• 한국포장학회지
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• 제26권2호
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• pp.61-69
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• 2020

As post-harvest processes of onions are carried by a 20 kg-net package which results in high-cost and low-efficiency, especially, the insufficient drying and physical damage of onions after harvesting leads to a huge second loss in storage, we had developed a low-cost, high-efficiency post-harvest bulk handling machinery system by collecting onions on a farm using ton-bags, drying with forced air circulation, and sorting/packaging. The post-harvest bulk handling machinery system consisted of 6 devices, and this study designed an automatic feed hopper with a feeding rate control device, an inclined belt conveyor with a two-step chute, and an automatic pallet unloading device for feeding onions into the sorting/packing line. This study also analyzed the performance and control of the total system. The device had 1-ton handling capacity, but the operational condition was set to increase the capacity. The three-step filling method of pallet by the velocity control of the inclined belt conveyor was applied in the post-harvest bulk handling machinery system for the prevention of physical damage. If one worker was set to operate the total system, the time required to complete one palletized load was approximately 5 minutes and 5 seconds. The calculated daily handling capacity was approximately 94 tons, when the daily actual working time was 8 hours. When the developed system was applied to the managerial size of 2,000 ton, the processing cost per ton of the system was decreased by 19.5%, compared with the existing 20 kg-net package-based handling. The developed post-harvest bulk handling machinery system would be a good substitute for the rapid decline and aging of rural labor.

• 한국전기전자재료학회논문지
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• 제30권7호
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• pp.407-412
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• 2017

This paper introduces a biocompatible packaging system for implantable medical device having a hermetic sealing, such that a perfect physical and chemical isolation between electronic medical system and human body (including tissue, body fluids, etc.) is obtained. The hermetic packaging includes an electronic MEMS pressure sensor, power charging system, and bluetooth communication system to wirelessly measure variation of capacitance. The packaging was acquired by Quartz direct bonding and $CO_2$ laser welding, with a size of width $ 6cm{\times}length\;10cm{\times}lheight\;3cm$. Hermetic sealing of the packaged system was tested by changing the pressure in a hermetic chamber using a precision pressure controller, from atmospheric to 900 mmHg. We found that the packaged system retained the same count or capacitance values with sensor 1 - 25,500, sensor 2 - 26,000, and sensor 3 - 20,800, at atmospheric as well as 900 mmHg pressure for 5 hours. This result shows that the packaging method has perfect hermetic sealing in any environment of the human body pressure.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.38-38
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• 2008

무선 통신에 사용되는 기판에서 passive device는 대부분 기판 위에 개별적으로 표면 실장 되고 있으며 전체 기판면적에 80% 정도를 차지하고 있다. 따라서 기판의 소형화, 경량화를 위하여 많은 면적을 차지하는 수동소자들을 다층인쇄회로기판(multi-layer circuit board)에 내장하는 내장형 수동소자(embedded passive device) 기술이 연구되고 있다. 본 연구원에서 개발한 복합재료는 무기물 충전제 $SrTiO_3$를 사용하였으며, 열가소성 수지로는 cyclo-olefin-polymer계열의 수지를 바탕으로 제작 하였고, 유전율7~7.5이고 유전손실은 0.0045이다. 또한 $SrTiO_3$/유기물 복합재료는 공정온도가 낮고 경제적인 유기물에 높은 유전상수를 갖는 무기물이 분산되어 있는 형태이며, 우수한 유전 특성, 화학적 안정성, 저온 제조공정, 제조단가의 감소, 패키징 크기의 감소 등의 장점을 갖는다. 개발된 재료를 기반으로 Multi-layer 구조를 이용한 다양한 용량대의 capacitor를 구현 하였으며, spiral inductor 와 내장형 spiral inductor를 구현하여 다양한 용량대의 inductor를 구현 하였다. 그리고 각각의 구조에 따른 inductance와 Q factor를 분석 하였으며, Q factor가 100이상인 high Q inductor도 구현하였다. 이렇게 구현된 내장형 수동소자는 기판의 크기의 감소와 제조 단가의 절감, 최소 크기의 기판을 구현하는데 응용이 가능 할 것으로 예상 된다.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.69-73
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• 2008

본 연구에서는 리드-온-칩 패키징 기술을 이용한 반도체 제품에서 디바이스의 패드의 위치가 온도변화로 인한 신뢰성 문제에 대단히 중요하다는 것을 보여준다. 컴퓨터를 이용한 이론적 계산 및 실험을 통해 패시베이션 파손으로 대변되는 신뢰성 문제가 디바이스의 코너 부위에 위치한 패턴에서 가장 심하게 발생할 수 있다는 것을 보여준다. 따라서, 패시베시션 파손 등으로 인한 디바이스의 신뢰성 저하를 예방하기 위해서는 취약한 패드 부위는 다바이스의 테두리 부위보다는 중앙부위에 위치하도록 설계하는 것이 바람직하다는 것을 본 연구에서는 지적하고 있다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.551-552
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• 2008

This paper presets a results of frequency response in variation of wire bonding length. A gold ball bonding is used as a wire bonding process, and a DPDT(double pole double thru) switch is adapted as a device for test. Wire length is ranged from 442um to 833um and a measured frequency range is from 1 GHz to 6 GHz. Little difference are measured in insertion loss and return loss depending on wire length. Measured S21 and S11 are -0.58 dB and -17.7 dB, respectively. S21 insertion loss is rising up and S11 insertion loss is falling down as the frequency is increased.

