• Macromolecular Research
• /
• v.12 no.3
• /
• pp.290-292
• /
• 2004

Multimode channel waveguides were fabricated using a direct UV patterning technology from thick films deposited by the one-step dip-coating of an organic/inorganic hybrid material (ORMOCER(equation omitted). The core size of the covered ridge waveguide was 43${\times}$51 $\mu\textrm{m}$$^2$; the waveguides can be readily prepared for multimode applications by direct UV patterning. The waveguides exhibited smooth surface profiles and a low optical loss of 0.07 ㏈/cm at the most important wavelength (850nm) used for optical interconnects.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.4
• /
• pp.83-89
• /
• 2015

In this paper, we propose a fabrication technique for enhanced electrical properties of piezoelectric thick films with excellent patterning property using sol-infiltration and a direct-patterning process. To achieve the needs of high-density and direct-patterning at a low sintering temperature (< $850^{\circ}C$), a photosensitive lead zirconate titanate (PZT) solution was infiltrated into a screen-printed thick film. The direct-patterned PZT films were clearly formed on a locally screen-printed thick film, using a photomask and UV light. Because UV light is scattered in the screen-printed thick film of a porous powder-based structure, there are needs to optimize the photosensitive PZT sol infiltration process for obtaining the enhanced properties of PZT thick film. By optimizing the concentration of the photosensitive PZT sol, UV irradiation time, and solvent developing time, the hybrid films prepared with 0.35 M of PZT sol, 4 min of UV irradiation and 15 sec solvent developing time, showed a very dense with a large grain size at a low sintering temperature of $800^{\circ}C$. It also illustrated enhanced electrical properties (remnant polarization, $P_r$, and coercive field, $E_c$). The $P_r$ value was over four times higher than those of the screen-printed films. These films integrated on silicon wafer substrate could give a potential of applications in micro-sensors and -actuators.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.11a
• /
• pp.287-287
• /
• 2007

The ferroelectric and electric properties of UV-irradiated bismuth lanthanum titanate (BLT) films prepared using photosensitive starting precursors were characterized. The effects of lanthanum doping on ferroelectric and electric properties were investigated by polarization-electric field hysteresis loops and leakage current-voltage measurements. X-ray diffractometer and ellipsometry were served to provide the information about the crystalline structure and thickness of the films after annealing. The images of the surface microstructure and direct-patterned BLT films were observed by using scanning electron microscopy. The effects of lanthanum doping on the electric properties of direct-pattern able BLT films and their direct-patterning were studied.

• Korean Journal of Materials Research
• /
• v.18 no.2
• /
• pp.98-102
• /
• 2008

The ferroelectric properties of UV irradiated and non-irradiated PZT films prepared via photochemical metal-organic deposition using photosensitive precursors were characterized. Fourier transform infrared spectroscopy showed that complete removal of organic groups was possible through UV exposure of the spin-coated PZT precursor films at room temperature. The measured remnant polarization values of UV-irradiated and non-irradiated PZT films after annealing at $650^{\circ}C$ were 29 and $23\;{\mu}C/cm^2$, respectively. The UV irradiation was found to be effective for the enhancement of the <111> growth orientation and ferroelectric property of PZT film and in the direct patterning in the fabrication of micro-patterned systems without dry etching.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2011.05a
• /
• pp.62.1-62.1
• /
• 2011

현재 상용화된 LED 또는 태양전지 등의 투명전극(TCO, transparent couducting oxide)재료로 높은 전기전도도와 광투과도를 갖는 ITO (Indium Tin Oxide)가 많이 채택되고 있다. 그러나 이에 사용되는 Indium의 단가가 높다는 문제점이 있어 이를 대체하기 위한 물질의 연구가 많이 이루어지고 있다. 특히 Aluminum을 doping한 ZnO (AZO)는 우수한 전기적, 광학적 특성 등으로 인해 ITO를 대체할 차세대 TCO 물질로 각광받고 있다. 본 연구에서는 sol-gel법을 및 direct patterning법을 이용하여 moth-eye 패턴을 포함하는 AZO 박막을 제작하였다. AZO sol을 제작하기 위하여 2-methoxyethanol, zinc acetate dihydrate 및 doping source로 aluminum nitrate nonahydrate를 사용하였다. 또한 광추출 향상 효과를 갖는 moth-eye 구조의 master stamp를 Polydimethyl siloxane(PDMS)를 이용하여 역상 moth-eye 구조의 mold를 복제하였으며, 이 복제된 mold와 제작된 AZO sol을 이용한 direct patterning법을 통해 나노급 moth-eye 구조를 갖는 AZO 투명전극층을 형성하였다. 제작된 moth-eye 구조를 갖는 AZO 투명전극층의 전기적 특성 평가를 위해, 4-point probe 측정 및 Hall measurement를 시행하였으며, 광학적 특성을 확인하기 위하여 UV-Visable spectrometer를 이용하여 투과도를 측정하였다. 본 연구를 통해 현재 상용화된 광전자 소자에 사용되고 있는 ITO 투명전극을 대체할 차세대 투명전극으로써 AZO 박막의 가능성을 확인하였다.

