• ETRI Journal
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• v.38 no.2
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• pp.244-251
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• 2016

In this paper, we investigate the electrical characteristics of two trench-gate-type super-barrier rectifiers (TSBRs) under different p-body implantation conditions (low and high). Also, design considerations for the TSBRs are discussed in this paper. The TSBRs' electrical properties depend strongly on their respective p-body implantation conditions. In the case of the TSBR with a low p-body implantation condition, it exhibits MOSFET-like properties, such as a low forward voltage ($V_F$) drop, high reverse leakage current, and a low peak reverse recovery current owing to a majority carrier operation. However, in the case of the TSBR with a high p-body implantation condition, it exhibits pn junction diode.like properties, such as a high $V_F$, low reverse leakage current, and high peak reverse recovery current owing to a minority carrier operation. As a result, the TSBR with a low p-body implantation condition is capable of operating as a MOSFET, and the TSBR with a high p-body implantation condition is capable of operating as either a pn junction diode or a MOSFET, but not both at the same time.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.5
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• pp.365-370
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• 2000

Schottky contacts on n-In$\_$0.53//Ga$\_$0.47//As have been made by metal deposition on substrates cooled to a temperature of 77K. The current-voltage and capacitance-voltage characteristics showed that the Schottky diodes formed at low temperature had a much improved barrier height compared to those formed at room temperature. The Schottky barrier height ø$\_$B/ was found to be increased from 0.2eV to 0.6eV with Ag metal. The saturation current density of the low temperature diode was about 4 orders smaller than for the room temperature diode. A current transport mechanism dominated by thermionic emission over the barrier for the low temperature diode was found from current-voltage-temperature measurement. Deep level transient spectroscopy studies exhibited a bulk electron trap at E$\_$c/-0.23eV. The low temperature process appears to reduce metal induced surface damage and may form an MIS (metal-insulator-semiconductor)-like structure at the interface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.882-885
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• 2004

Organic molecules have many properties that make them attractive for electronic applications. We have been examining the progress of memory cell by using molecular-scale switch to give an example of the application using both nanoscale components and Si-technology. In this study, molecular electronic devices were fabricated with amion style derivatives as redox-active component to compare to the devices using Zn-Porphyrin derivatives. This molecule is amphiphilic to allow monolayer formation by the Langmuir-Blodgett (LB) method, and then this LB monolayer is inserted between two metal electrodes. According to current-voltage (I-V) characteristics, it was found that the devices show remarkable hysteresis behavior and can be used as memory devices at ambient conditions, when aluminum oxide layer was existed on bottom electrode. Diode-like characteristics were measured only, when Pt layer was existed as bottom electrode. It was also found that this metal layer interacts with the organic molecules and acts as a protecting layer, when thin Ti layer was inserted between the organic molecular layer and the top Al electrode. These electrical properties of the devices may be applicable to active components for the memory and/or logic gates in the future.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.11
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• pp.908-913
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• 2000

CoSi$_2$/p+/n diodes(bilayer diodes) were fabricated by using epitaxial CoSi$_2$grown from Co/Ti bilayer as a diffusion source. The I-V characteristics of p+/n diodes were measured and compared with those of diode made from Co monolayer (monolayer diode). Monolayer diodes showed typical p+n junction characteristics with the leakage current of as low as 10$^{-12}$ A and forward current 6-orders higher than the leakage current, when drive-in annealed at 90$0^{\circ}C$ for 20 sec.. On the other hand, bilayer diodes showed the Schottky-like behaviors with forward currents rather higher than those of monolyer diodes, but with too high leakage currents, when drive-in annealed at $700^{\circ}C$ or higher. However, when the annealing temperature was lowered to $700^{\circ}C$ and annealing time was increased to 60 sec., the leakage current was reduced to 10$^{-11}$ A and thus sho3wed typical diode characteristics. The high leakage currents for diodes annealed at $700^{\circ}C$ or higher was attributed to Shannon contacts formed due to unremoved Co-Ti-Si precipitates. But when annealed at 50$0^{\circ}C$, B ions diffused in the direction of the surface layer, and thus the leakage currents were reduced by removing Shannon contacts.

• Journal of Sensor Science and Technology
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• v.16 no.4
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• pp.259-262
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• 2007

This paper describes the electrical characteristics of polycrystalline (poly) 3C-SiC thin film diodes, in which poly 3C-SiC thin films on n-type and p-type Si wafers, respectively, were deposited by APCVD using HMDS, $H_{2}$, and Ar gas at $1150^{\circ}C$ for 3 hr. The schottky diode with Au/poly 3C-SiC/Si (n-type) structure was fabricated. Its threshold voltage ($V_{bi}$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_{D}$) value were measured as 0.84 V, over 140 V, 61 nm, and $2.7{\times}10^{19}cm^{-3}$, respectively. Moreover, for the good ohmic contact, Al/poly 3C-SiC/Si (n-type) structure was annealed at 300, 400, and $500^{\circ}C$, respectively for 30 min under the vacuum condition of $5.0{\times}10^{-6}$ Torr. Finally, the p-n junction diodes fabricated on the poly 3C-Si/Si (p-type) were obtained like characteristics of single 3CSiC p-n junction diode. Therefore, poly 3C-SiC thin film diodes will be suitable for microsensors in conjunction with Si fabrication technology.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.179-182
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• 2007