• 펄프종이기술
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• 제46권4호
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• pp.93-100
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• 2014

The packaging with environment-friendly materials become more important issue since the concern for the environment and the disposal of waste such as the packaging materials has increased. Although the paper based packaging such as corrugated box are widely used as a typical environment-friendly packaging stuff, the heat insulation properties of paper packaging did not get many attention. In this study, the heat insulation properties of paper were deeply evaluated to improve the functional properties as packaging material of the cold storage goods. The simple device for evaluating the heat insulation of paper product was developed. Subsequently, the changes in the heat insulation depending on the paper structure and the addition of the inorganic fillers were investigated by using the instrument. The higher basis weight and the less beating time resulted in the bulkier structure and the less efficiency of heat transfer. The addition of the perlite powder as a filler resulted in the great increase in the heat insulation, although the addition of the calcium carbonate decreased the heat insulation potential of paper.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.315-315
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• 2010

휴대용 전자 기기는 얇고 가벼우면서 빠른 대용량을 처리하는 속도와 다기능이 필요한 추세로 가고 있다. 기기 크기가 작아짐에 따라서 내장 되는 칩 또한 소형화, 고집적화, 고성능화가 요구되므로 이에 상응하는 발전된 패키징 기술이 필요하게 되었고, 이에 대응하기위해서 embedded components device 패키징 기술이 필요로 하게 되었다. 본 연구에서는 $21{\Omega}$ 의 저항 값을 갖는 1005 수동 소자를 prepreg를 이용하여 PCB기판에 내장 한 후 micro via를 이용하여 무전해 구리 도금으로 전기적인 연결을 하여 기판을 제작하였다. 제작되어진 기판으로 Reflow, Aging 테스트 후 칩과 계면간의 금속화합물 반응을 관찰하였다. 또한 Reflow외 시효처리를 끝마친 기판을 사용하여 drop test를 실시한 후 fail 발생 시 저항 값의 변화와 접합부의 미세조직을 관찰하였다.

• ETRI Journal
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• 제26권6호
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• pp.589-596
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• 2004

Packaging technologies for a broadband and narrowband modulator with a traveling wave electro-absorption modulator (TWEAM) device were developed. In developing a broadband modulator, the effects of the device and packaging designs on the broadband performance were investigated. The optimized designs were obtained through a simulation with the result that we developed a broadband modulator with a 3 dB bandwidth of 38 GHz in the electrical-to-optical (E/O) response, an electrical return loss of less than -10 dB at up to 26 GHz, an rms jitter of 1.832 ps, and an extinction ratio of 5.38 dB in a 40 Gbps non-return to zero (NRZ) eye diagram. For analog application, the effect of the RF termination scheme on the fractional bandwidth was studied. The microstrip line with a double stub as a matching circuit and a laser trimming process were used to obtain an $S_{11}$ of -34.58 dB at 40 GHz and 2.9 GHz bandwidth of less than -15 dB.

• 한국포장학회지
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• 제28권3호
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• pp.193-199
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• 2022

Sustainable energy supplies without the recharging and replacement of charge storage device have become increasingly important. Among various energy harvesters, the triboelectric nanogenerator (TENG) has attracted considerable attention due to its high instantaneous output power, broad selection of available materials, eco-friendly and inexpensive fabrication process, and various working modes customized for target applications. The TENG harvests electrical energy from wasted mechanical energy in the ambient environment. TENG devices are very likely to be used in next-generation renewable energy and energy harvesting. TENG devices have the advantage of being able to manufacture very simple power devices. In this experiment, various organic dielectrics and inorganic dielectrics were used to improve the open voltage of TENG, Among the various organic dielectrics, Teflon-based FEP, which has the highest electron affinity, showed the highest open voltage and Al electrode was fabricated on Teflon substrate by sputtering deposition process. And AAO (Anodized Aluminum Oxide) nanostructures were applied to maximize the specific surface area of the TENG device. The power generation of TENG within the acceleration level (0.25, 0.5, 1.0, 1.5 and 2 G) and the frequency range (5-120 Hz) of the domestic transport environment was up to 4 V.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.390-391
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• 2007

LED Packaging 과정 중 Die bond 재료로 Silver epoxy를 사용하여 Packaging 한 후 T3Ster 장비로 열 저항 값(Rth)을 측정하였다. Silver epoxy 의 접착 두께를 조절하여 열 저항 값을 측정하였고, 열전도도 값이 다른 Silver epoxy를 사용하여 열 저항 값을 측정하였다. Silver epoxy 접착 두께가 충분하여 Chip 전면에 고루 분포되었을 경우 그렇지 않은 경우보다 평균 4.8K/W 낮은 13.23K/W의 열 저항 값을 나타내었고, 열전도도가 높은 Silver epoxy 일수록 열전도도가 낮은 재료보다 평균 4.1K/W 낮은 12K/W의 열 저항 값을 나타내었다.