• Design & Manufacturing
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• 제13권4호
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• 마이크로전자및패키징학회지
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• 제26권4호
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• pp.163-169
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• 2019

전자제품에서 사용되던 Sn-Pb계 솔더합금은 RoHS, WEEE, REACH 등의 환경규제에 의해 무연솔더합금(Pb free solder alloy)으로 빠르게 대체되고 있다. 그 중에서도 Sn58%Bi(in wt.%) 합금은 융점이 낮고 Sn-Pb계 합금에 비해 기계적특성이 우수하여, 전자제품 솔더합금으로 사용하기 위한 연구가 진행되고 있다. 그러나 Sn58%Bi 솔더합금은 구성 원소인 Bi의 취성으로 인해 기계적인 신뢰성이 저하되는 문제를 개선할 필요가 있다. 따라서 본 연구에서는 다양한 함량의 Sn-MWCNT (multiwalled carbon nanotube) 입자를 첨가한 Sn58%Bi 복합솔더를 제조한 후, OSP처리된 FR-4 기판 및 FR-4 컴포넌트를 리플로우(reflow) 횟수를 1회부터 7회까지 진행하였다. 접합시편의 접합강도 및 파괴에너지는 전단시험(die shear test)을 통해 측정하였고, 주사전자현미경(scanning electron microscope, SEM)으로 미세조직 및 파괴모드를 분석하였다. Sn-MWCNT 첨가에 의해 Sn58%Bi 복합솔더 접합부에서 조직 미세화가 관찰되었고, 함량이 0.1 wt.%일때 접합강도와 파괴에너지는 각각 20.4%, 15.4% 만큼 증가하였다. 또한 파단면에서 연성파괴(ductile failure) 영역이 관찰되었으며, F-x(force-displacement to failure) 그래프를 통해 Sn-MWCNT의 첨가가 복합솔더의 연성(ductility)을 증가시킨 것을 확인할 수 있었다.

• 소성∙가공
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• 제16권7호
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• pp.530-537
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• 2007

This paper is concerned with the analysis of plastic deformation of bimetal co-extrusion process. Two sets of material combination have been adopted for analysis, i.e. combinations of Cu/Al and Fe/Al. In the first set of material combination, the selected materials are AA 1100 aluminum alloy as hard material and CDA 110 as soft one. This type of material selection is to examine the effect of hard core and soft sleeve and vice versa on the deformation pattern in terms of plastic zone and velocity discontinuity along the contact surface between construction materials. Four different cases of co-extrusion process in terms of material combination and interference bonding were simulated to investigate the effect of material arrangement between core and sleeve, and of bonding on the plastic zones and velocity discontinuity. In the other set of material combination, model materials used as core and sleeve were AA 1100 and AISI 1010, which are relatively soft and hard, respectively. Process parameters except diameter ratio of core to sleeve material such as semi-die angle, reduction in area in global sense and die comer radius have been set constant throughout the simulation to concentrate our effort on the analysis of influence of diameter ratio on deformation behavior such as deformation zone, surface expansion, exit velocity discontinuity between composite materials, and extrusion forces.

• Design & Manufacturing
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• 제7권1호
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• pp.55-59
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• 2013

A Light Emitting Diode(LED) is a semiconductor device which converts electricity into light. LEDs are widely used in a field of illumination, LCD(Liquid Crystal Display) backlight, mobile signals because they have several merits, such as low power consumption, long lifetime, high brightness, fast response, environment friendly. In general, LEDs production does die bonding and wire bonding on board, and do silicon and phosphor dispensing to protect LED chip and improve brightness. Then lens molding process is performed using mixed liquid silicon rubber(LSR) by resin and hardener. A mixture of resin and hardener affect the optical characteristics of the LED lens. In this paper, computational design of static mixer was performed for mixing of liquid silicon. To evaluate characteristic of mixing efficiency, finite element model of static mixer was generated, and fluidic analysis was performed according to length of mixing element. Finally, optimal condition of length of mixing element was applied to static mixer from result of fluidic analysis.

