• Title/Summary/Keyword: die design

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Simulation and Experimental Investigation of Reverse Drawing Process for Manufacture of High-Capacity Aluminum Liner (대용량 알루미늄 라이너의 성형을 위한 역 드로잉 공정 해석 및 실험)

  • Lee, Seungyun;Cho, Sungmin;Lee, Sunkyu;Lyu, Geunjun;Kim, Soyoung;Kang, Sunghun
    • Journal of the Korean Institute of Gas
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    • v.20 no.4
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    • pp.78-84
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    • 2016
  • In this work, finite element investigations were carried out to optimize reverse drawing process design for manufacture of high-capacity aluminum liner used in fuel cell vehicle. The tensile tests with aluminum alloy Al6061 annealed at $350^{\circ}C$ were carried out to obtain the flow stresses. In order to estimate more accurate flow stresses after necking, the flow stresses were estimated from the comparison of load vs. displacement curves which were obtained from experimental and simulation results of tensile tests. In case of finite element analyses of reverse drawing processes, it was focused on the effects of process designs such as punch and die designs, blank holding force, drawing ratio and the clearance between the punch and blank holder on the generation of wrinkle and fracture of the blank and partially heated punch. However, it was revealed that experimental results still show the fracture at the end of 2nd drawn cup, although partially heated punch is used. Nevertheless, the drawn cup can be used because the sufficient length of the drawn cup for the next flow forming process and spinning process was obtained.

Process Capability Optimization of Ball Bonding Using Response Surface Analysis in Light Emitting Diode(LED) Wire Bonding (반응 표면 분석법을 이용한 Light Emitting Diode(LED) wire bonding 용 Ball Bonding 공정 최적화에 관한 연구)

  • Kim, Byung-Chan;Ha, Seok-Jae;Yang, Ji-Kyung;Lee, In-Cheol;Kang, Dong-Seong;Han, Bong-Seok;Han, Yu-Jin
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.4
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    • pp.175-182
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    • 2017
  • In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.

A Study on Structural Characteristics of Axial Fans Operating Speed Using Finite Element Analysis (유한요소해석을 이용한 축류팬 운전속도별 구조특성에 대한 연구)

  • Kook, Jeong-Keun;Cho, Byung-Kwan
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.22 no.2
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    • pp.593-601
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    • 2021
  • The axial fan is an element of a blower used for ventilation in various industrial fields. Many studies on aerodynamic performance have been conducted to assess axial fans using fluid dynamics. The subject was a large axial fan size, 1800 mm in diameter with 100 horsepower. The blower's axial fan consisted of blades, hubs, hub caps, and bosses are important components. The blade design has a great influence on the aerodynamic performance. 3D point data is extracted using an aerodynamic performance prediction program, and a 3D modeling shape is generated. The blades and hubs, which are important components, can be easily modified if processed by cutting owing to the environment in which blades and hubs are manufactured through die casting or gravity casting. In this study, the structural safety of components and the analysis results of weak areas at the rated operating speed of the axial fan were verified using the maximum stress and safety factor. The tip clearance reflected in the design was the rotation of the blade. To check whether there is interference with other components, the displacement result was derived to verify the structural safety of the axial fan.

Design Optimization to achieve an enhanced flatness of a Lab-on-a-Disc for liquid biopsy (액체생검용 Lab-on-a-Disc의 평탄도 향상을 위한 최적화)