Polycrystaline (poly) 3C-SiC thin film on n-type and p-type Si were deposited by APCVD using HMDS, $H_2$, and Ar gas at $1180^{\circ}C$ for 3 hour. And then the schottky diode with Au/poly 3C-Sic/Si(n-type) structure was fabricated. Its threshold voltage ($V_d$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_D$) value were measured as 0.84 V, over 140 V, 61nm, and $2.7{\times}10^{19}\;cm^3$, respectively. The p-n junction diode fabricated by poly 3C-SiC was obtained like characteristics of single 3C-SiC p-n junction diode. Therefore, its poly 3C-SiC thin films are suitable MEMS applications in conjuction with Si fabrication technology.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.2 no.4
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• pp.59-64
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• 2009

In this paper, we represent characteristics and equivalent circuit of donut type resonator of defected ground structure (DGS), and can control resonant frequency with chip capacitor. In General, DGS operates like with parallel LC resonator. We found out variation of resonance frequency when capacitor is placed on slot of DGS. If the chip capacitor replace with varactor diode, the resonance frequencies can be controlled by voltage. This tualable resonator can apply to voltage controlled oscillator and tunable bandpass filter.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.11 no.4
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• pp.39-52
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• 2000

A design of 2 stage S-DLVA(successive detector log video amplifier) was studied to detect wide dynamic radar pulse ranging from -70 ㏈m to 0㏈m. A basic design idea was focused on the linear detection in logarithmic scale of wide dynamic range radar pulses from nosie-like weak power of -70 ㏈m to relatively high power 0 ㏈m. It is highly formidable, since it requires high speed detection less than 10 nsec over the operating frequency ranges from 6 to 18 ㎓. A limiter diode, a tunnel diode and an L17-C were used as a protecting device, a detector diode and a log video amplifier in companion as a single stage detector to give voltage output proportional to the input power of about 35 ㏈ dynamic range. A protype of 2-stage DLVA having one more single stage detector was fabricated with a 32 ㏈ low noise amplifier and a 3 ㏈ hybrid coupler to provide total 70 ㏈ dynamic range detection. The logging characteristics were measured to have log slope of 25m.V/㏈ against 70 ㏈ logging range from -55 ㏈m to +15 ㏈m, the log linearity of within +/- 1.5 ㏈, and tangential sensitivity was at -63 ㏈m. The pulse dynamics of rise time and recovery time were measured as 50 nsec and 1.2 $\mu$sec, respectively. The reason might be due to the parasitic capacitances of packaged limiter, tunnel diode, and L17-C.

• Journal of the Korean Solar Energy Society
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• v.37 no.4
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• pp.1-11
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• 2017

Most PV modules are fabricated by 6 cell-strings with solar cells connected in series. Moreover, bypass diodes are generally installed every 2 cell-strings to prevent PV modules from a damage induced by current mismatch or partial shading. But, in the case of special purpose PV module, like as BIPV (Building Integrated Photovoltaic), the number of cell-strings per module varies according to its size. Differ from a module employing even cell-strings, the configuration of bypass diode should be optimized in the PV module with odd strings because of oppositely facing electrodes. Hence, in this study, electrical characteristics of special purposed PV module with odd string was empirically and theoretically studied depending on arrangement of bypass diode. Here, we assumed that PV module has 3 strings and the number of bypass diodes in the system varies from 2 to 6. In case of 2 bypass diodes, shading on a center string increases short circuit current of the module, because of a parallel circuit induced by 2 bypass diodes connected to center string. Also, the loss is larger, as the shading area in the center string is enlarged. Thus, maximum power of the PV module with 2 bypass diode decreases by up to 59 (%) when shading area varies from 50 to 90 (%). On the other hand, In case of 3 and 6 bypass diodes, the maximum power reduction was within about 3 (W), even the shading area changes from 50 to 90 (%). As a result, It is an alternative to arrange the bypass diode by each string or one bypass diode in the PV module in order to completely bypass current in case of shading, when PV module with odd string are fabricated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.348-349
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• 2007

This paper describes the electrical characteristics of polycrystalline (poly) 3C-SiC thin film diodes, in which poly 3C-SiC thin films on n-type and p-type Si wafers, respectively, were deposited by APCVD using HMDS, Hz, and Ar gas at $1180^{\circ}C$ for 3 hr. The schottky diode with Au/poly 3C-SiC/Si(n-type) structure was fabricated. Its threshold voltage ($V_d$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_D$) values were measured as 0.84 V, over 140 V, 61nm, and $2.7\;{\times}\;10^{19}\;cm^3$, respectively. The p-n junction diodes fabricated on the poly 3C-SiC/Si(p-type) were obtained like characteristics of single 3C-SiC p-n junction diodes. Therefore, poly 3C-SiC thin film diodes will be suitable microsensors in conjunction with Si fabrication technology.