• 소성∙가공
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• 제15권6호
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• pp.421-427
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• 2006

Drawing process of Al-1%Si bonding wire considering fine Si particle is analyzed in this study using FE-simulation. Al-1%Si boding wire requires electric conductivity because Al-1%Si bonding wire is used for interconnection in semiconductor device. About 1% of Si is added to Al wire for dispersion-strengthening. Distribution and shape of fine Si particle have strongly influence on the wire drawing process. In this study, therefore, the finite-element model based on the observation of wire by continuous casting is used to analyze the effect of various parameters, such as the reduction in area, the semi-die angle, the aspect ratio, the inter-particle spacing and orientation angle of the fine Si particle on wire drawing processes. The effect of each parameter on the wire drawing process is investigated from the aspect of ductility and defects of wire. From the results of the analysis, it is possible to obtain the important basic data which can be guaranteed in the fracture prevention of Al-1 %Si wire.

• 한국재료학회지
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• 제20권12호
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• Design & Manufacturing
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• 제17권1호
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• pp.40-47
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• 2023

Macular degeneration and glaucoma are representative age-related retinal diseases that rank second and third in the prevalence of retinal diseases, and are a kind of degenerative neurological disease. Irreversible visual acuity and visual field damage may occur, and the number of patients is rapidly increasing as the population ages. Since this retinal disease is a chronic disease, continuous drug treatment is required. There are various drug delivery methods for treatment, but direct injection of the drug into the intravitreal is the most effective for continuous delivery of the drug over a long period of time. In order to solidify Dexamethasone, a retinal disease treatment, and insert it into the primary intravitreal, it is important to develop a technology to miniaturize the treatment and an applicator to deliver the treatment. In this study, a mold technology was developed to integrate the cannula and hub, which are one part of applicator. In addition, surface treatment was performed on the outside of the cannula to improve the bonding strength between the cannula and the hub, and the bonding strength according to each condition was analyzed through a tensile test.

• Design & Manufacturing
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• 제2권4호
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• pp.44-47
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• 2008

The magnetic polishing is the useful method to finish some machinery fabrications by using magnetic power. This method is one of the precision techniques and has an aim for clean technology in the transportation of the pure gas in the clean pipes. The magnetic abrasive polishing method is not so common in the field of machine that it is not known to widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper we deals with the development of the magnetic abrasive with the use of Sr-Ferrite. In this development, abrasive grain A has been made by using the resin bond fabricated at low temperature. And magnetic abrasive powder was fabricated from the Sr-Ferrite which was crushed into 200 mesh. The XRD analysis result shows that only A abrasive and Sr-Ferrite crystal peaks were detected, explaining that resin bond was not any more to contribute chemical reaction. From SEM analysis, we found that A abrasive and Sr-Ferrite were strongly bonding with each other.

• 소성∙가공
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• 제18권1호
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• pp.80-86
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• 2009

This paper presents the plastic inhomogeneous deformation behavior of bimetal composite rods during the axisymmetric and steady-state extrusion process through a conical die. The rigid-plastic FE model considering frictional contact problem was used to analyze the co-extrusion process with material combinations of Cu/Al. Different cases of initial geometry shape for composite material were simulated under different conditions of co-extrusion process, which includes the interference and frictional conditions. From the simulation results, the sleeve cladding rate at the core/sleeve interface was recorded as a distribution of diameter ratio and interference conditions, which will be useful for the investigations of the bonding process during co-extrusion process. In addition, the results of the co-extrusion, connected with the results of the variations of diameter rate and average contact pressure, demonstrate a good agreement and present the possibility of describing the parameters of the plastic zones in non-uniform deformation of these type of composite materials.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1995년도 특별강연 및 춘계학술발표 개요집
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• pp.155-159
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• 1995

A16061 alloy reinforced with 10 vol% $\delta$-A1$_2$O$_3$ short fiber have been fabricated by Rheo-compocasting and squeeze casting and extruded at high temperature using conical shape die and curved shape die with various extrusion ratios.. Tensile and hardness tests were carried out to examine mechanical properties of extruded materials and SEM observation of fractured surface was capable of accounting for fracture mechanism and bonding state of fiber and matrix.