  • Seokkwan Hong;Jeong-Won Lee;Taek Yong Hwang;Sung-Hun Lee;Kyung-Tae Kim;Tae Gon Kang;Chul Jin Hwang
    • Design & Manufacturing
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    • v.17 no.1
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    • pp.20-26
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    • 2023
  • Lab-on-a-disc is a circular disc shape of cartridge that can be used for blood-based liquid biopsy to diagnose an early stage of cancer. Currently, liquid biopsies are regarded as a time-consuming process, and require sophisticated skills to precisely separate cell-free DNA (cfDNA) and circulating tumor cells (CTCs) floating in the bloodstream for accurate diagnosis. However, by applying the lab-on-a-disc to liquid biopsy, the entire process can be operated automatically. To do so, the lab-on-a-disc should be designed to prevent blood leakage during the centrifugation, transport, and dilution of blood inside the lab-on-a-disc in the process of liquid biopsy. In this study, the main components of lab-on-a-disc for liquid biopsy are fabricated by injection molding for mass production, and ultrasonic welding is employed to ensure the bonding strength between the components. To guarantee accurate ultrasonic welding, the flatness of the components is optimized numerically by using the response surface methodology with four main injection molding processing parameters, including the mold & resin temperatures, the injection speed, and the packing pressure. The 27 times finite element analyses using Moldflow® reveal that the injection time and the packing pressure are the critical factors affecting the flatness of the components with an optimal set of values for all four processing parameters. To further improve the flatness of the lab-on-a-disc components for stable mass production, a quarter-disc shape of lab-on-a-disc with a radius of 75 mm is used instead of a full circular shape of the disc, and this significantly decreases the standard deviation of flatness to 30% due to the reduced overall length of the injection molded components by one-half. Moreover, it is also beneficial to use a quarter disc shape to manage the deviation of flatness under 3 sigma limits.

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Evaluation of Harmless Crack Size of SCM822H Steel by Double Shot Peening (이중 쇼트 피닝에 의한 SCM822H 강의 무해화 균열 크기 평가)

  • Jin-Woo Choi;Seo-Hyun Yun;Yung-Kug Kwon;Gum-Hwa Lee;Ki-Woo, Nam
    • Journal of the Korean Society of Industry Convergence
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    • v.26 no.6_2
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    • pp.1011-1017
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    • 2023
  • In this study, the harmless crack size (ahml) by double shot peening (DSP) using shot balls with different diameters was evaluated on carburized, quenched-tempered SCM822H steel. The minimum crack size (aNDI) detectable by non-destructive inspection was also evaluated. The relationship between the crack size (a25,50) that reduces the fatigue limit by 25% and 50% and ahml was evaluated. The residual stress of DSP was greater in SP(0.6+0.08) than SP(0.8+0.08) and appeared deeper in the depth direction. In addition, the hardness below the surface appeared larger. The fatigue limit of DSP increased 2.07 times and 1.95 times compared to non-SP. All ahml of the DSP specimen was determined at the depth (a). The compressive residual stress distribution affects ahml, and the ahml of SP(0.6+0.08), which has a large compressive residual stress and a high fatigue limit, appeared large. ahml of SP(0.6+0.08) introduced deeper than the residual stress of SP(0.8+0.08) is larger in the range of As=1.0-0.3. Since the residual stress in the thickness direction has a greater effect on ahml than the residual stress at the surface, it is necessary to introduce it more deeply. The relation of ahml, a25,50, and aNDI were evaluated in the point for safety and reliability.

Fracture load and marginal fitness of zirconia ceramic coping by design and coloration (유색 및 백색 지르코니아 세라믹 코핑의 코핑 디자인에 따른 파절 하중과 변연 적합성)

