• Proceedings of the Korean Geotechical Society Conference
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• 2002.10a
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• pp.621-628
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• 2002

Compaction Grouting Pack (CGP) Anchor which is composite anchor of bearing plus friction-type was chosen and executed for the open-cuts in soft ground. This paper presents an analysis of data from tests on composite-anchor by jacking force. The properties of composite-anchor was presented to be as follows , the maximum plastic displacement was 60 mm in abandoned coal fill deposit, the shear stress($\tau$) is expressed as $\tau$ = (equation omitted) kg/$\textrm{cm}^2$ in clayey silt.

• Proceedings of the Korean Geotechical Society Conference
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• 2004.03b
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• pp.227-234
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• 2004

Sand compaction pile (SCP) method is composed of compacted sand pile inserted into the soft clay deposit by displacement method. SCP-reinforced ground is composite soil which consists of the SCP and the surrounding soft soil. When a surcharge load is applied on composite ground, time-dependent behavior occurs in the soft soil due to consolidation according to radial flow toward SCP and stress transfer also takes place between the SCP and the soft soil. This paper presents the numerical results of cylindrical composite ground that was conducted to investigate consolidation characteristics and the stress transfer mechanism of SCP-reinforced composite ground. The results show that the consolidation of soft clay has a significant effect on the stress transfer mechanism and stress concentration ratio of composite ground

• KSCE Journal of Civil and Environmental Engineering Research
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• v.34 no.4
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• pp.1181-1190
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• 2014

In this study, the erosional parameters for deposit beds were quantitatively estimated domestically for the first time through the erosion tests using an annular flume. Four erosion tests were carried out for the deposit beds with different consolidation structures, which were obtained by consolidating the kaolinite slurries for a given time durations. Results of erosion tests showed that the bed shear strength ${\tau}_s$ increased with the consolidation time and bed depth. The erosion rate ${\epsilon}$ was also shown to be related well with the excess shear stress ${\tau}_b-{\tau}_s$ which was given by the difference between flow shear stress ${\tau}_b$ and bed shear strength ${\tau}_s$. While the logarithm of the erosion rate was linearly related with the excess shear stress as ${\tau}_b-{\tau}_s{\geq}0.1N/m^2$, however, the erosion rate decreased rapidly with it when ${\tau}_b-{\tau}_s{\leq}0.1N/m^2$. These erosion test results were also shown to be good enough to verify by comparing with the test results from previous studies and a new equation was suggested to describe the erosion rate more well in the region of ${\tau}_b-{\tau}_s{\leq}0.1N/m^2$.

• Proceedings of the KIPE Conference
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• 2000.07a
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• pp.685-688
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• 2000

Pulse plating is about to deposit material at high current density compared to conventional DC plating. For example pulse plating can get more fine grain can improve adhension and metal distribution and current efficiency can reduce internal stress and crack. therefore we studied pulsed power supply which has high current density and improve deposition quality and increase plating speed in this paper.

• Korean Journal of Materials Research
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• v.22 no.1
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• pp.8-15
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• 2012

Silicon-based thin film was prepared at room temperature by an electrochemical deposition method and a feasibility study was conducted for its use as an anode material in a rechargeable lithium battery. The growth of the electrodeposits was mainly concentrated on the surface defects of the Cu substrate while that growth was trivial on the defect-free surface region. Intentional formation of random defects on the substrate by chemical etching led to uniform formation of deposits throughout the surface. The morphology of the electrodeposits reflected first the roughened surface of the substrate, but it became flattened as the deposition time increased, due primarily to the concentration of reduction current on the convex region of the deposits. The electrodeposits proved to be amorphous and to contain chlorine and carbon, together with silicon, indicating that the electrolyte is captured in the deposits during the fabrication process. The silicon in the deposits readily reacted with lithium, but thick deposits resulted in significant reaction overvoltage. The charge efficiency of oxidation (lithiation) to reduction (delithiation) was higher in the relatively thick deposit. This abnormal behavior needs to clarified in view of the thickness dependence of the internal residual stress and the relaxation tendency of the reaction-induced stress due to the porous structure of the deposits and the deposit components other than silicon.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.395-398
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• 2000

