• Proceedings of the KIPE Conference
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• 2012.11a
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• pp.103-104
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• 2012

In the AC module system, mismatch problem between AC power and constant input power is occurred. To solve this problem, electrolytic capacitor is utilized for diminishing power pulsation in PV side. However, it has disadvantages of low life span and weak in temperature. Decoupling method has been studied to reduce the capacitance and replaces electrolytic capacitor to film capacitor. This paper proposes design method for decoupling circuit which bidirectional DC-DC converter using soft switching. Proposed system is verified by design optimization and simulation results.

• Journal of information and communication convergence engineering
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• v.13 no.3
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• pp.189-196
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• 2015

In this paper, we present a rotating auto-zeroing offset cancellation technique, which can improve the performance of touch screen sensing circuits. Our target touch screen detection method employs multiple continuous sine waves to achieve a high speed for large touch screens. While conventional auto-zeroing schemes cannot handle such continuous signals properly, the proposed scheme does not suffer from switching noise and provides effective offset cancellation for continuous signals. Experimental results show that the proposed technique improves the signal-to-noise ratio by 14 dB compared to a conventional offset cancellation scheme. For the realistic simulation results, we used Cadence SPECTRE with an accurate TSP model and noise source. We also applied an asymmetric device size (10% MOS size mismatch) to the OP Amp design in order to measure the effectiveness of offset cancellation. We implemented the proposed circuit as part of a touch screen controller system-on-chip by using a Magnachip/SK Hynix 0.18-µm complementary metal-oxide semiconductor (CMOS) process.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.10a
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• pp.167-170
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• 2003

In this paper, the electromechanical displacements of curved actuators using laminated composites are calculated by finite element method to design the optimal configuration of curved actuators. To predict the pre-stress in the device due to the mismatch in coefficients of thermal expansion, the carbon-epoxy and glass- epoxy as well as PZT ceramic is also numerically modeled by using hexahedral solid elements. Because the modeling of these thin layers causes the numbers of degree of freedom to increase, large-scale structural analyses are performed in a cluster system in this study. The curved shape and pre-stress in the actuator are obtained by the cured curvature analysis. The displacement under the piezoelectric force by an applied voltage is also calculated to compare the performance of curved actuator. The thickness of composite is chosen as design factor.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.04a
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• pp.87-90
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• 2003

In this paper, the electromechanical displacements of curved actuators such as THUNDER are calculated by finite element method to design the optimal configuration of curved actuators. To predict the pre-stress in the device due to the mismatch in coefficients of thermal expansion, the adhesive as well as metal and PZT ceramic is also numerically modeled by using hexahedral solid elements. Because the modeling of these thin layers causes the numbers of degree of freedom to increase, large-scale structural analyses are performed in a cluster system in this study. The curved shape and pre-stress in the actuator are obtained by the cured curvature analysis. The displacement under the piezoelectric force by an applied voltage is also calculated to compare the performance of curved actuator. The thickness of metal and adhesive, the number of metal layer are chosen as design factors.

• Proceedings of the Korean Society of Broadcast Engineers Conference
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• 2009.01a
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• pp.1-6
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• 2009

Due to the different camera properties of the multi-view camera system, the color properties of captured images can be inconsistent. This inconsistency makes post-processing such as depth estimation, view synthesis and compression difficult. In this paper, the method to correct the different color properties of multi-view images is proposed. We utilize a gray gradient bar on a display device to extract the color sensitivity property of the camera and calculate a look-up table based on the sensitivity property. The colors in the target image are converted by mapping technique referring to the look-up table. Proposed algorithm shows the good subjective results and reduces the mean absolute error among the color values of multi-view images by 72% on average in experimental results.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1407-1412
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• 2003

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temparature change is investigated using high-sensitivity $Moir{\acute{e}}$ interferometry. Using the real-time $Moir{\acute{e}}$ setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compond and the PCB.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.14-14
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• 2011

Graphene is known to possess excellent thermal properties, including high thermal conductivity, that make it a prime candidate material for heat management in ultra large scale integrated circuits. For device applications, the key parameters are the thermal expansion coefficient and the thermal conductivity. There has been no reliable experimental determination on the thermal expansion coefficient of graphene whereas the estimates of the thermal conductivity vary widely. In this work, we estimate the thermal expansion coefficient of graphene on silicon dioxide by measuring the temperature dependence of the Raman spectrum. The shift of the Raman peaks due to heating or cooling results from both the intrinsic temperature dependence of the Raman spectrum of graphene and the strain on the graphene film due to the thermal expansion mismatch with silicon dioxide. By carefully comparing the experimental data against theoretical calculations, it is possible to determine the thermal expansion coefficient. The thermal conductivity is measured by estimating the thermal profile of a graphene film suspended over a circular hole of the substrate.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.12
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• pp.88-96
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• 2015

This paper describes a new method for enhancing the accuracy of network analysis applications in energy management systems. Topology processing, state estimation, power flow analysis, and contingency analysis play a key factor in the stable and reliable operation of power systems. In this respect, the aim of topology processing is to provide the electrical buses and the electrical islands with the actual state of the power system as input data. The results of topology processing is used to input of other applications. New method, which includes the topology error analysis based on inconsistency check, coherency check, bus mismatch check, and outaged device check is proposed to enhance the accuracy of network analysis. The proposed methodology is conducted by energy management systems and the Korean power systems have been utilized for the test systems.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.11b
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• pp.1376-1383
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• 2001

Modem technology depends on the reliability of extremely high technology equipments. In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a sub-micrometer. This equipment requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga and tera class semiconductor wafers. This high technology equipments require very strict environmental vibration standard, vibration criteria, in proportion to the accuracy of the manufacturing, inspecting devices. The vibration criteria of high sensitive equipment should be represented in the form of 'exactness' and 'accuracy', because this is used as basic data for the design of building structure and structural dynamics of equipment. This paper deals with the properties of time and frequency domain in order to obtain more improved vibration criteria for high sensitive equipment.