• 설비공학논문집
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• 제27권8호
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• pp.426-431
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• 2015

The advantages of a printed circuit heat exchanger (PCHE) are the compactness and efficiency derived from its heat-transfer characteristics; furthermore, a PCHE for which a diffusion bonding method was used during production can be applied to extreme environments such as a cryogenic condition. In this study, a micro-channel PCHE fabricated by diffusion bonding was investigated in a cryogenic environment regarding its thermal performance and the pressure drop. The test rig consists of an LN2 storage tank, vaporizers, heaters, and a cold box, whereby the vaporized cryogenic nitrogen flows in hot and cold streams. The overall heat-transfer coefficients were evaluated and compared with traditional correlations. Lastly, we suggested the modified heat-transfer correlations for a PCHE in a cryogenic condition.

• 한국재료학회지
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• 제15권10호
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• pp.662-666
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• 2005

Solid solutions of $(Zr/Ti)O_2$ were prepared in powder form by the coprecipitation technique. After mixing with carbon or exposing to nitrogen gas at elevated temperature, titanium cations selectively diffused out from the oxide compound to form titanium carbide (TiC) or titanium nitride (TiN), respectively. TiN formed strong interfacial contacts between the oxide grains. In contrast, TiC formed as small crystallites on oxide grains but did not bind the matrix grains together. TiN therefore played a role in strengthening the interparticle bonding, but TiC weakened the bonding between grains. Partial diffusion of titanium cations also led to nanolayered structure being formed between the oxide grains, which provided weak interfacial layers that fractured in a step-wise fashion.

• 한국분말재료학회지
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• 제4권3호
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• pp.196-204
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• 1997

Joining of AIN ceramics to W and Cu by active-metal brazing method was tried with use of (Ag-Cu)-Ti alloy as insert-metal. Joints were produced under various conditions of temperature, holding time and Ti-content in (Ag-Cu) alloy Reaction and microstructural development in bonded interface were investigated through observation and analysis by SEM/EDS, EPMA and XRD. Joint strengths were measured by shear test. Bonded interface consists of two layers: an insert-metal layer of eutectic Ag- and Cu-rich phases and a reaction layer of TiN. Thickness of reaction layer increases with bonding temperature, holding time and Ti-content of insert-metal. It was confirmed that the growth of reaction layer is a diffusion-controlled process. Activation energy for this process was 260 KJ/mol which is lower than that for N diffusion in TiN. Maximum shear strength of 108 MPa and 72 MPa were obtained for AIN/W and AIN/Cu joints, respectively. Relationship between processing variables, joint strength and thickness of reaction layer was also explained.

• 한국전기전자재료학회논문지
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• 제15권4호
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• pp.301-307
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• 2002

Direct bonded SOI wafer pairs with $Si ll SiO_2/Si_3N_4 ll Si$ the heterogeneous insulating layers of SiO$_2$-Si$_3$N$_4$are able to apply to the micropumps and MEMS applications. Direct bonding should be executed at low temperature to avoid the warpage of the wafer pairs and inter-diffusion of materials at the interface. 10 cm diameter 2000 ${\AA}-SiO_2/Si(100}$ and 560 $\AA$- ${\AA}-Si_3N_4/Si(100}$ wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were pre- mated with facing the mirror planes by a specially designed aligner in class-100 clean room immediately. We employed a heat treatment equipment so called fast linear annealing(FLA) with a halogen lamp to enhance the bonding of pre mated wafers We kept the scan velocity of 0.08 mm/sec, which implied bonding process time of 125 sec/wafer pairs, by varying the heat input at the range of 320~550 W. We measured the bonding area by using the infrared camera and the bonding strength by the razor blade clack opening method, respective1y. It was confirmed that the bonding area was between 80% and to 95% as FLA heat input increased. The bonding strength became the equal of $1000^{\circ}C$ heat treated $Si ll SiO_2/Si_3N_4 ll Si$ pair by an electric furnace. Bonding strength increased to 2500 mJ/$\textrm{m}^2$as heat input increased, which is identical value of annealing at $1000^{\circ}C$-2 hr with an electric furnace. Our results implies that we obtained the enough bonding strength using the FLA, in less process time of 125 seconds and at lowed annealing temperature of $400^{\circ}C$, comparing with the conventional electric furnace annealing.

• 소성∙가공
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• 제18권1호
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• pp.45-51
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• 2009

Shape memory alloy has been used to improve the tensile strength of composite by the occurrence of compressive residual stress in matrix using its shape memory effect. In order to fabricate shape memory alloy composite, TiNi alloy fiber and Al2024 sheets were used as reinforcing material and matrix, respectively. In this study, TiNi/Al2024 shape memory alloy composite was made by using hot press method. In order to investigate bonding condition between TiNi reinforcement and Al matrix, the micro-structure of interface was observed by using optical microscope and diffusion layer of interface was measured by using Electron Probe Micro Analyser. And the mechanical properties of composite with three parameters(volume fraction of fiber, cold rolling amount and test temperature) were obtained by tensile test. The most optimum bonding condition for fabrication the TiNi/Al2024 composite material was obtained as holding for 30min. under the pressure of 60MPa at 793K. The strength of composite material increased considerably with the volume fraction of fiber up to 7.0%. And the tensile strength of this composite increased with the reduction ratio and it also depends on the volume fraction of fiber.

