• Journal of Institute of Control, Robotics and Systems
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• v.13 no.8
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• pp.743-748
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• 2007

Recently, various types of camera mouse are developed using the image processing. The camera mouse showed limited performance compared to the traditional optical mouse in terms of the response time and the usability. These problems are caused by the mismatch between the size of the monitor and that of the active pixel area of the CMOS Image Sensor. To overcome these limitations, we designed a new input device that uses the face recognition as well as the speech recognition simultaneously. In the proposed system, the area of the monitor is partitioned into 'n' zones. The face recognition is performed using the web-camera, so that the mouse pointer follows the movement of the face of the user in a particular zone. The user can switch the zone by speaking the name of the zone. The multimodal mouse is analyzed using the Keystroke Level Model and the initial experiments was performed to evaluate the feasibility and the performance of the proposed system.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.2
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• pp.106-113
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• 2006

Electrical properties of $Si_{0.88}Ge_{0.12}(C)$ p-MOSFETs have been exploited in an effort to investigate $Si_{0.88}Ge_{0.12}(C)$ channel structures designed especially to suppress diffusion of dopants during epitaxial growth and subsequent fabrication processes. The incorporation of 0.1 percent of carbon in $Si_{0.88}Ge_{0.12}$ channel layer could accomodate stress due to lattice mismatch and adjust bandgap energy slightly, but resulted in deteriorated current-voltage properties in a broad range of operation conditions with depressed gain, high subthreshold current level and many weak breakdown electric field in gateoxide. $Si_{0.88}Ge_{0.12}(C)$ channel structures with boron delta-doping represented increased conductance and feasible use of modulation doped device of $Si_{0.88}Ge_{0.12}(C)$ heterostructures.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.02a
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• pp.287-290
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• 2003

For microwave device applications, c-axis oriented high temperature superconducting YBa$_2$Cu$_3$O$_{7-{\delta}}$ (HTS-YBCO) epitaxial thin films on the r-cut sapphire substrate(Al$_2$O$_3$) were prepared. In order to reduce the lattice mismatch with a substrate and to enhance the crystallity of HTS thin films, CeO$_2$ buffer layer on the r-cut sapphire substrate was grown by the RF-magnetron sputtering. The YBCO films on the CeO$_2$ buffer layer were deposited using the pulsed-laser deposition (PLD) method. These HTS YBCO /CeO$_2$/Al$_2$O$_3$ multilayer thin films(30 $\times$ 30 mm$^2$) routinely exhibited a critical temperature(T$_{c}$) of 89 K from the R-T measurement. Using HTS YBCO/CeO$_2$ /Al$_2$O$_3$ multilayer thin film. We fabricated and characterized the microwave passive devices (planar type filters) with cryopack-age such as the coupled -line type low-pass filter (LPF) and the open-loop meander type bandpass filter (BPF).filter (BPF).).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.11
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• pp.1001-1006
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• 2005

A new fabrication method is proposed to form the stacked polysilicon gate by nitridation in $N_2$ atmosphere using conventional LP-CVD system. Two step stacked layers with an amorphous layer on top of a polycrystalline layer as well as three step stacked layers with polycrystalline films were fabricated using the proposed method. SIMS profile showed that the proposed method would successfully create the nitrogen-rich layers between the stacked polysilicon layers, thus resulting in effective retardation of dopant diffusion. It was observed that the dopants in stacked films were piled-up at the interface. TEM image also showed clear distinction of stacked layers, their plane grain size and grain mismatch at interface layers. Therefore, the number of stacked polysilicon layers with different crystalline structures, interface position and crystal phase can be easily controlled to improve the device performance and reliability without any negative effects in nano-scale CMOSFETs.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.4
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• pp.376-382
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• 2014

In this paper, a 9-bit 1GS/s high precision folding A/D converter with a 45 nm CMOS technology is proposed. In order to improve the asymmetrical boundary condition error of a conventional folding ADC, a novel scheme with an odd number of folding blocks is proposed. Further, a new digital encoding technique is described to implement the odd number of folding technique. The proposed ADC employs a digital error correction circuit to minimize device mismatch and external noise. The chip has been fabricated with 1.1V 45nm Samsung CMOS technology. The effective chip area is $2.99mm^2$ and the power dissipation is about 120 mW. The measured result of SNDR is 45.35 dB, when the input frequency is 150 MHz at the sampling frequency of 1 GHz. The measured INL is within +7 LSB/-3 LSB and DNL is within +1.5 LSB/-1 LSB.

