• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.6
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• pp.43-49
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• 1997

Tungsten poycide has studied gate oxide reliability and dielectric strength charactristics as the composition of gate electrode which applied submicron on CMOS and MOS device for optimizing gate electrode resistivity. The gate oxide reliability has been tested using the TDDB(time dependent dielectric breakdwon) and SCTDDB (stepped current TDDB) and corelation between polysilicon and WSi$_{2}$ layer. iN the case of high intrinsic reliability and good breakdown chracteristics on polysilicon, confirmed that tungsten polycide layer is a better reliabilify properities than polysilicon layer. Also, hole trap is detected on the polysilicon structure meanwhile electron trap is detected on polycide structure. In the case of electron trap, the WSi$_{2}$ layer is larger interface trap genration than polysilicon on large POCL$_{3}$ doping time and high POCL$_{3}$ doping temperature condition. WSi$_{2}$ layer's leakage current is less than 1 order and dielectric strength is a larger than 2MV/cm.

• Transactions on Electrical and Electronic Materials
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• v.10 no.3
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• pp.80-84
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• 2009

The microstructure, voltage-current, capacitance-voltage, and dielectric characteristics of CCT doped Zn/Pr-based varistors were investigated at different sintering temperatures. As the sintering temperature increased, the average grain size increased from 4.3 to 5.1 ${\mu}m$ and the sintered density was saturated at 5.81 g $cm^{-3}$. As the sintering temperature increased, the breakdown field decreased from 7,532 to 5,882 V $cm^{-1}$ and the nonlinear coefficient decreased from 46 to 34. As the sintering temperature increased, the donor density, density of interface states, and barrier height decreased in the range of (9.06-7.24)${\times}10^{17}\;cm^{-3}$, (3.05-2.56)${\times}10^{12}\;cm^{-2}$, and 1.1-0.95 eV, respectively. The dielectric constant exhibited relatively low value in the range of 529.1-610.3, whereas the $tan{\delta}$ exhibited a high value in the range of 0.0910-0.1053.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.313-316
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• 1997

The effects of aromatic curing agent of MDA contents and post curing conditions on dielectric deterioration characteristics of DGEBA/MDA/SN system were investigated. The dielectric properties were measured by using needle-plane electrode geometry under the commercial AC high electric field application. As the curing agent content increased, the dielectric breakdown strength increased and then decreased slightly. All the trees initiated from the tip of needle electrode and the shape of the tree in this system was a dendrite type.

• Transactions on Electrical and Electronic Materials
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• v.16 no.2
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• pp.53-61
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• 2015

High-energy ball milling was tested as a method for producing Ultra High Molecular Weight Polyethylene (UHMWPE)- based nanodielectrics containing 1 wt% and 5 wt% OctaIsoButylPOSS (OibPOSS). Qualitative and quantitative evaluations were used to explore the compatibility between OibPOSS and PE. Several ball milling variables were optimized in a bid to achieve UHMWPE/OibPOSS nanodielectrics. The morphology, as well as the thermal and the dielectric properties of the samples, were characterized by scanning electron microscopy, thermogravimetric analysis, broadband dielectric spectroscopy, and progressive-stress breakdown tests. The results showed that (i) ball milling was an effective method for producing UHMWPE/OibPOSS dielectric composites, but appeared ineffective in dispersing OibPOSS at the nanoscale, and (ii) the resulting UHMWPE/OibPOSS dielectric composites presented thermal and dielectric properties similar to those of neat UHMWPE.

• Advances in materials Research
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• v.1 no.1
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• pp.93-107
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• 2012

Epoxy resin is widely used in high voltage apparatus as insulation. Fillers are often added to epoxy resin to enhance its mechanical, thermal and chemical properties. The addition of fillers can deteriorate electrical performance. With the new development in nanotechnology, it has been widely anticipated that the combination of nanoparticles with traditional resin systems may create nanocomposite materials with enhanced electrical, thermal and mechanical properties. In the present paper we have carried out a comparative study on dielectric properties, space charge and dielectric breakdown behavior of epoxy resin/nanocomposites with nano-fillers of $SiO_2$ and $Al_2O_3$. The epoxy resin (LY556), commonly used in power apparatus was used to investigate the dielectric behavior of epoxy resin/nanocomposites with different filler concentrations. The epoxy resin/nanocomposite thin film samples were prepared and tests were carried out to measure their dielectric permittivity and tan delta value in a frequency range of 1 Hz - 1 MHz. The space charge behaviors were also observed by using the pulse electroacoustic (PEA) technique. In addition, traditional epoxy resin/microcomposites were also prepared and tested and the test results were compared with those obtained from epoxy resin/nanocomposites.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.1
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• pp.80-84
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• 2014

