• Korean Journal of Fisheries and Aquatic Sciences
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• v.17 no.5
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• pp.353-360
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• 1984

As an effort to expand the utilization of mackerel which has been thought disadvantageous to processors due to the defects in bloody dark color of meat, high content of lipid, and low stability of protein, and to develope a new type of product, so called, preservative fish meat paste, the processing method was studied in which dielectric heating was applied by means of cooking, pasteurization, dehydration, and control of water activity. The principle of this method is based on that dielectric heating can initiate a rapid dispersion or displacement of moisture in the meat tissue so that the level of water acivity can be controlled by dehydration with hot air meanwhile the product is cooked, pasteurized, and texturized. And the product is finally heated with electric heaters and vacuum sealed to stabilize water activity and storage stability. In present paper, a formula for preparing the fish meat-stach paste, the conditions of dielectric heating and dehydration, shape and size of the product, and other parameters were tested to optimize the process operation. A formula of the fish meat-starch paste to provide proper textural properties and water activity was $10\%$ starch, $1.5\%$ salt, $3\%$ soybean, $0.6\%$ MSG, $2\%$ sucrose, and $3\%$ sorbitol against the weight of fish meat. A proper shape and size of the product to avoid foaming and case hardening during heating was sliced disc of 8 cm $diameter{\times}0.8$ cm thickness or $10{\times}10$ cm square plate with 1.0 cm thickness. The disc shape was recommended because it resulted more uniform heating, minimum foaming and case hardening. And it was also advantageous that disc was simply provided when the fish meat disc was stuffed in the same, solidified in boiling water for 2 to 3 minutes, and sliced. Condition of dielectric heating was critical to decide the levels of sterility, water activity, and textural property of the product. The temperature at the center of the meat disc slices was raised up to $95^{\circ}C$ in 1.5 minutes so that continuous exposure to microwave caused expanded tissue and hardening ending up with a higher water content. Heating for 5 to 6 minutes was adequate to yield the final water activity of 0.86 to 0.83(35 to $40\%$ moisture). It is important, however, that heating had to be done periodically, for instance, in the manner of 2.0, 1.5, 1.5, and 1.0 minute to give enough time to displace or evaporate moisture from the meat tissue. The product was dehydrated for 2 to 3 minutes by hot air of $60^{\circ}C$, 3 to 5m/sec and finally exposed to electric heaters for 5 to 6 minutes until the surface was roasted deep brown. These conditions of heating and dehydration resulted in a complete reduction of total plate count from an initial count of $5.3{\times}10^6/g$ to less than $3{\times}10^2/g$. General composition of the product was $40.1\%$ moisture, $20.8\%$ protein, $17.4\%$ lipid, $16.2\%$ carbohydrate, and $5.5\%$ ash. Textural properties revealed folding test AA, hardness 42, cohesiveness 0.53, toughness 4.6, and elasticity 0.8.

• International Journal of Highway Engineering
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• v.17 no.6
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• pp.1-9
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• 2015

PURPOSES : The objective of this study is to propose a quality control and quality assurance method for use during asphalt pavement construction using non-destructive methods, such as ground penetrating radar (GPR) and an infrared (IR) camera. METHODS : A 1.0 GHz air-coupled GPR system was used to measure the thickness and in situ density of asphalt concrete overlay during the placement and compaction of the asphalt layer in two test construction sections. The in situ density of the asphalt layer was estimated based on the dielectric constant of the asphalt concrete, which was measured as the ratio of the amplitude of the surface reflection of the asphalt mat to that of a metal plate. In addition, an IR camera was used to monitor the surface temperature of the asphalt mat to ensure its uniformity, for both conventional asphalt concrete and fiber-reinforced asphalt (FRA) concrete. RESULTS : From the GPR test, the measured in situ air void of the asphalt concrete overlay gradually decreased from 12.6% at placement to 8.1% after five roller passes for conventional asphalt concrete, and from 10.7% to 5.9% for the FRA concrete. The thickness of the asphalt concrete overlay was reduced from 7.0 cm to 6.0 cm for the conventional material, and from 9.2 cm to 6.4 cm for the FRA concrete. From the IR camera measurements, the temperature differences in the asphalt mat ranged from $10^{\circ}C$ to $30^{\circ}C$ in the two test sections. CONCLUSIONS : During asphalt concrete construction, GPR and IR tests can be applicable for monitoring the changes in in situ density, thickness, and temperature differences of the overlay, which are the most important factors for quality control. For easier and more reliable quality control of asphalt overlay construction, it is better to use the thickness measurement from the GPR.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.523-523
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• 2012

