• Membrane and Water Treatment
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• 제6권5호
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• pp.365-378
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• 2015

Herein, the preparation of anion exchange membrane (AEM) from brominated poly(2,6-dimethyl 1,6-phenylene oxide) BPPO and dimethylaniline (DMA) by phase-inversion process is reported. Anion exchange membranes (AEMs) are prepared by varying the DMA contents. Prepared AEMs show high thermal stability, water uptake (WR) around 202% to 226%, dimensional change ratios of 1.5% to 2.6% and ion exchange capacities (IECs) of 0.34 mmol/g to 0.82 mmol/g with contact angle of $59.18^{\circ}$ to $65.15^{\circ}$. These membranes are porous in nature as confirmed by SEM observation. The porous property of membranes are important as it could reduce the resistance of transportation of ions across the membranes. They have been used in diffusion dialysis (DD) process for recovery of hydrochloric acid (HCl) from the mixture of HCl and ferrous chloride ($FeCl_2$). Presence of $-N+(CH_3)_2C_6H_5Br^-$ as a functional group in membrane matrix facilitates its applications in DD process. The dialysis coefficients of hydrochloric acid ($U_H$) of the membranes are in range of 0.0016 m/h to 0.14 m/h and the separation factors (S) are in range of 2.09 to 7.32 in the $HCl/FeCl_2$ system at room temperature. The porous membrane structure and presence of amine functional group are responsible for the mechanism of diffusion dialysis (DD).

• Membrane Journal
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• 제25권2호
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• pp.123-131
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• 2015

The PTMSP/PDMS graft copolymer were synthesized from the PTMSP[poly(1-trimethylsilyl-1-propyne)] and the PDMS[poly(dimethylsiloxane)] and then the PTMSP/PDMS-borosilicate composite membranes were prepared by adding the porous borosilicates to the PTMSP/PDMS graft copolymer. The number-average molecular weight (${\bar{M}}_n$) and the weight-average molecular weight (${\bar{M}}_w$) of PTMSP/PDMS graft copolymer were 460,000 and 570,000 respectively, and glass transition temperature ($T_g$) of PTMSP/PDMS graft copolymer appeared at $33.53^{\circ}C$ according to DSC analysis. According to the TGA measurements, the addition of borosilicate to the PTMSP/PDMS graft copolymer leaded the decreased weight loss and the completed weight loss temperature went down. SEM observation showed that borosilicate was dispersed in the PTMSP/PDMS-borosilicate composite membranes with the size of $1{\sim}5{\mu}m$. Gas permeation experiment indicated that the addition of borosilicate to PTMSP/PDMS graft copolymer resulted in the increase in free volume, cavity and porosity resulting in the gradual shift of the mechanism of the gas permeation from solution diffusion to molecular sieving surface diffusion, and Knudsen diffusion. Consequently, the permeability of $H_2$ and $N_2$ increased and selectivity ($H_2/N_2$) decreased as the contents of borosilicate increased.

• YAKHAK HOEJI
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• 제41권6호
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• pp.737-748
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• 1997

