• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.1
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• pp.12-21
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• 1999

All kinds of electronic machinery including portable communication system are being smaller size and are used at high frequency. It generates a lot of unwanted noise signals called electromagnetic interface (EMI). This paper presents an analysis result of EMI generation in VLSI and propose new circuits to minimize of EMI using I/O driver with parallel buffer architecture and distributed decoupling capacitor in a chip. The proposed circuits are evaluated with i8052 MCU which is shown reducing of delta current 1/3 times and improvement of EMI more 10dBuV compared with conventional processors.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.2
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• pp.142-145
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• 2018

In this paper, we present a design technique for the suppression of common-mode(CM) noise in switched-mode power supply boards using the segmentation method. By applying the segmentation method, the example structure is decomposed into two segments with decoupling capacitors and a recombination matrix is extracted for the segments. The effects of the decoupling capacitor on CM noise suppression are examined. The simulation time is significantly reduced on using the segmentation method.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.319-319
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• 2013

Even though the fabrication methods of metal oxide based thin film capacitor have been well established such as RF sputtering, Sol-gel, metal organic chemical vapor deposition (MOCVD), ion beam assisted deposition (IBAD) and pulsed laser deposition (PLD), an applicable capacitor of printed circuit board (PCB) has not realized yet by these methods. Barium Strontium Titanate (BST) and other high-k ceramic oxides are important materials used in integrated passive devices, multi-chip modules (MCM), high-density interconnect, and chip-scale packaging. Thin film multi-layer technology is strongly demanded for having high capacitance (120 nF/$mm^2$). In this study, we suggest novel multi-layer thin film capacitor design and fabrication technology utilized by plasma assisted deposition and photolithography processes. Ba0.6Sr0.4TiO3 (BST) was used for the dielectric material since it has high dielectric constant and low dielectric loss. 5-layered BST and Pt thin films with multi-layer sandwich structures were formed on Pt/Ti/$SiO_2$/Si substrate by RF-magnetron sputtering and DC-sputtering. Pt electrodes and BST layers were patterned to reveal internal electrodes by photolithography. SiO2 passivation layer was deposited by plasma-enhanced chemical vapor deposition (PE-CVD). The passivation layer plays an important role to prevent short connection between the electrodes. It was patterned to create holes for the connection between internal electrodes and external electrodes by reactive-ion etching (RIE). External contact pads were formed by Pt electrodes. The microstructure and dielectric characteristics of the capacitors were investigated by scanning electron microscopy (SEM) and impedance analyzer, respectively. In conclusion, the 0402 sized thin film multi-layer capacitors have been demonstrated, which have capacitance of 10 nF. They are expected to be used for decoupling purpose and have been fabricated with high yield.

• Proceedings of the KIPE Conference
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• 2019.07a
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• pp.207-209
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• 2019

This paper proposes a grid-tied photovoltaic (PV) system, consisting of Voltage-fed dual-active-bridge (DAB) dc-dc converter with single phase inverter. The proposed converter allows a small dc-link capacitor, so that system reliability can be improved by replacing electrolytic capacitors with film capacitors. The double line frequency free maximum power point tracking (MPPT) is also realized in the proposed converter by using Ripple Correlation method. First of all, to eliminate the double line frequency ripple which influence the reduction of DC source capacitance, control is developed. Then, a designing of Current control in DQ frame is analyzed and to fulfill the international harmonics standards such as IEEE 519 and P1547, $3^{rd}$ harmonic in the grid is directly compensated by the feedforward terms generated by the PR controller with the grid current in stationary frame to achieve desire Total Harmonic Distortion (THD). 5-kW PV converter and inverter module with a small dc-link film capacitor was built in the laboratory with the proposed control and MPPT algorithm. Experimental results are given to validate the converter performance.