  • Shin, Mee-Ran;Kim, Min-Jeong;Oh, Sang-Chun
    • The Journal of Korean Academy of Prosthodontics
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    • v.47 no.4
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    • pp.406-415
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    • 2009
  • Purpose: The purpose of this study was to compare the marginal fitness and fracture load of the zirconia copings according to the design with different thickness and coloration. Material and methods: The evaluation was based on 80 zirconia copings. Zirconia copings were fabricated in design with different thicknesses using CAD/CAM system (Everset, KAVO dental GmbH, Biberach, Germany). The designs of copings were divided into four groups. The first group consisted of copings with uniform thickness of 0.3 mm. The thickness in the second group was 0.3 mm on the buccal surface and 0.6 mm on the lingual surface. The third group consisted of coping with uniform thickness of 0.6 mm. The thickness in the fourth group was 0.6 mm on the buccal surface and 1mm on the lingual surface. Each group consisted of 10 colored and 10 uncolored copings. Half of the copings (40) processed with a milling system according to the specific design were sent to be given a color (A3) through saturation in special dye by a manufacturing company. Just after sintering, the marginal discrepancies of copings were measured on the buccal, lingual, mesial and distal surfaces of metal die, under a Video Microscope System (sv-35, Sometech, Seoul, Korea) at a magnification of $\times$ 100. It was remeasured after the adjusting of the inner surface. Next, all copings were luted to the metal dies using reinforced cement {GC FujiCEM (GC Corp. Tokyo, Japan)} and mounted on the testing jig in a Universal Testing Machine (Instron 4467, Norwood, MA, USA). The results were analyzed statistically using the one-way ANOVA test. Results: The obtained results were as follow: 1. The measured value of marginal discrepancy right after sintering was the greatest in the contraction of the buccal area in all groups, except for group I2. 2. There was no significant difference of marginal fitness among the groups in the colored zirconia group (P<.05). 3. When the marginal fitness among the groups in the uncolored zirconia group was considered, group II2 had the smallest marginal discrepancy. 4. When the colored and uncolored groups with the same design were compared, there was a significant difference between I1 and II1 groups. In group 2, 3, and 4, the uncolored zirconia had the greatest marginal fitness (P<.05). 5. After adjustment of inner surface, there was no significant difference in the marginal fitness in all groups when color and design of the zirconia coping were compared. 6. The fracture load of CAD/CAM zirconia copings showed significant difference in group 1, 2, 3, and 4. I4 and II4 had the strongest fracture load. 7. When groups with different color and same design were compared, all colored groups showed greater fracture load (P>.05), with no significance. Conclusion: There was difference in the marginal fitness according to the design and coloration of zirconia copings right after sintering, but it was decided that the copings may well be used clinically if the inner surface are adjusted. The copings should be thick enough for the reinforcement of fracture strength. But considering the esthetics of the visible surfaces (labial and buccal surface), the thickness of copings may be a little thin, without giving any significant effect on the fracture strength. This type of design may be considered when giving priority to preservation of tooth or esthetics.

A comparison of the fidelity of various zirconia-based all-ceramic crowns fabricated with CAD/CAM systems (수종의 CAD/CAM 시스템으로 제작한 지르코니아 기반 완전도재관의 적합도 비교)

  • Kim, Sung-Jun;Jo, Kwang-Hun;Lee, Kyu-Bok
    • The Journal of Korean Academy of Prosthodontics
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    • v.47 no.2
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    • pp.148-155
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    • 2009
  • Statement of problem: The interest in all-ceramic restorations has increased as more techniques have become available. With the introduction of machinable dental ceramics and CAD/CAM systems there is a need to evaluate the quality levels of these new fabrication techniques. Purpose: This study is to evaluate the crown fidelity(absolute marginal discrepancy and internal gap) of various zirconia-based all-ceramic crowns fabricated with different CAD/CAM(computer-assisted design/computer-assisted manufacturing) systems and conventional cast metal-ceramic crowns. Material and methods: A resin tooth of lower right second premolar was prepared. After an impression was taken, one metal master die was made. Then 40 impressions of metal master dies were taken for working dies. 10 crowns per each system were fabricated using 40 working dies. Metal-ceramic crowns were cast by using the conventional method, and Procera, Lava, and Cerec inLab crowns were fabricated with their own CAD/CAM manufactruing procedures. The vertical marginal discrepancies and internal gaps of each crown groups were measured on a metal master die without a luting agent. The results were statistically analyzed using the one-way ANOVA and Tukey's HSD test. Results: 1. Vertical marginal discrepancies were $50.6{\pm}13.9{\mu}m$ for metal-ceramic crowns, $62.3{\pm}15.7{\mu}m$ for Procera crowns, $45.3{\pm}7.9{\mu}m$ for Lava crowns, and $71.2{\pm}2.0{\mu}m$ for Cerec inLab crowns. 2. The Internal gaps were $52.6{\pm}10.1{\mu}m$ for metal-ceramic crowns, $161.7{\pm}18.5{\mu}m$ for Procera crowns, $63.0{\pm}10.2{\mu}m$ for Lava crowns, and $73.7{\pm}10.7{\mu}m$ for Cerec inLab crowns. Conclusion: 1. The vertical marginal discrepancies of, 4 crown groups were all within the clinically acceptable range($120{\mu}m$). 2. The internal gaps of LAVA, Cerec inlab, and metal-ceramic crowns were within clinically acceptable range except Procera crown($140{\mu}m$).