Distribution of rhEGF in the skin, plasma and several organ tissues following topical application of $^{125}I-rhEGF$ (0.4${\mu}$Ci) solution in 25% Pluronic F-127 on 154$mm^2$ normal and damaged (burned and stripped) skins of hairless mice was examined. The radioactivity in the stripped skin tissues increased as a function of time, and was 10-20 times higher than that in the normal and burned skins. The fractions of intact drug in the skin tissues were 40-60% for the normal and burned skins, and 60-80% for the stripped skin. It indicates that the stratum corneum layer behaves as a barrier for the dermal penetration of the drug. The radioactivity in the plasma was much higher for the stripped skin than for the normal and burned skins. However, the concentration of intact drug in the stripped skin was comparable to those in the normal and burned skins indicating most severe degradation (or metabolism) of the drug in the stripped skin. As a result, the fraction of intact drug in the plasma was lowest for the stripped skin (<10%). Body organ distribution of the drug was much higher for the stripped skin. The concentration in the stomach. Both in total radioactivity and intact drug, showed more than 10-times higher value than in the other organs (liver, kidney and spleen). The fraction of intact drug in each organ tissue was below 10-20%. And generally lowest for the stripped skin. The lowest fraction of the drug for the stripped skin could not be explained by the activity of the aminopeptidases in the skin since it was lower for the stripped skin than for the normal skin. Thereover, the fraction of intact drug appears to be determined by the balance between dermal uptake and systemic elimination of the drug, for example. The mechanism of dermal uptake of rhEGF was examined by topical applying 200${\mu}$l of 25% Pluronic F-127 solution containing 0.4 ${\mu}$Ci of $^{125}I-rhEGF$ and 0.14${\mu}$Ci of $^{14}C$-inulin (a marker of passive diffusion). The radioactivity of $^{125}I-rhEGF$ at each sampling time point (0.5, 1, 2, 4 and 8hr) was correlated (p<0.05) with the corresponding radioactivity of $^{14}C$-inulin. It appears to indicate the rhEGF may be uptaken into the skins mainly by the passive diffusion. This hypothesis was supported by the constant specific binding of EGF to the skin homogenates regardless of the skin models. Receptor mediated endocytosis (RME) appears to contribute negligibly, if any, to the overall uptake process.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.181-181
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• 2012

Direct synthesis of graphene using a chemical vapor deposition (CVD) has been considered a facile way to produce large-area and uniform graphene film, which is an accessible method from an application standpoint. Hence, their fundamental understanding is highly required. Unfortunately, the CVD growth mechanism of graphene on Cu remains elusive and controversial. Here, we present the evidences for two different growth modes of graphene on Cu investigated by varying carbon feedstock (C2H2 and CH4) and working pressure. The number of uniform graphene layer grown by C2H2 increased with increasing its injection time. A combined secondary ion mass spectrometry (SIMS) and X-ray diffraction (XRD) study revealed a carbon-diffused Cu layer created below surface region of Cu substrate with the expansion of Cu lattice. The graphene on Cu was grown by the diffusion and precipitation mode not by the surface adsorption mode, because similar results were observed in graphene/Ni system. The carbon-diffused Cu layer was also observed after graphene growth under high CH4 pressure. Based on various previous results and ours, we have successfully found that there are two selective growth modes for graphene on Cu substrate, and a desired mode can be chosen by tuning working pressure corresponding to the kind of carbon feedstock. We believe that this finding will shed light on high quality graphene growth and its multifaceted applications.

• Geotechnical Engineering
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• 제7권4호
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• pp.35-48
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• 1991

Based on centrifuge model tests, the failure mechanism of reinforced earth retaining wall under strip load was investigated in this paper. Tests were performed by changing the materials of reinforcing strips, strip lengths, and strip arrangements. The strips were strain-gauged to measure the tensions in strips. The results were analyzed and compared with various design methosds in use to verify their feasibility. Consequently, a centrifuge model test was an effective method of investigating the behavior of reinforced earth retaining wall. The 2 : 1 stress diffusion method showed comparable results with tests in estimating the capacity of the reinforced earth wall under strip load. The superposition of tensions due to selfweight of the backfill and strip load was valid to estimate total tensions mobilized in strips. Using the elasticity theory to estimate the maximum tension mobilized in strips due to surcharge, while solutions of Boussinesq and Westergaard underestimated less tensions than the measured valises, Frohlich solution showed the comparable results with tests.

• Journal of Environmental Science International
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• 제6권2호
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• pp.125-131
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• 1997