• Korean Journal of Materials Research
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• v.9 no.5
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• pp.509-514
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• 1999

Interest in the integrated capacitors, which make it possible to reduce the size of and to obtain improved electrical performance of an electronic system, is expanding. In this study, $Ta_2$O\ulcorner thin film capacitors for MCM integrated capacitors were fabricated on a Upilex-S polymer film by DC magnetron reactive sputtering and the effects of low temperature annealing at various atmospheres and substrate surface morphology on the capacitor characteristics were discussed. The low temperature($150^{\circ}C$) annealing produced improved capacitor yield irrespective of the annealing at mosphere. But the leakage current of the $O_2$-annealed film was larger than that of any other films. This is presumably mosphere. But the leakage current of the $O_2$-annealed film was larger than that of any other films. This is presumably due to the change of the $Ta_2$O\ulcorner film surface by oxygen, which was explained by conduction mechanism study. Leakage current and breakdown field strength of the capacitors fabricated on the Upilex-S film were 7.27$\times$10\ulcornerA/$\textrm{cm}^2$ and 1.0 MV/cm respectively. These capacitor characteristics were inferior to those of the capacitors fabricated on the Si substrate but enough to be used for decoupling capacitors in multilayer package. Roughness Analysis of each layer by AFM demonstrated that the properties of the capacitors fabricated on the polymer film were affected by the surface morphology of the substrate. This substrate effect could be classified into two factors. One is the surface morphology of the polymer film and the other is the surface morphology of the metal bottom electrode determined by the deposition process. Therefore, the control of the two factors is important to obtain improved electrical of capacitors deposited on a polymer film.

• Proceedings of the KIEE Conference
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• 1996.07a
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• pp.501-503
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• 1996

In this paper, a novel control strategy for PWM current source converter and inverter is proposed, applying a multivariable state feedback control. The PWM converter controls line current to be sinusoidal and make input power factor unity. In addition, the modulation index control of dc link current is carried out, which produces lower loss of switching devices. Since the voltage control of inverter output filter capacitor is performed a decoupling of the d-q current of the induction motor is well retained. With the proposed algorithm, both high dynamic responses and satisfactory static performance can obtained.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1555_1556
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• 2009

전자기기에서 외부 Console로 사용되는 Touch Pad의 입력오류를 줄이기 위해서는 안정된 전원의 공급이 필요하다, 전원에서 발생하는 노이즈는 PDN(Power Delivery Network)의 임피던스에 의해서 발생하며, 이들 노이즈를 줄이기 위해서는 decoupling capacitor의 적절한 수량과 위치를 선정하여, PDN의 임피던스를 최소화해야 한다. 본 논문에서는 임피던스의 최소화를 위해서 Full-wave 시뮬레이션을 이용해서 임피던스 특성을 분석하고, VNA(Vector Network Analyzer)를 이용하여 주파수에 대한 PDN 임피던스를 측정하고, Touch Pad 구동용 지그를 이용해서 Time Domain에서의 임피던스 저감에 따른 노이즈 특성을 분석 비교하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.322-322
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• 2008

Low-temperature co-fired ceramics (LTCC) have turned out to be very promising technology in accordance with the rapid developments in semiconductor technology. The demands for compact electrical assemblies, smaller power loss as well as high signal density can be fulfilled by LTCC. And for the multi-layered ceramic devices with embedded passive components such as high dielectric constant decoupling capacitor, LTCC materials require the several conditions to avoid delamination and internal cracks. For the present study, diopside-based glass is chosen as the LTCC substrate material in view of its high coefficient of thermal expansion (CTE). From the experimental resultsn the influence of each element on the CTE change can be revealed.

• Proceedings of the KIPE Conference
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• 2019.11a
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• pp.152-153
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• 2019

본 논문에서는 캐패시터-분할 타입 능동전력 디커플링 회로를 위한 전압제어 방법을 제안한다. 능동전력 디커플링 회로는 시스템에 필요한 커패시턴스를 낮추어 전해커패시터를 필름 커패시터로 대체하여 시스템 수명과 전력밀도를 높일 수 있는 장점이 있다. 그러나 일반적으로 오픈 루프 제어방식의 전압제어 방식을 사용하여 파라미터 값의 변화에 민감하다는 단점을 가지고 있다. 이에 본 논문에서는 커패시터-분할 타입 능동전력 디커플링 회로를 위한 폐루프 제어 방법을 제안한다.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.2
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• pp.114-126
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• 2013

In this paper, we present a set of methodologies to model the electromagnetic susceptibility (EMS) testing of I/O buffers for mobile system memory based on the bulk current injection (BCI) method. An efficient equivalent circuit model is developed for the current injection probe, line impedance stabilization network (LISN), printed circuit board (PCB), and package. The simulation results show good correlation with the measurements and thus, the work presented here will enable electromagnetic susceptibility analysis at the integrated circuit (IC) design stage.