• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.09a
• /
• pp.233-241
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.09a
• /
• pp.211-219
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of Technology Innovation
• /
• v.13 no.1
• /
• pp.213-246
• /
• 2005

Despite of the impressive progress made in the Evolutionary techno-economics during the last two decades, there have been very little, if not at all, theoretical advancement in explaining an endogenous mechanism of transforming a technological paradigm within self-perpetuatingstructural dynamics. The question poorly attempted was raised by Schumpeter a century ago in his effort to overcome the well-known 'Walras' trap'. Although there have been increasing number of researchers recently tackling the issue quite seriously from within the Evolutionary school, I see it that radical reconstruction of the basic principle of Evolutionary research framework is urgently needed to solve the century long fundamental question, from evolutionary approach to transformational approach. In the paper, I will show the theoretical feasibility of explaining an endogenous mechanism of paradigm transformation, relying upon the concept of localized dynamics and the concept of morphogenetic structuration. It should be emphasized that there must be aendogenous process of deepening structural Instability generated in the process of economic coordination to secure efficient circular flow. The concept of development bottleneck initiated by the Baumol's cost disease could be regarded as one of the important source of such mechanism. Unfortunately, however, it is a brief conceptual description presented in the paper rather than a comprehensive analytical model, due to the space limitation imposed.

• The Journal of Information Systems
• /
• v.14 no.3
• /
• pp.1-8
• /
• 2005

This paper formally defines a role-driven security and access control model of a business process in order eventually to provide a theoretical basis for realizing the secured business process management systems. That is, we propose a graphical representation and formal description of the mechanism that generates a set of role-driven security and access control models from a business process modeled by the information control net(ICN) modeling methodology that is a typical business process modeling approach for defining and specifying business processes. Based upon the mechanism, we are able to design and accomplish a secured business process management system that provides an unified resource access control mechanism of the business process management engine domain's and the application domain's. Finally, we strongly believe that the secured access control policies from the role-driven security and access control model can be easily transformed into the RBAC(Role-based Access Control) model that is a standardized security technology for computer and communications systems of commercial and civilian government organizations.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2006.05a
• /
• pp.741-744
• /
• 2006

There are a lot of on-going researches on various security technologies for guaranteeing the safety of home network systems. Until now, a few security technologies such as device authentication mechanism, user authentication mechanism, access control mechanism and firewall are generally deployed, and they are just simple. However, we need some representation skills in order to efficiently define the home network and describe the security for managing and performing these security mechanisms. So, in this paper, we define the xHDL language to define and describe the security components of home network and analyze the semantics of each components.

• Proceedings of the Korean Geotechical Society Conference
• /
• 1998.05a
• /
• pp.83-114
• /
• 1998

The most widely accepted method for understanding the deformation mechanism of rock is from the use of computer simulation. However, if the changes in rock properties after excavation are significant this will prevent the computer simulation kent predicting the deformation with acceptable accuracy. If the deformations are, however, carefully measured in situ, the resulting data can be more useful far predicting the deformational behavior of underground openings, since the effect of the parameters which influence the deformational behavior are included in the measurement. In this study, extensive data analyses were carried out using the deformation measurements from the Waste Isolation Pilot Plant (WIPP), which is a permanent nuclear waste repository The results from computer simulations were compared with field measurements to evaluate the assumptions used in the computer simulations, For better description of the deformational behavior around underground excavations, several techniques were developed, namely: (a) the calculation of the zero strain boundary; (b) the evaluation of the influence of adjacent excavations on the deformational behavior of pre-excavated openings; (c) the description of the deformational behavior using in situ measurements; (d) the calculation of the shear stress distribution; and (e) the application of a Neural Network for the prediction of opening deformation.

• The Journal of Society for e-Business Studies
• /
• v.8 no.4
• /
• pp.53-68
• /
• 2003

Currently, it is possible to buy almost anything from books(Amazon.com) to airplane tickets(Travelocity.com) using the world wide web. The purpose of this research is to develop a "clean interface" between design and fabrication facilities for the production of custom machined parts through Internet. The current mechanism for production of prototype parts that can be fabricated using standard machine tools like milling machines, requires a process of part description preparation, bidding, contract award, and finally fabrication and delivery of the part. This is a substantially more complex process than buying a book or airplane ticket. In this paper, we try to define the ambiguous part description using XML based data exchange format and to enable e-commerce in this field. The research accomplishments are summarized: 1. Creation of a new format for data exchange of machined prototype parts, 2. Development of a prototype system to illustrate how the XML data can be effectively used to conduct e-Commerce for custom machined parts, 3. Testing of the methodology with a number of parts.

• The KIPS Transactions:PartC
• /
• v.18C no.4
• /
• pp.255-264
• /
• 2011

TV-Anytime is an XML-based standard for description of PVR and digital broadcast services. It is referenced by many standards of digital broadcast service for their schemas and delivery protocols of contents guide. Although its readability and extensibility, TV-Anytime has a big problem which generates massive documents due to its text-based description method. Therefore, various encoding algorithms have been proposed to reduce the size of XML documents. This paper proposes efficient metadata encapsulation architecture based on the optimization information generated at server-side to minimize XML documents. Advanced indexing method is also proposed to reduce resources needed to encapsulate indices and to receive metadata with fast and explicit mechanism.

• KSII Transactions on Internet and Information Systems (TIIS)
• /
• v.16 no.5
• /
• pp.1489-1515
• /
• 2022

The number of interconnected real-world devices such as sensors, actuators, and physical devices has increased with the advancement of technology. Due to this advancement, users face difficulties searching for the location of these devices, and the central issue is the findability of Things. In the WoT environment, keyword-based and geospatial searching approaches are used to locate these devices anywhere and on the web interface. A few static methods of indexing and ranking are discussed in the literature, but they are not suitable for finding devices dynamically. The authors have proposed a mechanism for dynamic and efficient searching of the devices in this paper. Indexing and ranking approaches can improve dynamic searching in different ways. The present paper has focused on indexing for improving dynamic searching and has indexed the Things Description in Solr. This paper presents the Things Description according to the model of W3C JSON-LD along with the open-access APIs. Search efficiency can be analyzed with query response timings, and the accuracy of response timings is critical for search results. Therefore, in this paper, the authors have evaluated their approach by analyzing the search query response timings and the accuracy of their search results. This study utilized different indexing approaches such as key-words-based, spatial, and hybrid. Results indicate that response time and accuracy are better with the hybrid approach than with keyword-based and spatial indexing approaches.

• Journal of KIISE:Computing Practices and Letters
• /
• v.10 no.3
• /
• pp.282-291
• /
• 2004

There has been many researches in TopicMap and RDF which are approach to handle data efficiently with metadata. However, No researches has been performed to service and implement except for presentation and description. In this paper, We suggest the caching mechanism to support an efficient access of knowledgemap and practical knowledgemap service with implementation of TopicMap system. First, We propose a method to navigate Knowledgemap efficiently that includes advantage of former methods. Then, To transmit TopicMap efficiently, We suggest caching mechanism for knowledgemap. This method is that user will be able to navigate knowledgemap efficiently in the viewpoint of human, not application. Therefor the mechanism doesn't cash topics by logical or physical locality but clustering by information and characteristic value of TopicMap. Lastly, we suggest replace mechanism by using graph structure of TopicMap for efficiency of transmission.