• ETRI Journal
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• v.38 no.1
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• pp.149-158
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• 2016

In the field of augmented reality technologies, commercial optical see-through-type wearable displays have difficulty providing immersive visual experiences, because users perceive different depths between virtual views on display surfaces and see-through views to the real world. Many cases of augmented reality applications have adopted eyeglasses-type displays (EGDs) for visualizing simple 2D information, or video see-through-type displays for minimizing virtual- and real-scene mismatch errors. In this paper, we introduce an innovative optical see-through-type wearable display hardware, called an EGD. In contrast to common head-mounted displays, which are intended for a wide field of view, our EGD provides more comfortable visual feedback at close range. Users of an EGD device can accurately manipulate close-range virtual objects and expand their view to distant real environments. To verify the feasibility of the EGD technology, subject-based experiments and analysis are performed. The analysis results and EGD-related application examples show that EGD is useful for visually expanding immersive 3D augmented environments consisting of multiple displays.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.140-143
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• 2003

BST thin films have a good thermal-chemical stability, insulating effect and variety of phases. However, BST thin films have problems of the aging effect and mismatch between the BST thin film and electrode. Also, due to the high defect density and surface roughness at grain boundarys and in the grains, which degrades the device performances. In order to overcome these weakness, we first applied the chemical mechanical polishing (CMP) process to the polishing of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interface. BST ferroelectric film was fabricated by the sol-gel method. And then, we compared the structural characteristics before and after CMP process of BST films. We expect that our results will be useful promise of global planarization for FRAM application in the near future.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2008.03a
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• pp.837-841
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• 2008

Propulsion of gene coated micro-particles is desired for non-intrusive drug delivery inside biological tissue. This has been achieved by the development of a device that uses high power laser pulses. The present paper looks at the mechanisms of micro-particle acceleration. Initially, a high power laser pulse is focused onto the front side of a thin aluminium foil leading to its ablation. The ablation front drives a compression wave inside the foil, thus leading to the formation of a shock wave, which will later reflect from the rear side of the foil, due to acoustic impedance mismatch. The reflected wave will induce an opposite motion of the foil, characterized by a very high speed, of the order of several millimeters per microsecond. Micro-particles, which are deposited on the rear side of the foil, thus get accelerated and ejected as micro-projectiles and are able to penetrate several hundreds of micrometers inside tissue-like material. These processes have been observed experimentally by using high-speed shadowgraphy and considered analytically.

• Journal of Korean Orthopaedic Sports Medicine
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• v.10 no.1
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• pp.27-34
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• 2011

Purpose: To evaluate the short term clinical result of ACL reconstruction with autologous hamstring tendon using Cross pin and Graft Tensioner and to seek way to resolve the experienced technical problems. Materials and Methods: From January 2008 to March 2009, 35 patients who had been treated arthroscopic ACL reconstruction were enrolled. The femoral side of ACL graft was fixed with Cross pin. The tibial side of graft was fixed with Intrafix and post-tie. The graft was tensioned with Graft Tensioner at 80N. We analyzed the clinical, radiographic results and complications. Results: IKDC subjective score and Lysholm score improved to 89.1 and 91.4 points. Also, Pivot shift test and One-leg hop test showed good results postoperatively. Side to side difference using KT-1000 arthrometer and Telos stress radiography improved compared with normal limb to $2.8{\pm}1.6$ mm and $2.6{\pm}1.3$ mm, respectively. The femoral tunnel enlarged to $2.3{\pm}1.1$ mm. Soft tissue irritation and femoral tunnel-graft harness length mismatch, femoral tunnel-cross pin tunnel mismatch were happened as peri-operative complications. Conclusion: Using of Cross pin and Graft Tensioner for ACL reconstruction with hamstring tendon is one of the good method for obtaining stability in short-term clinical result. But to reduce femoral tunnel-cross pin mismatch, it needs to shorten femoral bone tunnel and to create cross pin tunnel as vertical as possible. And to reduce femoral tunnel-graft harness mismatch, it needs to advance position rod further 3 mm when to create femoral tunnel.