• Design & Manufacturing
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• v.11 no.2
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• pp.37-41
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• 2017

With light vehicle weight gradually becoming ever more importance due to tightened exhaust gas regulations, hot-stamping processing using boron alloyed steel is being applied more and more by major automobile OEMs since process assures both moldability and a high strength of 1.5 GPa. Although laser trimming is generally applied to the post-processing of the hot-stamped process with high strength, there have been many studies of in-die hot trimming using shear dies during the quenching of material in order to shorten processing times. As such, this study investigated the effects of the Shear rate and Shear mechanism on shear processes during the quenching process of hot-stamping material. In case of pad variable, padding force is very weak compared with shear force, so it does not affect the shear surface. In case of shear rate, the higher the shear at high temperatures and the higher the friction effect. As a result the rollover and the fracture distribution decreased, and the burnish distribution increased. Therefore, it is considered that the shear quality is guaranteed when high shear rate is applied in high temperature shear process.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.6
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

• Elastomers and Composites
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• v.43 no.3
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• pp.173-182
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• 2008

Rubber-pad forming process for materials such as metal in which portions of the die which act upon the material is composed of a natural or synthetic rubber or elastomer material. This makes the rubber pad forming process relatively cheap and flexible, high accuracy for small product series in particular. In this study, we carried out the physical test and finite element analysis of elastomer such as natural rubber and urethane for steel rack rube forming. The non-linear property of elastomer which are described as strain energy function are important parameter to design and evaluate of elastomer component. These are determined by material tests which are uni-axial tension and bi-axial tension. This study is concerned with simulation and investigation of the significant parameters associated with this process.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.7
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• pp.147-154
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• 2003

An effective die-polishing robot system is developed. ATC (Automatic Tool Change), tool posture angle control, and robot program for polishing application are developed and integrated into a robotic system that consists of a robot, pneumatic grinding tool, and grinding abrasives (papers and special films). ATC is specifically designed to exchange whole grinding tool set for complete unmanned operation. A tool posture angle control system is developed for the tools to maintain a specified skew angle rather than right angle on the surface for best finishing results. A PC and the robot controller control ATC and tool posture angle. Also, there have been more considerations on enhancing the performance of the system. Elastic material is inserted between the grinding pad and the holder for better grinding contact. Robot path data are generated automatically from the NC data of previous machining process.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.69-73
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• 2008

This article shows that the susceptibility of the device pattern to thermal stress-induced damage has a strong dependence on its proximity to the device comer in semiconductor devices utilizing lead-on-chip (LOC) die attach technique. The result, as explained based on numerical calculation and experiment, indicateds that the stress-driven damage potential of the passivation layer is the highest at the device comer. Thus, the bonding pads, which are very susceptible to passivation damage, should be designed to be located along the central region rather than the peripheral region of the device.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.1-7
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• 2021

In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (P_in) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P_1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.

• Textile Coloration and Finishing
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• v.23 no.4
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• pp.304-311
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• 2011

For sound absorption and sound insulation in automobile industry, the sound absorption materials based on meltblown nonwovens were prepared by SMS (spunbond-meltblown-spunbond) technique. And the sound absorption coefficient (${\alpha}$) of the meltblown nonwoven, produced with isotatic-polypropylene(PP), was examined for the various processing conditions such as die-to-collector distance(DCD), nonwoven weight(GSM), and air suction conditions. The meltblown nonwoven for sound absorption materials was composed of bulky microfiber web, increasing with increases in weight and DCD. The sound absorption coefficient(${\alpha}$) was excellent as a sound absorption materials of PAD type composed of SMS(spunbond-meltblownspunbond) nonwovens.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.3-8
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• 2002

An intelligent polishing robot automation system is developed. Automatic Tool Change System(A.T.C.), Tool Posture Angle Control, and Robot Program for Polishing Application are developed and integrated into a robotic system that consists of a robot, pneumatic finding tool, and finding abrasives (papers and special films). A.T.C. is specifically designed to exchange whole grinding tool set for complete unmanned operation. Tool Posture Angle Control is developed to give a certain skew angle rather than right angle to tools on the surface for best finishing results. A.T.C. and Tool Posture Angle Control is controlled by a PC and the robot controller. Also, there have been some considerations on enhancing the performance of the system. Some elastic material is inserted between the grinding pad and the holder for better grinding contact. The robot path data is generated automatically from the NC data of previous machining process.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.7
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• pp.315-318
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• 2005

The effect of plasma cleaning was examined on package delamination phenomena in the integrated circuit (IC) packaging process. Without plasma cleaning, delamination was observed for all three experimental treatments applied after the packaging step, which include bake of If, reflow, and bake of If followed by reflow However, no delamination was observed when the plasma cleaning was performed before and after the wire bonding step. Plasma cleaning was found to be a critical step to improve the reliability of the package by reducing the possibility of contact failure between die pad and bonding wire.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.873-878
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• 2000

Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.