As the wafer geometric requirements continuously complicated and minutes in tens of nanometers, the expectation of real-time add-on sensors for in-situ plasma process monitoring is rapidly increasing. Various industry applications, utilizing plasma impedance monitor (PIM) and optical emission spectroscopy (OES), on etch end point detection, etch chemistry investigation, health monitoring, fault detection and classification, and advanced process control are good examples. However, process monitoring in semiconductor manufacturing industry requires non-invasiveness. The hypothesis behind the optical monitoring of plasma induced ion current is for the monitoring of plasma induced charging damage in non-invasive optical way. In plasma dielectric via etching, the bombardment of reactive ions on exposed conductor patterns may induce electrical current. Induced electrical charge can further flow down to device level, and accumulated charges in the consecutive plasma processes during back-end metallization can create plasma induced charging damage to shift the threshold voltage of device. As a preliminary research for the hypothesis, we performed two phases experiment to measure the plasma induced current in etch environmental condition. We fabricated electrical test circuits to convert induced current to flickering frequency of LED output, and the flickering frequency was measured by high speed optical plasma monitoring system (OPMS) in 10 kHz. Current-frequency calibration was done in offline by applying stepwise current increase while LED flickering was measured. Once the performance of the test circuits was evaluated, a metal pad for collecting ion bombardment during plasma etch condition was placed inside etch chamber, and the LED output frequency was measured in real-time. It was successful to acquire high speed optical emission data acquisition in 10 kHz. Offline measurement with the test circuitry was satisfactory, and we are continuously investigating the potential of real-time in-situ plasma induce current measurement via OPMS.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.17 no.5
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• pp.361-367
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• 1984

In previous paper(Lee et al., 1984), preparation formula and processing conditions of the fish meat (mackerel) paste using dielectric heating were described, that included the proper shape and size of product and the conditions of dielectric heating, hot air dehydration, and heating with electric heater to yield the minimum expansion and case hardening during heating and to controll the final rater activity of 0.86 to 0.83 accompanying with a complete reduction of viable cells and good texture. In present study, changes in VBN, pH, total plate count, water activity, texture, the loss of available lysine, color indexes, TBA value, and the content of TI were determined to assess the quality stability and shelf-life of the product during the storage for 35 days at $5^{\circ}C\;and\;25^{\circ}C$, respectively. And the effect of vacuum sealing and hot water treatment before storage on the storage stability of product was also mentioned. As the product was vacuum packed in K-flex film bag, heat treated in boiling water for 6 minutes, and stored, water activity was maintained 0.86 to 0.84 for 35 days regardless of storage temperature, and the increase of total plate count was negligible in case of $5^{\circ}C$ storage while tended to gain slightly after 25 days at $25^{\circ}C$ storage. Changes in VBN was also minimum with an increase of 1.5 mg/100g at $5^{\circ}C$ and 7.0mg/100g at $25^{\circ}C$, but in case of unpacked sample, it was 24.5mg/100g at $5^{\circ}C$ and 42.4 mg/100g at $25^{\circ}C$ even after 7 days. In textural property hardness tended to increase after 28 days and folding test score was down to A or B from AA grade. The loss of available lysine was $7.5\%\;at\;5^{\circ}C$ and $17.0\%\;at\;25^{\circ}C$ but brown color was not deeply developed as the color index score indicated. TBA value was not increased at $5^{\circ}C$ while it tended to increase rapidly after 30 days at $25^{\circ}C$. Changes in TI content was not obvious except that it showed a tendency of increase at the end of storage as well as in the change of lysine and TBA value. It is concluded from the results that the quality of the product, pasteurized and water activity controlled by dielectric heating, and vacuum packed in K-flex film would be stable for more than 35 days at $5^{\circ}C$ and at least 25 days even at room temperature.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1867-1869
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• 1999

