• ETRI Journal
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• 제38권2호
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• pp.244-251
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• 2016

In this paper, we investigate the electrical characteristics of two trench-gate-type super-barrier rectifiers (TSBRs) under different p-body implantation conditions (low and high). Also, design considerations for the TSBRs are discussed in this paper. The TSBRs' electrical properties depend strongly on their respective p-body implantation conditions. In the case of the TSBR with a low p-body implantation condition, it exhibits MOSFET-like properties, such as a low forward voltage ($V_F$) drop, high reverse leakage current, and a low peak reverse recovery current owing to a majority carrier operation. However, in the case of the TSBR with a high p-body implantation condition, it exhibits pn junction diode.like properties, such as a high $V_F$, low reverse leakage current, and high peak reverse recovery current owing to a minority carrier operation. As a result, the TSBR with a low p-body implantation condition is capable of operating as a MOSFET, and the TSBR with a high p-body implantation condition is capable of operating as either a pn junction diode or a MOSFET, but not both at the same time.

• 한국전기전자재료학회논문지
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• 제13권5호
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• pp.365-370
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• 2000

Schottky contacts on n-In$\_$0.53//Ga$\_$0.47//As have been made by metal deposition on substrates cooled to a temperature of 77K. The current-voltage and capacitance-voltage characteristics showed that the Schottky diodes formed at low temperature had a much improved barrier height compared to those formed at room temperature. The Schottky barrier height ø$\_$B/ was found to be increased from 0.2eV to 0.6eV with Ag metal. The saturation current density of the low temperature diode was about 4 orders smaller than for the room temperature diode. A current transport mechanism dominated by thermionic emission over the barrier for the low temperature diode was found from current-voltage-temperature measurement. Deep level transient spectroscopy studies exhibited a bulk electron trap at E$\_$c/-0.23eV. The low temperature process appears to reduce metal induced surface damage and may form an MIS (metal-insulator-semiconductor)-like structure at the interface.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.882-885
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• 2004

Organic molecules have many properties that make them attractive for electronic applications. We have been examining the progress of memory cell by using molecular-scale switch to give an example of the application using both nanoscale components and Si-technology. In this study, molecular electronic devices were fabricated with amion style derivatives as redox-active component to compare to the devices using Zn-Porphyrin derivatives. This molecule is amphiphilic to allow monolayer formation by the Langmuir-Blodgett (LB) method, and then this LB monolayer is inserted between two metal electrodes. According to current-voltage (I-V) characteristics, it was found that the devices show remarkable hysteresis behavior and can be used as memory devices at ambient conditions, when aluminum oxide layer was existed on bottom electrode. Diode-like characteristics were measured only, when Pt layer was existed as bottom electrode. It was also found that this metal layer interacts with the organic molecules and acts as a protecting layer, when thin Ti layer was inserted between the organic molecular layer and the top Al electrode. These electrical properties of the devices may be applicable to active components for the memory and/or logic gates in the future.

• 한국전기전자재료학회논문지
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• 제13권11호
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• pp.908-913
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• 2000

CoSi$_2$/p+/n diodes(bilayer diodes) were fabricated by using epitaxial CoSi$_2$grown from Co/Ti bilayer as a diffusion source. The I-V characteristics of p+/n diodes were measured and compared with those of diode made from Co monolayer (monolayer diode). Monolayer diodes showed typical p+n junction characteristics with the leakage current of as low as 10$^{-12}$ A and forward current 6-orders higher than the leakage current, when drive-in annealed at 90$0^{\circ}C$ for 20 sec.. On the other hand, bilayer diodes showed the Schottky-like behaviors with forward currents rather higher than those of monolyer diodes, but with too high leakage currents, when drive-in annealed at $700^{\circ}C$ or higher. However, when the annealing temperature was lowered to $700^{\circ}C$ and annealing time was increased to 60 sec., the leakage current was reduced to 10$^{-11}$ A and thus sho3wed typical diode characteristics. The high leakage currents for diodes annealed at $700^{\circ}C$ or higher was attributed to Shannon contacts formed due to unremoved Co-Ti-Si precipitates. But when annealed at 50$0^{\circ}C$, B ions diffused in the direction of the surface layer, and thus the leakage currents were reduced by removing Shannon contacts.

• 센서학회지
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• 제16권4호
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• pp.259-262
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• 2007

This paper describes the electrical characteristics of polycrystalline (poly) 3C-SiC thin film diodes, in which poly 3C-SiC thin films on n-type and p-type Si wafers, respectively, were deposited by APCVD using HMDS, $H_{2}$, and Ar gas at $1150^{\circ}C$ for 3 hr. The schottky diode with Au/poly 3C-SiC/Si (n-type) structure was fabricated. Its threshold voltage ($V_{bi}$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_{D}$) value were measured as 0.84 V, over 140 V, 61 nm, and $2.7{\times}10^{19}cm^{-3}$, respectively. Moreover, for the good ohmic contact, Al/poly 3C-SiC/Si (n-type) structure was annealed at 300, 400, and $500^{\circ}C$, respectively for 30 min under the vacuum condition of $5.0{\times}10^{-6}$ Torr. Finally, the p-n junction diodes fabricated on the poly 3C-Si/Si (p-type) were obtained like characteristics of single 3CSiC p-n junction diode. Therefore, poly 3C-SiC thin film diodes will be suitable for microsensors in conjunction with Si fabrication technology.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
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• pp.179-182
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• 2007

