• Journal of the Korean housing association
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• v.26 no.1
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• pp.1-10
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• 2015

In line with the recent public concern on the environmental issues in building industry, there has been a rise in demand for a healthy, sustainable housing environment in South Korea. In order to achieve a healthy environment in residential buildings, considerable efforts have been made in a wide range of sectors. Among others, the development of the certification schemes to promote environment-friendly planning and building construction is remarkable. In urban South Korea, recently built houses tend to be significantly high-rise, high-density buildings. Global warming has brought about drastic climate change and continued to increase the average annual temperature year by year. These changes should be well reflected on the government's implementation of the building environmental assessment system. For guidance, therefore, this study looks to the case of Hong Kong which is well known for high-density housing development and subtropical climate conditions. It compares the features of the green building certification schemes for newly developed multifamily housing in two regions, namely HK-BEAM in Hong Kong and G-SEED in South Korea. Based on the findings, it argues that the G-SEED implementor should have expanded roles in providing training programs and follow-up services in collaboration with the certification authorities. It is also argued that G-SEED professionals should be involved in the early stages of design processes, and training programs and licence systems to produce green building professionals should be developed. Finally, it points out that the assessment indicators should be more detailed and diversified.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.40 no.1
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• pp.39-44
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• 2003

As the portable electronic equipments are developed and popularized, the batteies are more important. To prolong life of the equipments, engineers demand to have batteries of high-power density and they are used to use Li-ion batteries popularly Li-ion batteries are better than conventional batteries, Ni-cd, about power density per volume and weight, but they have a fault that discharge voltage of them goes down. In order to maximize life of the Li-ion batterries, we have to use a converter which is suitable for the characteristic of Li-ion batteries. Therefore, capacitive idling SEPIC(Single Ended Primary Inductance Converter) that is derived from the SEPIC topology is proposed as a source of the Portable low-power applications. The converter has characteristics of buck-boost porformance. Besides, that makes it possible to increase the switching frequency by partial soft commutation of power switches through adding a diode and a switch. This paper is presented the characteristics, DC voltage conversion ratio, circuits of operation modes, of the converter and it is analized and implemented.

• Earthquakes and Structures
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• v.17 no.6
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• pp.557-566
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• 2019

The evaluation of the seismic hazard for a given site is to estimate the seismic ground motion at the surface. This is the result of the combination of the action of the seismic source, which generates seismic waves, the propagation of these waves between the source and the site, and site local conditions. The aim of this work is to evaluate the sensitivity of dynamic response of extended structures to spatial variable ground motions (SVGM). All factors of spatial variability of ground motion are considered, especially local site effect. In this paper, a method is presented to simulate spatially varying earthquake ground motions. The scheme for generating spatially varying ground motions is established for spatial locations on the ground surface with varying site conditions. In this proposed method, two steps are necessary. Firstly, the base rock motions are assumed to have the same intensity and are modelled with a filtered Tajimi-Kanai power spectral density function. An empirical coherency loss model is used to define spatial variable seismic ground motions at the base rock. In the second step, power spectral density function of ground motion on surface is derived by considering site amplification effect based on the one dimensional seismic wave propagation theory. Several dynamics analysis of a curved viaduct to various cases of spatially varying seismic ground motions are performed. For comparison, responses to uniform ground motion, to spatial ground motions without considering local site effect, to spatial ground motions with considering coherency loss, phase delay and local site effects are also calculated. The results showed that the generated seismic signals are strongly conditioned by the local site effect. In the same sense, the dynamic response of the viaduct is very sensitive of the variation of local geological conditions of the site. The effect of neglecting local site effect in dynamic analysis gives rise to a significant underestimation of the seismic demand of the structure.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Journal of Broadcast Engineering
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• v.25 no.5
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• pp.709-722
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• 2020

Point Cloud which is a cluster of numerous points can express 3D object beyond the 2D plane. Each point contains 3D coordinate and color data basically, reflectance or etc. additionally. Point Cloud demand research and development much higher effective compression technology. Video-based Point Cloud Compression (V-PCC) technology in development and standardization based on the established video codec. Despite its high effective compression technology, point cloud service will be limited by terminal spec and network conditions. 2D video had the same problems. To remedy this kind of problem, 2D video is using Scalable High efficiency Video Coding (SHVC), Dynamic Adaptive Streaming over HTTP (DASH) or diverse technology. This paper proposed a density scalability method using SHVC codec in V-PCC.