• 한국생산제조학회지
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• 제21권6호
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• pp.1013-1017
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• 2012

Advanced composite-sintered bushings are widely utilized in the areas of excavators and injection molding machines as a journal bearing. Since the bearings are mainly used under high loads, service life should be long and the stored oil of inner bushings has to be continually fed into the bearing. The composite-sintered bushings are consisted of the two different materials; outer steel materials and inner porous sintered materials respectively. High temperature diffusion bonding has been applied for holding the both materials of the bushing together. Therefore, it is very important that the bonding reliability has to be assured and evaluated in manufacturing process. Finite element method (FEM) is performed in order to evaluate the minimum allowable flaw sizes that are possibly generated in the composite-sintered bushings. Additionally, the composite-sintered bushings were undergone ultrasonic C-scan tests to find out the size of inherent flaws through artificially simulated UT signal analysis.

• 한국기계가공학회지
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• 제9권1호
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• pp.106-113
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• 2010

The most suitable condition for plasma source ion implantation(PSII) was found based on the study of the characteristics of PSIIed tool and machined surfaces. The depth analysis according to the chemical bonding state of elements and surface component elements through the XPS and SIMS, was conducted to find the improved property of the PSIIed surface. Due to the diffusion of PSII, the nitrogen was found up to a depth of about 150nm according to the supplied voltage and ion implanted time. The deep diffusion by nitrogen caused the surface modification, but the formation of oxide component was found due to the residual gas contamination on the surface. Statistical method of ANOVA was conducted to find the effects of spindle speed and feed rate in interaction for machined surface roughness with PSIIed tools. The surface modification was found largely occurred by the nitrogen implanted surface with 2 hours for 27kV, 35kV and 43kV.

• 비파괴검사학회지
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• 제23권2호
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• pp.148-155
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• 2003

저방사화 페라이트강인 JLF는 핵융합로의 블랑켓과 같은 열교환기의 재료로써 유용한 재료이다. 이 재료의 광범위한 적용을 위해서는 JLF강과 다른 재료와의 접합기술의 개발이 중요하다. 최근 두 이종재료간의 접합에는 마찰용접이 많이 이용되고 있으며 본 연구에서도 JLF강과 STS304 간의 마찰용접에 의한 용접특성을 평가하였으며 특히 비파괴기법중의 하나인 음향방출 기법을 이용하여 두 이종재료간의 용접특성 및 최적의 용접조건을 평가하였다. 음향방출 파라미터중의 하나인 카운트와 사상수 등이 최적용접조건 및 용접품질을 평가하는데 유효한 파라미터들이었다.

• KSBB Journal
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• 제20권3호
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• pp.133-141
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• 2005

This review presents the preparation, transport mechanism and application of molecularly imprinted membranes (MIM). Molecular imprinting has now been established as a technique which allows the creation of tailor-made binding sites for many classes of compounds. MIM have some advantages; a high capacity due to a large surface area, faster transport of substrate molecules and faster equilibrium of binding cavities compared to molecularly imprinted particles. MIM were prepared by covalent and non-covalent chemical bonding systems, by interactions between functional monomer and template. MIM can be prepared by in-situ polymerization, wet phase inversion, dry phase inversion, and surface imprinting method. MIM can continuously separate mixtures based on facilitated or retarded diffusion of the template. MIM can change their permeability in the presence of templates. MIM have a potential to be used to separate chiral compounds and materials with similar structures. However the application of MIM by the chemical industries is still in its infancy stages.

• Bulletin of the Korean Chemical Society
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• 제33권8호
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• pp.2603-2608
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• 2012

A novel mononuclear supramolecule of copper(II) has been synthesized with Ippyt ligand (Ippyt=3-(4'-imidazole phenyl)-5-(pyrid-2''-yl)-1,2,4-triazole) (1). Compound 1, namely [$Cu(Ippyt)_2(H_2O)_2$], has been characterized by single-crystal X-ray diffraction, IR spectrum, elemental analysis and thermogravimetric analysis. Structure determination reveals that the elongated-octahedral geometry is formed in the vicinity of the copper (II) atom being coordinated by four nitrogen atoms from two Ippyt ligands occupying the equatorial position and two oxygen atoms from two coordinated water molecules in the axial position, which together form the $N_4O_2$ donor set. Hydrogen bonding interactions between nitrogen and oxygen atoms result in the set up of a supramolecular network architecture. Biological properties including antibacterial activity and superoxide dismutase (SOD) mimetic activity of compound 1 have been investigated by agar diffusion method and the modified Marklund method, respectively. The results indicate that compound 1 exhibits a stronger antibacterial efficiency than the parent ligand and it also has a certain radical-scavenging activity.