Pulse electric field induced electron emission from ferroelectrics has been studied with Pb$(Zr_xTi_{1-x})O_3$ ceramics with varying Zr/Ti ratio from 35/65 to 65/35, Electron emission was proved to be concentrated on the electrode edge by emission profile test and emission capture photographs. The 65/35 composition showed largest emission charge in lowest field and lowest emission threshold field. The emission characteristics are closely dependent on their ferroelectric properties in hysteresis curve. Electron emission charge increases with the polarization charge and emission threshold voltage is dependent on coercive field regardless of their composition. But dielectric constant has little relation with emission property. Electron emission charge increases exponentially with pulse electric field irrespective of composition. On the assumption that the surface potential is linear with the pulse electric field, electron emission can be regarded as a field emission at the electrode edge using Fowler-Nordheim plot of ln$(Q_e/E_{fe})$ to $1/E_{fe}$.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.196-203
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• 2004

A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.146-150
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• 2001

Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. S-parameters of on-chip and substrate were separately measured in the frequency range of 200 MHz to 20 GHz using a microwave network analyzer HP8510 and cascade probe. And the cascade transmission matrix conversion was performed. The same measurements and conversion techniques were conducted on the assembled test chip and substrate at the same frequency range. Then impedance values in ACF flip-chip interconnection were extracted from cascade transmission matrix. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of SiO$_2$filler to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. High frequency behavior of metal Au stud bumps was investigated. The resonance frequency of the metal stud bump interconnects is higher than that of ACF flip-chip interconnects and is not observed at the microwave frequency band. The extracted model parameters of adhesive flip chip interconnects were analyzed with the considerations of the characteristics of material and the design guideline of ACA flip chip for high frequency applications was provided.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.53-60
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• 2003

CCD(Charge-Coupled Device) wafers, with a layer of micro lenses on top, usually are not passivated with dielectric films. Micro lenses, in general, are made of polymer material, which usually has a large affinity for particles generated in the various chip fabrication processes, most notably the wafer sawing for chip-dicing. The particles deposited on the micro lens layer either seriously attenuate or deflect the incoming light and often lead to CCD failure. In this study we introduce new type of saws which would significantly reduce the particle-related problems found in conventional type of saws. In the new saws, the positions and diverging angles of side and center nozzles have been optimized so as to flush the particles effectively. In addition, an independent nozzle is added for the sole purpose of flushing the generated particles. The test results show that, with the new saws. the ratio of the particle-related CCD chip failures has been dropped drastically from 9.1% to 0.63%.

• The Journal of the Korea institute of electronic communication sciences
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• v.12 no.3
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• pp.427-432
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• 2017

This study describes the design and implementation of SHF band Downconverter Digital Satellite Communication. The SHF band Downconverter unit consists of PLDRO and Frequency converter. In Frequency converter, microstrip BPF and LPF designed through the pre EM simulation are implemented to minimize the unwanted spurious in Frequency converter. Through the pre-simulation analysis of space environment, the possibility of and minimized about the malfunction of equipment and we designed a reliable SHF band Downconverter through simulation for a TID according to the vibration generated during the launch and space radiation environment, and compared pre-simulation of main performance results to test results about main performances of SHF band Downconverter after production.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.198.1-198.1
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• 2016

Organic light-emitting diode (OLED) displays have promising potential to replace liquid crystal displays (LCDs) due to their advantages of low power consumption, fast response time, broad viewing angle and flexibility. Organic light emitting materials are vulnerable to moisture and oxygen, so inorganic thin films are required for barrier substrates and encapsulations.[1-2]. In this work, the silicon-based inorganic thin films are deposited on plastic substrates by plasma-enhanced chemical vapor deposition (PECVD) at low temperature. It is necessary to deposit thin film at low temperature. Because the heat gives damage to flexible plastic substrates. As one of the transparent diffusion barrier materials, silicon oxides have been investigated. $SiO_x$ have less toxic, so it is one of the more widely examined materials as a diffusion barrier in addition to the dielectric materials in solid-state electronics [3-4]. The $SiO_x$ thin films are deposited by a PECVD process in low temperature below $100^{\circ}C$. Water vapor transmission rate (WVTR) was determined by a calcium resistance test, and the rate less than $10.^{-2}g/m^2{\cdot}day$ was achieved. And then, flexibility of the film was also evaluated.