• Journal of Electrochemical Science and Technology
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• v.14 no.2
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• pp.194-204
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• 2023

Models based on diffusion-limited aggregation (DLA) have been extensively used to explore the mechanisms of dendritic particle aggregation phenomena. The physical and chemical properties of systems in which DLA aggregates emerge are given in their fractal. In this paper, we present a comprehensive study of the growth of electrodeposited copper dendrites in flat plate electrochemical cells from a fractal perspective. The effects of growth time, applied voltage, copper ion concentration, and electrolyte acidity on the morphology and fractal dimension of deposited copper were examined. 'Phase diagram' set out the variety of electrodeposited copper fractal morphology analysed by metallographic microscopy. The box counting method confirms that the electrodeposited dendritic structures manifestly exhibit fractal character. It was found that with the increase of the voltage and copper ion concentration. The fractal copper size becomes larger and its morphology shifts towards a dendritic structure, with the fractal dimension fluctuating around 1.60-1.70. In addition, the morphology of the deposited copper is significantly affected by the acidity of the electrolyte. The increase in acidity from 0.01 to 1.00 mol/L intensifies the hydrogen precipitation side reactions and the overflow path of hydrogen bubbles affects the fractal growth of copper dendrites.

• Steel and Composite Structures
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• v.15 no.2
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• pp.151-162
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• 2013

In this study, an electrolyzing device for the production of metal powders was designed and fabricated. The production of copper powders was performed using a variety of current densities, anode-cathode distances and power removal times. The effect of these parameters on powder particle size and shape was determined. Particle size was measured using a laser diffraction unit while the powder shape was determined by SEM. Experimental results show that an increase in current density leads to a decrease in powder particle size. In addition particle shape changed from globular dendritic to acicular dendritic with increasing the current density. Distance between the cathode and anode also showed a similar influence on powder particle size and shape. An increase in time of powder removal led to an increase in powder particle size, as the shape changed from acicular dendritic to globular dendritic.

• Journal of Korea Foundry Society
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• v.6 no.1
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• pp.12-19
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• 1986

This study was undertaken to understand the formation mechanism of the hard spots in high strength brass. To investigate the behavior of the hard spots in the isothermal liquid state with varying silicon content, the rapidly quenched specimens were obtained by suctioning the melt into the silica tube and water quenching. To examine the growth process of the hard spots with holding time, the unidirectional solidification technique was used. The results of this study are summarized as follows: 1) With the addition of Fe in order to get the effects of grain refinement in high strength brass, the two different type of Fe-rich phases are occurred, which are defined as dendritic and globular phase. The chemical composition of the globular phase was different from that of the dendritic phase in that the globular phase contained Si. 2) With increasing Si content, the Fe-rich phase had a tendency to form globular phase. 3) As the holding time increased in the liquid state, globular was also prone to coalesce. The further growth of globular phase to large size was due to reducing the interfacial energy. 4) The primary phase of copper alloy was nucleated preferentially on the dendritic phase. It was noticeable that the dendritic phase acted as a grain refiner. However, the agglomerate (hard spots) which was composed of the globular phase decreased the mechanical properties of high strength brass. 5) Once the hard spots formed in the high strength brass casting, it was very difficult to remove them. This is due to the fact that their meting temperature is higher than the pouring temperature of high strength brass.

• Bulletin of the Korean Chemical Society
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• v.28 no.10
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• pp.1777-1780
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• 2007

The synthesis of well-defined dendrons based on aliphatic polyether dendritic cores and glassy polystyrene peripheries is described. The synthetic route involves a combination of living anionic polymerization and a stepwise convergent method consisting of iterative Williamson etherification and hydroboration/oxidation reactions. On the basis of molecular weight, as characterized by gel permeation chromatography (GPC), the first generation dendron (Generation-1) shows a random coil conformation like a linear polystyrene, while higher generations (Generation-2 and 3) reveal globular forms in solution.

• Applied Chemistry for Engineering
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• v.8 no.2
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• pp.161-171
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• 1997

Anodic regeneration of PCB enchant and cathodic deposition of copper using electrochemical method has been studied. Cu(I)/Cu(II) concentration ratio as a function of Cu(I) oxidation at the anode was measured from the potential difference between platinum and Ag/AgCl/4M KCl electrodes. Chlorine gas evolution was minimized by maintaining Cu(I) concentration above a specific concentration and using non-porous graphite electrode. Dendritic copper deposition was observed at the cathode and the optimum conditions for Cu deposition was identified as the current density of $360mA/cm^2$, and copper concentration of 12 g/l. Titanium was the most effective cathode material which showed a higher current efficiency and copper recovery. The current efficiency decreased with increasing temperature, but the highest power efficiency was achieved at $50^{\circ}C$.