The mechanism of stomatal closing in response to $O_2$ was indirectly investigated by using $H_2O_2$ which is the intermediate product of $O_2$ metabolites. Stomata in epidermal strips close in response to $H_2O_2$. The effect of $H_2O_2$ on stomatal closing was dependent on the concentration of $H_2O_2$. 10 ppm $H_2O_2$ showed a clear effect on stomatal closing and 1000 ppm $H_2O_2$ induced complete stomatal closing after the treatment of 3 hours. Stomatal closing by $H_2O_2$ in intact leaf was also observed by measuring the diffusion resistance with porometer. It was found that the stomatal closing by $H_2O_2$ was not mediated by $Ca^{2+}$, and that was a different result observed in stomatal closing by water stress. Reversely, $Ca^{2+}$ showed a great inhibition on stomatal closing. The leakage of K+ in epidermal strips was doubled in response to $H_2O_2$ when it was campared to the control. 10 ppm $H_2O_2$ decreased photosynthetic activity. Fv/Fm representing the activity of Photosystem II was reduced about 4 % in 10 ppm $H_2O_2$ and 8 % in 100 ppm $H_2O_2$ In the treatment of 1.5 hour. However, stomatal closing by 10 ppm $H_2O_2$ was reduced about 56 %. According1y, it can be suggested that stomatal closing by $H_2O_2$ is related with the decrease of photosynthetic activity, but it was chiefly induced by the change of the membrane permeability. Key words Commelina communis, stomatal closing, $H_2O_2$, $Ca^{2+}$, photosynthesis.

• The Korean Journal of Physiology and Pharmacology
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• 제6권3호
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• pp.131-138
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• 2002

Thanks to recent progress in availability of molecular and functional techniques it became possible to search for the basic molecular and cellular processes that mediate and control $HCO_3{^-}$ and fluid secretion by the pancreatic duct. The coordinated action of various transporters on the luminal and basolateral membranes of polarized epithelial cells mediates the transepithelial $HCO_3{^-}$ transport, which involves $HCO_3{^-}$ absorption in the resting state and $HCO_3{^-}$ secretion in the stimulated state. The overall process of HCO3 secretion can be divided into two steps. First, $HCO_3{^-}$ in the blood enters the ductal epithelial cells across the basolateral membrane either by simple diffusion in the forms of $CO_2$ and $H_2O$ or by the action of an $Na^+-coupled$ transporter, a $Na^+-HCO_3$ cotranporter (NBC) identified as pNBC1. Subsequently, the cells secrete $HCO_3{^-}$ to the luminal space using at least two $HCO_3{^-}$ exit mechanisms at the luminal membrane. One of the critical transporters needed for all forms of $HCO_3{^-}$ secretion across the luminal membrane is the cystic fibrosis transmembrane conductance regulator (CFTR). In the resting state the pancreatic duct, and probably other $HCO_3{^-}$ secretory epithelia, absorb $HCO_3{^-}.$ Interestingly, CFTR also control this mechanism. In this review, we discuss recent progress in understanding epithelial $HCO_3{^-}$ transport, in particular the nature of the luminal transporters and their regulation by CFTR.

• Molecular & Cellular Toxicology
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• 제1권2호
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• pp.73-77
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• 2005

Nickel is the one of potent environmental, the occupational pollutants and the classified human carcinogens. It is a serious hazard to human health, when the metal exposure. To prevent human diseases from the heavy metals, it is seemingly important that understanding of how nickel exerts their toxicity and carcinogenic effect at a molecular and a genomic level. The process of nickel absorption has been demonstrated as phagocytosis, iron channel and diffusion. Uptaked nickel has been suggested to induce carcinogenesis via two pathways, a direct DNA damaging pathway and an indirect DNA damaging pathway. The former was originated from the ability of metal to generate Reactive Oxygen Species (ROS) and the reactive intermediates to interact with DNA directly. Ni-generated ROS or Nickel itself, interacts with DNAs and histones to cause DNA damage and chromosomal abnormality. The latter was originated from an indirect DNA damage via inhibition of DNA repair, or condensation and methylation of DNA. Cells have ability to protect from the genotoxic stresses by changing gene expression. Microarray analysis of the cells treated with nickel or nickel compounds, show the specific altered gene expression profile. For example, HIF-I (Hypoxia-Inducible Factor I) and p53 were well known as transcription factors, which are upregulated in response to stress and activated by both soluble and insoluble nickel compounds. The induction of these important transcription factors exert potent selective pressure and leading to cell transformation. Genes of metallothionein and family of heat shock proteins which have been known to play role in protection and damage control, were also induced by nickel treatment. These gene expressions may give us a clue to understand of the carcinogenesis mechanism of nickel. Further discussions on molecular and genomic, are need in order to understand the specific mechanism of nickel toxicity and carcinogenicity.