• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.6
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• pp.531-537
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• 2006

A micromachined piezoelectric microspeaker was fabricated with a highly c-axis oriented ZnO thin film on a silicon-nitride film having compressive residual stress. When it was measured 3 mm away from the microspeaker in open field, the largest sound pressure level produced by the fabricated microspeaker was about 91 dB at around 2.9 kHz for the applied voltage of $6\;V_{peak-to-peak}$. The key technologies to these successful results were as follows: (1) the usage of a wrinkled diaphragm caused by the high compressive residual stress of silicon-nitride thin film, (2) the usage of the highly c-axis oriented ZnO thin film.

• The Journal of Korean Academy of Prosthodontics
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• v.34 no.2
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• pp.385-402
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• 1996

The purpose of this study was to analyze how the stability of the implant prostheses and the loosening of the fastening screw was affected when the various types of Hex structure provided for the effect of anti-rotation of the single prostheses were given. Three dimensional finite element model was designed with which the implants with the external hex type of 0.75mm, 1.5mm and the implant with the internal hex type of 0.75mm, 1.5mm and the implant with the external hex type of $15^{\circ}$ tapered shape of 0.75mm were supposed to completely osseointegrate to the mandible. After fininshing the finite element model, the preload of 10N at the fastening screw was applied and then the vertical and $30^{\circ}$ lateral load of 200N was applied respectively at the cusp tips of the prostheses. The following results were obtained : 1. In case of displacement, the amount of displacement was increased at the internal hex type(model C, D) than at the external hex type(model A, B, E) when the vertical and lateral load was applied. 2. Less equivalent stress was represented at the model B with increased external hex height than at the model A when the vertical and lateral load was applied. 3. Much stress was represented at the model E with increased hex angle than at the model A in case of the stress happened to the implant body and the fastening screw when the vertical and lateral load was applied. 4. Much equivalent stress was represented at the model D with deepened internal hex height than at the model C when vertical and lateral load was applied. 5. The least stress was taken at the model B and the most stress was taken at the model D in case of the stress happened to the implant when the vertical and lateral load was applied. 6. The least stress was taken at the model C at the vertical load. And the least stress was taken at the model B at lateral load in case of the stress happened to the fastening screw. As a results of this study, the good lateral stability of prostheses and less stress of the component of implant was taken when the external hex height was increased, and the risk of neck fracture of implant and fastening screw was increased when the internal hex height was deepned because of long screw neck portion and thin implant neck portion.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2002.10a
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• pp.341-346
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• 2002

In this study, an effect that compressive residual stress formed by shot-peening the surface of spring steel(JISG SUP-9) at each shot velocity(1800, 2200, 2600, 3000rpm) on the fatigue crack growth property and threshold stress intensity factor, ${\Delta}K_{th}$, was examined. Followings are the result (1) Compressive residual stress on surface of specimen was determined at each -601 MPa(1800rpm), -638 MPa(2200rpm), -587 MPa (2600rpm), -550 MPa(3000rpm) by shot velocity of shot peening and threshold stress intensity factor, ${\Delta}K_{th}$, fatigue crack growth rate, da/dN, on fatigue crack growth is obstructed by the compressive residual stress was determined at each $5.619\;MPa\sqrt{m}$(Un-peening), $8.319\;MPa\sqrt{m}$(1800rpm), $8.797\;MPa\sqrt{m}$(2200rpm), $7.835\;MPa\sqrt{m}$(2600rpm), $7.352\;MPa\sqrt{m}$(3000rpm) (2) Existing compressive residual stress by effect of shot velocity of shot-peening on relation of crack length. a, and number of cycle, N, was 2 times progressed in case of 2200rpm than specimen of Un-peening on fatigue life. And fatigue life was 1.6 times progressed incase of 3000rpm by Over peening. (3) Fatigue life of Material on Paris' law, $da/dN=C({\Delta}K)^m$, that effect of material constant, C, and fatigue crack growth exponent, m, was influenced by effect of. C and m.