• Laser Solutions
• /
• v.15 no.3
• /
• pp.7-10
• /
• 2012

Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as $10{\mu}m/10{\mu}m$ in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut $10{\mu}m/10{\mu}m$ and $6{\mu}m/6{\mu}m$ into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.

• Laser Solutions
• /
• v.12 no.4
• /
• pp.1-5
• /
• 2009

Conventional patterning based on wet-process for multi-layered film is a relatively complex and costly process though it is a necessary step for fabrication of TFT-LCD module. Recently, a direct pattering by laser has been studied because it is low cost and simple process compared to the wet process. In this work, the selective removal process of multi-layered film (polyimide/indium tin oxide/glass) is studied by modeling the thermal and mechanical behavior for multi-layered structure. Especially, the effects of thickness of polyimide layer are examined.

• Laser Solutions
• /
• v.10 no.2
• /
• pp.17-24
• /
• 2007

We have studied a laser direct writing lithography(LDWL). This is more important to apply to micro patterning using UV laser. We demonstrate the possibility of LDWL and construct the fabrication system. We use Galvano scanner to process quickly micro patterns from computer data. And laser beam is focused with $F-{\theta}$ lens. AZ5214 and SU-8 photoresist are chosen as experimental materials and a kind of well-known positive and negative photoresist respectively. Laser ablation mechanism depends on the optical properties of polymer. In this paper, therefore we investigate the phenomenon of laser ablation according to the laser fluence variation and measure the shape profile of micro patterned holes. From these experimental results, we show that LDWL is very useful to process various micro patterns directly.

• Journal of the Korean Society for Precision Engineering
• /
• v.22 no.1
• /
• pp.199-206
• /
• 2005

Mask manufacturing is a high COC and COO process in developing of semiconductor devices because of mask production tool with high resolution. Direct writing has been thought to be the one of the patterning method to cope with development or small-lot production of the device. This study consists two categories. One is the additional process of the direct and maskless patterning generation using SLA for easy and convenient application and the other is a removal process using wet-etching process. In this study, cured status of epoxy pattern is most important parameter because of the beer-lambert law according to the diffusion of UV light. In order to improve the contact force between patterns and substrate, prime process was performed and to remove the semi-cured resin which makes a bad effects to the pattern, spin cleaning process using TPM was also performed. At a removal process, contact force between photo-curable resin as an etching mask and Si wafer is important parameter.

• Journal of the Korean Society for Precision Engineering
• /
• v.24 no.5
• /
• pp.97-103
• /
• 2007

A novel selective metallization process to fabricate the fine conductive line based on inkjet printing has been investigated. Recently, Inkjet printing has been widely used in flat panel display, electronic circuits, biochips and bioMEMS because direct inkjet printing is an alternative and cost-effective technology for patterning and fabricating objects directly from design without masks. The photosensitive etching resist used in this process is an organic polymer which becomes solidified when exposed to ultraviolet lights and has high viscosity at ambient temperature. A piezoelectric-driven inkjet printhead is used to dispense 20-30 ${\mu}m$ diameter droplets onto the copper substrate to prevent subsequent etching. Repeatability of circuitry fabrication is closely related to the formation of steady droplets, adhesion between etching resist and copper substrate. Therefore, the ability to form small and stable droplets and surface topography of the copper surface and chemical attack must be taken into consideration for fine and precise patterns. In this study, factors affecting the pattern formation such as adhesion strength, etching mechanism, UV curing have been investigated. As a result, microscale copper patterns with tens of urn high have been fabricated.