A UTMI-Compatible USB2.0 Transceiver Chip Design (UTMI 표준에 부합하는 USB2.0 송수신기 칩 설계)

  • Nam Jang-Jin;Kim Bong-Jin;Park Hong-June
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.42 no.5 s.335
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    • pp.31-38
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    • 2005
  • The architecture and the implementation details of a UTMI(USB2.0 Transceiver Macrocell Interface) compatible USB2.0 transceiver chip were presented. To confirm the validation of the incoming data in noisy channel environment, a squelch state detector and a current mode Schmitt-trigger circuit were proposed. A current mode output driver to transmit 480Mbps data on the USB cable was designed and an on-die termination(ODT) which is controlled by a replica bias circuit was presented. In the USB system using plesiochronous clocking, to compensate for the frequency difference between a transmitter and a receiver, a synchronizer using clock data recovery circuit and FIFO was designed. The USB cable was modeled as the lossy transmission line model(W model) for circuit simulation by using a network analyzer measurements. The USB2.0 PHY chip was implemented by using 0.25um CMOS process and test results were presented. The core area excluding the IO pads was $0.91{\times}1.82mm^2$. The power consumptions at the supply voltage of 2.5V were 245mW and 150mW for high-speed and full-speed operations, respectively.

Numerical Study of Warpage and Stress for the Ultra Thin Package (수치해석에 의한 초박형 패키지의 휨 현상 및 응력 특성에 관한 연구)

  • Song, Cha-Gyu;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.49-60
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    • 2010
  • Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.

Effect of System Parameters on Target Parameters in Extrusion Cooking of Corn Grit by Twin-Screw Extruder (옥분 압출가공시 이축압출성형기의 System Parameters에 따른 압출물의 특성변화)

  • Kim, Ji-Yong;Kim, Chong-Tai;Kim, Chul-Jin
    • Korean Journal of Food Science and Technology
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    • v.23 no.1
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    • pp.88-92
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    • 1991
  • To analyze the effects of the system parameters on the target parameters, which include the amount of water evaporation, water solubility index(WSI) and water absorption index(WAI), test trials of fractional factorial design of the three process variables at three levels were carried out for corn grit with a laboratory twin-screw extruder with three different screw configurations. The system parameters collected from the trials, such as extrusion temperature, specific mechanical energy input(SME) and mean residence time(RT), were showed the ranges of $129{\sim}182^{\circ}C$, $67{\sim}163\;kwh/ton$ and $12{\sim}34\;sec$, respectively. Within these ranges of the system parameters, the target parameters were able to be quantified by using multiple regression equations. The correlation of results with the system parameters blocked by the screw configuration as dependent variables, yield correlation coefficients above 0.90, and the correlation using the system parameters obtained from whole experiment system as the dependent variables yield correlation coefficients around 0.80. The functional relationship, which can be quantified by second order polynomial regression equation with only two system parameters within necessary degree of accuracy, can he graped in three dimensional surface response and contour diagrams.

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