가는 P-ratio (phosphophyllite/ hopeite + phosphophyllite)를 증가시키므로 내수 밀착성과 내식성을 향상시키게 됨을 알 수 있었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Corrosion Science and Technology
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• 제17권2호
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• pp.45-53
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• 2018

A new 80Ti-15Ta-5Zr wt% alloy surface was protected by anodic oxidation in phosphoric acid solution. The protective oxide layer (TiO2, ZrO2 and Ta suboxides and thickness of 15.5 nm) incorporated $PO{_4}^{3-}$ ions from the solution, according to high resolution XPS spectra. The AFM analysis determined a high roughness with SEM detected pores (20 - 50 nm). The electrochemical studies of bare and anodically oxidized Ti-15Ta-5Zr alloy in Carter-Brugirard saliva of different pH values and saliva with 0.05M NaF, pointed to a nobler surface for the protected alloy, with a thicker electrodeposited oxide layer acting as a barrier against aggressive ions. The oxidized alloy significantly decreased corrosion current densities and total quantity of ions released into the oral environment in comparison with the bare one, at higher polarisation resistance and protective capacity of the electrodeposited layer. The impedance data revealed a bi-layered oxidation film formed by: a dense, compact, barrier layer in contact with the metallic substrate, decreasing the potential gradient across the metal/oxide layer/solution interface, reducing the anodic dissolution and a more permissive, porous layer in contact with the electrolyte. The open circuit potential for protected alloy shifted to nobler values, with thickening of the oxidation film signifying long-term protection.

• 한국표면공학회지
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• 제50권3호
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• pp.147-154
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• 2017

This research was conducted to investigate the electrochemical properties of the thin air-formed oxide film-covered AZ31 Mg alloy. Native air-formed oxide films on AZ31 Mg alloy samples were prepared by knife-abrading method and the changes in the electrochemical properties of the air-formed oxide film were investigated in seven different electrolytes containing the following anions $Cl^-$, $F^-$, $SO{_4}^{2-}$, $NO_3{^-}$, $CH_3COO^-$, $CO{_3}^{2-}$, and $PO{_4}^{3-}$. It was observed from open circuit potential (OCP) transients that the potential initially decreased before gradually increasing again in the solutions containing only $CO{_3}^{2-}$ or $PO{_4}^{3-}$ ions, indicating the dissolution or transformation of the native air-formed oxide film into new more protective surface films. The Nyquist plots obtained from electrochemical impedance spectroscopy (EIS) showed that there was growth of new surface films with immersion time on the air-formed oxide film-covered specimens in all the electrolyte. The least resistive surface films were formed in fluoride and sulphate baths whereas the most protective film was formed in phosphate bath. The potentiodynamic polarization curves illustrated that passive behaviour of AZ31 Mg alloy under anodic polarization appears only in $CO{_3}^{2-}$, or $PO{_4}^{3-}$ ions containing solutions and at more than $-0.4V_{Ag/AgCl}$ in $F^-$ ion containing solution.