• Journal of Surface Science and Engineering
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• v.49 no.5
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• pp.416-422
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• 2016

We have investigated the effects of applied potential, deposition time and electrolyte types on shapes and physical properties of Cu dendrites by potentiostatic electrodeposition. Finer shape of dendrites was observed at less cathodic potential by 100mV than at the limiting current, due to 'effective overpotential'. The shape of copper dendrite is related to the deposition time, too. The dendrite depositing for 10 min showed the finest shape. The finer dendrite has the less apparent density and the larger specific surface area. Dendrite from chloride solution has the lowest density and the largest surface area among three plating solutions, sulfate, chloride and pyrophosphate.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.29-33
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• 2011

The current density in copper electroplating is directly related with the productivity and then to increase the productivity, the increase in current density is required. To obtain the high mass flow rate, rotating disk electrode(RDE) was employed. High rotational speed in RDE can increase the mass flow rate and then high speed electroplating was possible using RDE to control mass flow. Two types of cathode were used. One is RDE and another is rotating cylindrical electrode(RCE). A constant-current, constant-voltage and linear sweep voltammetry were applied to investigate current and voltage relationship. The maximum current density without evolution of hydrogen gas was increased with rotational speed. Over 400 rpm, maximum current density was higher than 1000 A/$m^2$. The diffusion coefficients of copper calculated from the slope of the plots are $5.5{\times}10^6\;cm^2\;s^{-1}$ at $25^{\circ}C$ and $10.5{\times}10^6\;cm^2\;s^{-1}$ at $62^{\circ}C$. The stable voltage without evolution of hydrogen gas was -0.05 V(vs Ag/AgCl). Additives were added to prevent dendritic growth on cathode deposits. The surface roughness was analyzed with UV-Vis Spectrophotometer. The reflectance of the copper surface over 600 nm was measured and was related with the surface roughness. As the surface roughness improved, the reflectance was also increased.

• Journal of the Mineralogical Society of Korea
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• v.27 no.4
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• pp.183-195
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• 2014

In order to study the mineralogical characteristics of a cathodic deposition-metallic powder, electrowinning experiments were carrier out on different electrolytic solutions at varying electric distances and electric currents. Under the same experimental conditions, Cu recovery was obtained much more effectively using a sodium chloride electrolyte than with a sulfuric acid electrolyte. In XRD analysis, copper ($Cu^0$), chalcanthite and cuprite were identified in the sulfuric acid electrolyte, while copper, nantokite and chalcanthite were observed in the sodium chloride electrolyte. In the sodium chloride electrolyte solution, increasing the electric distance and the electric current increased the Cu recovery rate, anode weight and anodic corrosion. The results of XRD analysis with non-pulverized cathodic deposition-metallic powder showed the average copper crystallite size was increased by increasing the electric current and decreasing the electric distance. It is suggested that the mass transfer was controlled with diffusion on the boundary between the electrode and the electrolytic solution due to the formation of dendrite copper.

• Polymer(Korea)
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• v.27 no.4
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• pp.275-284
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• 2003

The positive temperature coefficient (PTC) effects of high density polyethylene (HDPE)/carbon black composite materials were investigated by enhancing adhesive characteristics of electrodes and controlling HDPE chemical crosslinking. When the silver paste was used as an electrode for the same 45 wt% HDPE/carbon composites, the resistance was over 1 $\Omega$, which should be compared with the resistance of 0.2 $\Omega$ for the dendritic copper electrode. In general, the silver-paste electrode exhibited higher electrical resistance than cupper electrode due to the interfacial resistance between the electrode and PTC composites. The HDPE/carbon composite exhibited typical PTC characteristics maintaining a constant resistance up to vicat point and showing a maximum at the melting point of HDPE. The crosslinked HDPE significantly decreased the negative temperature coefficient (NTC) phenomena, and desirably showed a constant or slightly increasing feature of electrical resistance in the high temperature region.

• Journal of Auto-vehicle Safety Association
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• v.13 no.2
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• pp.30-34
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• 2021

Electrical failures and reliability problems of electronic components by ionic migration between adjacent device terminals have become an issue in automotive electronics. Especially unlike galvanic corrosion, ionic migration is occurred at high temperature and high humidity under applied electric field condition. Until now, although extensive studies of the ionic migrations dealing with PCBs, electrodes, and solders were reported, there is no study on the effect of insulation polymers and metallic fillers for ionic migration. In this research, therefore, ionic migration induced by the types and contents of polymers and metallic fillers, and variety conditions of temperature, humidity, and applied voltage was studied in detail. Ester and amide types of liquid crystal polymer (LCP) and poly (phthalamide) (PPA) were used as base polymers, respectively and compounded with the metallic fillers of Copper iodide (CuI), Zinc stearate (Zn-st), or Calcium stearate (Ca-st) in various compositions. The compounding polymers were fabricated in IPC-B-24 of SIR test coupon according to ISO 9455-17 with Cu electrodes for ionic migration test. While there is no change in LCP-based samples, ionic migration in PPA compounding sample with a high water absorption property was accelerated in the presence of 0.25 wt% or above of CuI at the environmental conditions of 85℃, 85% RH and 48V. The dendritic short-circuit growth of Cu caused by ionic migration between the electrodes on the surface of compounded polymers was systematically observed and analyzed by using optical microscopy and SEM (EDX).