Polycrystaline (poly) 3C-SiC thin film on n-type and p-type Si were deposited by APCVD using HMDS, $H_2$, and Ar gas at $1180^{\circ}C$ for 3 hour. And then the schottky diode with Au/poly 3C-Sic/Si(n-type) structure was fabricated. Its threshold voltage ($V_d$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_D$) value were measured as 0.84 V, over 140 V, 61nm, and $2.7{\times}10^{19}\;cm^3$, respectively. The p-n junction diode fabricated by poly 3C-SiC was obtained like characteristics of single 3C-SiC p-n junction diode. Therefore, its poly 3C-SiC thin films are suitable MEMS applications in conjuction with Si fabrication technology.

• 한국정보전자통신기술학회논문지
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• 제2권4호
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• pp.59-64
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• 2009

본 논문에서는 새로운 형태의 도넛형 결함 접지면 구조를 이용한 공진기의 동작특성과 등가회로을 나타내고, 이것의 접지면에 칩 캐패시터를 추가하여 공진주파수를 가변할 수 있도록 설계하였다. 일반적으로 결함접지면 구조는 병렬 공진 특성을 갖는다. 여기에 집중소자 캐패시터를 추가하면 공진주파수가 낮아지게 된다. 캐패시터 대신에 바랙터다이오드를 이용하면 전압으로써 공진 주파수를 제어할 수 있다. 본 공진기는 전압제어발진기와 가변주파수 대역통과 여파기등에 응용될 수 있다.

• 한국전자파학회지:전자파기술
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• 제11권4호
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• pp.39-52
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• 2000

A design of 2 stage S-DLVA(successive detector log video amplifier) was studied to detect wide dynamic radar pulse ranging from -70 ㏈m to 0㏈m. A basic design idea was focused on the linear detection in logarithmic scale of wide dynamic range radar pulses from nosie-like weak power of -70 ㏈m to relatively high power 0 ㏈m. It is highly formidable, since it requires high speed detection less than 10 nsec over the operating frequency ranges from 6 to 18 ㎓. A limiter diode, a tunnel diode and an L17-C were used as a protecting device, a detector diode and a log video amplifier in companion as a single stage detector to give voltage output proportional to the input power of about 35 ㏈ dynamic range. A protype of 2-stage DLVA having one more single stage detector was fabricated with a 32 ㏈ low noise amplifier and a 3 ㏈ hybrid coupler to provide total 70 ㏈ dynamic range detection. The logging characteristics were measured to have log slope of 25m.V/㏈ against 70 ㏈ logging range from -55 ㏈m to +15 ㏈m, the log linearity of within +/- 1.5 ㏈, and tangential sensitivity was at -63 ㏈m. The pulse dynamics of rise time and recovery time were measured as 50 nsec and 1.2 $\mu$sec, respectively. The reason might be due to the parasitic capacitances of packaged limiter, tunnel diode, and L17-C.

• 한국태양에너지학회 논문집
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• 제37권4호
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• pp.1-11
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• 2017

Most PV modules are fabricated by 6 cell-strings with solar cells connected in series. Moreover, bypass diodes are generally installed every 2 cell-strings to prevent PV modules from a damage induced by current mismatch or partial shading. But, in the case of special purpose PV module, like as BIPV (Building Integrated Photovoltaic), the number of cell-strings per module varies according to its size. Differ from a module employing even cell-strings, the configuration of bypass diode should be optimized in the PV module with odd strings because of oppositely facing electrodes. Hence, in this study, electrical characteristics of special purposed PV module with odd string was empirically and theoretically studied depending on arrangement of bypass diode. Here, we assumed that PV module has 3 strings and the number of bypass diodes in the system varies from 2 to 6. In case of 2 bypass diodes, shading on a center string increases short circuit current of the module, because of a parallel circuit induced by 2 bypass diodes connected to center string. Also, the loss is larger, as the shading area in the center string is enlarged. Thus, maximum power of the PV module with 2 bypass diode decreases by up to 59 (%) when shading area varies from 50 to 90 (%). On the other hand, In case of 3 and 6 bypass diodes, the maximum power reduction was within about 3 (W), even the shading area changes from 50 to 90 (%). As a result, It is an alternative to arrange the bypass diode by each string or one bypass diode in the PV module in order to completely bypass current in case of shading, when PV module with odd string are fabricated.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.348-349
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• 2007

This paper describes the electrical characteristics of polycrystalline (poly) 3C-SiC thin film diodes, in which poly 3C-SiC thin films on n-type and p-type Si wafers, respectively, were deposited by APCVD using HMDS, Hz, and Ar gas at $1180^{\circ}C$ for 3 hr. The schottky diode with Au/poly 3C-SiC/Si(n-type) structure was fabricated. Its threshold voltage ($V_d$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_D$) values were measured as 0.84 V, over 140 V, 61nm, and $2.7\;{\times}\;10^{19}\;cm^3$, respectively. The p-n junction diodes fabricated on the poly 3C-SiC/Si(p-type) were obtained like characteristics of single 3C-SiC p-n junction diodes. Therefore, poly 3C-SiC thin film diodes will be suitable microsensors in conjunction with Si fabrication technology.