• Korean Journal of Materials Research
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• v.30 no.10
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• pp.522-532
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• 2020

Conductive polymer composites with high electrical and mechanical properties are in demand for bipolar plates of phosphoric acid fuel cells (PAFC). In this study, composites based on natural graphite/fluorinated ethylene propylene (FEP) and different ratios of carbon black are mixed and hot formed into bars. The overall content of natural graphite is replaced by carbon black (0.2 wt% to 3.0 wt%). It is found that the addition of carbon black reduces electrical resistivity and density. The density of composite materials added with carbon black 3.0 wt% is 2.168 g/㎤, which is 0.017 g/㎤ less than that of non-additive composites. In-plane electrical resistivity is 7.68 μΩm and through-plane electrical resistivity is 27.66 μΩm. Compared with non-additive composites, in-plane electrical resistivity decreases by 95.7 % and through-plane decreases by 95.9 %. Also, the bending strength is about 30 % improved when carbon black is added at 2.0 wt% compared to non-additive cases. The decrease of electrical resistivity of composites is estimated to stem from the carbon black, which is a conductive material located between melted FEP and acts a path for electrons; the increasing mechanical properties are estimated to result from carbon black filling up pores in the composites.

• Journal of the Korean Regional Science Association
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• v.8 no.1
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• pp.31-50
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• 1992

The aim of this paper is to define major factors influencing land development of each of major uses (residential, commercial, industrial) in the process of rapid urban expansion. The main hypothesis of this study is that land use changing patterns are directed by supply side of land managed to public policies rather than demand side. The graphic analysis is applied to relationships between urban growth and land development process of each use and between land development project managed to public policies and land development process. Public and land development projects and zonning protection seem to be major roles of land supply and main determinants of urban spatial structure. Location factors for land development of each uses are selected in 23 variables. Factor analysis is applied to test correlation between variables in 1971 and 1981. Factor structure between two years is similar, but progressive processing of functional separation is derived such as intensive land use is grouped, different location between residential and industrial use is deep. Dependent variables are standardized to logarithm of land development of each use per unit vacant land in two periods, between 1971 and 1980 year and between 1981 year. Correlation analysis between 6 dependent variables and 23 location factors in each years are applied. Major factors of each use are selected in criteria such as high correlation with dependent variables, low correlation between independent variables and common application in two periods. As the result, major factors for residential land development are Land Readjustment Project (LRP), percent of total zoned area in residential zone, residential floor space density per available area, percent of total area in industrial use; for commercial development is distance to CBD, percent of total area in commercial use, residential floor space density per available area in each year, and volumn rate of industrial use; for industrial use is percent of total area of industrial use is percent of total area of industrial use, Industrial Estate Project (IES), LRP, and distance from CBD. Land development pattern of each use between two periods are slightly different. So 6 equation is derived from appling backward method of regession. Adjusted multiple R squares of all is more than 0.5 and those equation is statistically significant and valuable to assist urban land use forecasting.

• Journal of Korean Society of Transportation
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• v.24 no.2 s.88
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• pp.31-41
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• 2006

The main purpose of this paper is to develop the practical method to estimate the congestion price in odor to overcome the difficulty of traditional microeconomics approach for demand and cost function concepts. In this paper, we estimate the theoretical congestion toll which reflecting the real traffic conditions such as a speed-density functions using a traffic engineering methods We calculates the optimal congestion toll based on the real traffic conditions assuming that the electronic road pricing (ERP) systems ave installed for the study road. After evaluating the various speed-density relationship methods. we found that the Drake model is best suited for the Gangbyeon Expressway Using the Drake model, the optimal congestion toll will be 94 to 3,255 Won for the traffic speed between 44km/h to 68 km/h based on wage rate method and 107 to 6,381 Won for the marginal substitution method for the Gangbyeon Expressway in city of Seoul, Korea.

• Journal of the Korean Society of Hazard Mitigation
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• v.8 no.3
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• pp.43-49
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• 2008

The objective of this research was to test a hypothesis that sprawl increases congestion, and so the estimated evacuation time become longer. For this, sprawl was thought to be poor accessibility so that vehicle miles of travel become longer. This research shows that the daily vehicle miles per lane mile that are thought to be an accessibility index had a strong and statistically significant relationship to the estimated evacuation time, while urban population density has no statistically significant relationship to the evacuation time. The result of this research recommends that we should consider sustainable land use patterns that decrease traffic demand by providing good accessibility.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.31-36
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• 2000

We developed embedded inductors in MCM-D substrate for RF applications. The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need fur mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. The proposed MCM-D substrate was based on Cu/photosensitive BCB multilayer and Ti/Cu is used to form the interconnect layer. Seed metal was formed with 1000 $\AA$ Ti/3000 $\AA$ Cu by sputtering method and main metal was formed with 3 $\mu\textrm{m}$ Cu by electrical plating method. The multi-turn sprial inductors were designed in coplanar fashion. This paper describe the manufacturing process of integrated inductors in MCM-D substrate and the results of electrical performance test.