The discharge characteristics of Surface Dielectric Barrier Discharge (SDBD) reactor are investigated to find optimal driving condition with adjusting various parameter. When the high voltage with sine wave form is applied to SDBD source, successive pulsed current waveforms are observed owing to multiple ignitions through the long discharge channel and wall charge accumulation on the dielectric surface. The discharge voltage, total charge between dielectrics, mean energy and power are calculated from measured current and voltage according to electrode gap and dielectric thickness. Discharge mode transition from filamentary to diffusive glow is observed for narrow gap and high applied voltage case. However, when the diffusive discharge is occurred with high applied voltage, the actual firing voltage is always lower than that with low driving voltage. The $Si_3N_4$, $MgF_2$, $Al_2O_3$ and $TiO_2$ are considered for dielectric protection and high secondary electron emission coefficient. SDBD with $MgF_2$ shows the lowest breakdown voltage. $MgF_2$ thin film is proposed as a protection layer for low voltage atmospheric dielectric barrier discharge devices.

• Proceedings of the KIEE Conference
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• 1989.07a
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• pp.302-305
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• 1989

Ac, dc and impulse dielectric strengths of $LN_2$ at 0.1MPa were investigated experimentally, referring to the behavior of thermally induced bubble, which might be generated at quenching condition of immerged-cooling superconducting devices. The experimental results show that the bubble shape under electric field stress depends significantly on the applied voltage waveform. With ac voltage, the breakdown voltage of $LN_2$ falls suddenly near to one of the saturated gas at the threshold heater power of boiling onset. In control to this, the reduction of impulse breakdown voltage with heater peter is gradual and the time to breakdown depends on the existence of thermal bubble. These breakdown characteristics can be explained satisfactorily by the bubble behavior under electric fields.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1420-1423
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• 1997

To make clearly breakdown rl1cchanism and path at interface of crystal and amorphous region, we fabricated HDPE and LDPE thin film by dropping solution onto glass substrate. then annealed the film at $140^{\circ}C$. Shperulites formation and its interface prepared from of two different materials differ from each other. Comparing breakdown site and breakdown field of HDPE with those of LDPE, we can demonstrate the reason that breakdown holes in HDPE are concentrated on the region of interface. From the result, It is appeared that interface of crystallites lead not to weakness as electrical insulating materials.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.2
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• pp.151-156
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• 2003

High temperature superconductor can only be applied against an engineering specofication that has to be determined for each particular application form the design requirements for economic viability and for operation margins in service. However, in order to realize the HTS transformer, it is necessary to establish the high voltage insulation technique in cryogenic temperature. Therefore, the composite insulation of double pancake coil type transformer are described and AC breakdown voltage characteristics of liquid nitrogen(LN$_2$) under HTS pancake coil electrode made by Bi-2223/Ag are studied. The Breakdown of LN$_2$ is dominated electrode shape and distance. The influence of pressure on breakdown voltage is discussed with th different electrode. For the electrical insulation design of turn-to-turn insulation for the HTS transformer, we tested breakdown strength of insulation sheet under varying pressure. And we investigated surface flashover properties of LN$_2$ and complex conition of cryogenic gaseous nitrogen(CGN$_2$) obove a LN$_2$ surface. The surface voltage of GFRP was measured as a function of thickness and electrode distance in LN$_2$ and complex condition of CGN$_2$ above a LN$_2$ surface. this research presented information of electrical insulation design for double pancake coil(DPC) type HTS transformer.

• Electrical & Electronic Materials
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• v.7 no.5
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• pp.376-382
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• 1994

In this study we developed a program(DEVSIM) to simulate the two dimensional distribution of the electrostatic potential and the electric field of the arbitrary structure consisting of GaAs/AlGaAs semiconductor and metal as well as dielectric. By the comparision of the electric field distribution of GaAs MESFETs with the various recess gates we proposed a suitable device structure to improve the breakdown characteristics of MESFET. According to the results of simulation the breakdown characteristics were improved as the thickness of the active epitaxial layer was decreased. And the planar structure, which had the highly doped layer under the drain for the ohmic contact, was the worst because the highly doped layer prevented the space charge layer below the gate from extending to the drain, which produced the narrow spaced distribution of the electrostatic potential contours resulting in the high electric field near the drain end. Instead of the planar structure with the highly doped drain the recess gate structure having the highly doped epitaxial drain layer show the better breakdown characteristics by allowing the extention of the space charge layer to the drain. Especially, the structure in which the part of the drain epitaxial layer near the gate show the more improvement of the breakdown characteristics.