Reactive radio frequency (RF)magnetron sputter with incident angle has been used to deposit AlN thin film on a crystalline Si substrate. (002)Preferred orientation of AlN thin film has been obtained at low sputtering pressure. Also it has been shown that depostion rate of AIN thin film is affected by fraction Ar and $N_2$ partial pressure. But substrate temperature didn't affect depostion rate of AIN thin film . As sputtering pressure increased preferred orientation degraded. The internal stress changed from tensile stress to compressive stress as fraction of $N_2$ partial pressure increased. At low nitrogen partial pressure cermet$^{[1]}$ AIN thin film is obtained.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.56-56
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• 2001

Ni-W alloy deposit is one of the best alternatives to hard chromium plating because of its good mechanical properties (high hardness, high strength, and good wear resistance). Ni-W alloy is deposited from weakly acidic or alkaline electrolytic bath with nickel sulfate, sodium tungstate or APT, and some kinds of organic hydroxy-acid complex and ammonia salts. W content of the deposit can be changed from 0 to 5Owt% and the coating with high W content is more attracted. But, meanwhile, the deposited layers are always found high internal stress, which cause them to become brittle and to bond insufficiently with the substrate. On the second hand, as the W content is incresed, the current efficiency reduced, which results in large quantities of hydrogen evolution and then produces bubbles on surface and pitting appearance In this paper, the influence of some additives on Ni-W alloy electroplating was investigated by means of compositional analysis and SEM. The initial results showed that 2-butyne-1,4-diol was the best brightener for Ni-W plating process. It could brighten and level deposit, but decreased the cathodic current efficiency. Its optimum concentration range is from O.lgjL to 0.5gjL. Besides, three kinds of additives including 2-butyne-1,4-diol were examined with Dagguchi method.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.1-6
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• 2013

In carrying out the elastic-plastic analysis, four conditions (equilibrium equation, constitutive equation, condition of compatibility and yield condition) should be satisfied. In welding, the temperature largely changed from a melting temperature to a room temperature. So, yield stress of materials largely changed, too. In particular, yield stress becomes about zero over $700^{\circ}C$. The analysis should be carried out under the condition that equivalent stress generated in temperature increment ${\Delta}T$ did not exceed yield stress of materials at high temperature over $700^{\circ}C$. It should be sufficiently recognized that the obtained results were not reliable if this condition was not satisfied.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.209-211
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• 2005

Super duplex stainless steels have been used for offshore oil and gas piping systems which are subject to corrosion atmosphere, because they have excellent resistance to Stress Corrosion Cracking (SCC) and Pitting corrosion and high strength/weight ratio. Normally, the welding for duplex stainless steels has been peformed using GTAW with Ar shielding gas. However, in case of using Ar as shielding gas, the corrosion resistance at root weld metal will be deteriorated due to loss of nitrogen from weld deposit during welding. It is wellknown that the corrosion resistance of super duplex stainless can be restored by addition of nitrogen as shielding gas. In this study, we made super duplex welding with using several kinds of shielding and purging gases and investigated the relationship between shielding gas and corrosion resistance. Consequently, it was shown that corrosion resistance of weld deposit can be restored by addition of $N_{2}$ as shielding gas.

• Proceedings of the KSR Conference
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• 2001.05a
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• pp.416-423
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• 2001

The object of this study is to determine the application of friction and ground stress type CGP(Compaction Grouting Pack)-anchor in retaining wall construction on the soft ground by executing in the fill deposit with abandoned coal. In this study the effect of CGP-anchors as retaining wall anchor on the soft ground anchor was evaluated through measuring displacement according to tensile strength by acting tensile strength after equipping CGP-anchors. From the field tests results, CGP-anchor was determined to be considerably effective as retaining wall anchor on the soft ground by showing that the maximum displacement was 60mm and the elastic displacement was within 50mm by 53ton tensile strength.