• Journal of the Korean Vacuum Society
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• v.5 no.3
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• pp.229-238
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• 1996

The electromigration phenomena and the characterizations of the conductor lifetime (Time-To-Failure, TTF) in Al-1%Si thin film interconnections under D.C. and Pulsed D.C. conditions were investigated . Meander type test patterns were fabricated with the dimensions of 21080$mu \textrm{m}$ length, 3$\mu\textrm{m}$ width, 0.7$\mu\textrm{m}$ thickness and the 0.1$\mu\textrm{m}$/0.8$\mu\textrm{m}$($SiO_2$/PSG)dielectric overlayer. The current densities of $2 \times10^6 A/\textrm{cm}^2$ and $1 \times10^7 A/\textrm{cm}^2$ were stressed in Al-1%Si thin film interconnection s under a D.C. condition. The peak current densities of $2 \times10^6 A/\textrm{cm}^2$ and $1 \times10^7 A/\textrm{cm}^2$ were also applied under a Pulsed D.C. condition at frequencies of 200KHz, 800KHz, 1MHz, and 4MHz with the duty factor of 0.5. THe time-to-failure under a Pulsed D.C.($TTF_{pulsed D.C}$) was appeared to be larger than that under a D.C. condition. It was found that the TTF under both a D.C. and a Pulsed D.C. condition. It was found that the TTF under both a D.C. and a Pulsed D.C. condition largely depends upon the appiled current densities respectively . This can be explained by a relaxation mechanism view due to a duty cycle under a Pulsed D.C. related to the wave on off. The relaxation phenomena during the pulsed off period result in the decayof excess vacancies generated in the Al-1%Si thin film interconnections because of the electrical and mechanical stress gradient . Hillocks and voids formed by an electromigration were observed by using a SEM (Scanning Electron Microscopy).

• Journal of the Korean Geotechnical Society
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• v.23 no.7
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• pp.87-98
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• 2007

A series of dilatometer test, field vane test, and $CK_0U$ triaxial test were performed for clayey soils of Busan new port site to develop the relationships between undrained shear strength and the DMT results. Normalized undrained shear strength is turned out to be $S_{u(CKU)}/{\sigma}'_v=0.30{\sim}0.35\;for\;CK_0U$ triaxial test and ${\mu}S_{u(VST)}/{\sigma}'_v=0.20{\sim}0.22$ for vane shear test. By comparing the undrained shear strength estimated from DMT indices with the results measured by in-situ vane test or $CK_0U$ triaxial test, two methods to predict the undrained shear strength from DMT results are suggested. One is based on the relationship between $S_u/{\sigma}'_v$ and horizontal stress index (KD) while another method comes from $N_c-I_D$ and $N_c-E_D$ correlation. It was observed that the method based on $N_c-I_D\;or\;N_c-E_D$ relation shows slightly better accuracy than the one based on $K_D$ although all of the methods suggested in this study provided comparable values of predicted undrained shear strength. Since the definitions of $I_D\;and\;E_D$ contain $p_1-p_0$, in which soil condition is reflected, it is believed that the prediction method using $N_c$ is capable of taking a material type into consideration.

• Journal of Welding and Joining
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• v.3 no.2
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• pp.16-26
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• 1985

Post weld heat treatment(PWHT), at more than 600.deg. C, is essential to remove residual stress and hydrogen in weld HAZ and improve fatigue characteristics. However, residual stress during PWHT is responsible for PWHT embitterment and it promotes precipitation of impurities to grain boundary. In this paper, the effect of stress simulated residual stress on fatigue failure was evaluated by fatigue test, microhardness test and fractograph. The obtained results are summarized as follows; (1) The fatigue crack growth rate(da/dN) of parent and heat treated parent was affected by microstructure due to heat treatment and it depended on stress intensity factor (.DELTA.k). (2) The fatigue strength of weld HAZ was dependent on applied stress during PWHT and da/dN after PWHT was slower than as-weld. (3) Softening amount of weld HAZ was bigger than any other due to PWHT. Hardness value of weld HAZ was affected by heat treatment under the applied stress of 10 $kgf/mm^2$, but beyond 20 $kgf/mm^2$ it was increased by the applied stress rather than heat treatment. (4) Beyond the applied stress of 20 $kgf/mm^2$ during PWHT, intergranular fracture surface was observed and its amount was increased with applied stress during PWHT. (5) Effect of applied stress during PWHT on aspect of fracture surface was larger rather than that on fatigue crack growth behavior.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.31 no.1 s.49
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• pp.85-89
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• 2005

An aim of this study is to study the correlation between rheological properties and sedimentation of capsules in aqueous polymer solution with low viscosity. Rheological properties of aqueous polymer solutions were controlled by carbomer (C), acylate/C10-30 alkyl acylate crosspolymer (AC), and ammonium acryloyldimethyltaurate/VP copolymer (AV). Small amount of polymer C solution had the highest viscosity and yield stress of polymer AV solution was higher than that of polymer C solution in the same viscosity when the concentration of polymer AV exceeded $0.35 wt\%$. Each aqueous polymer solution was tested and the results showed that as viscosity and yield stress increased, the sedimentation ratio of capsules decreased. The viscoelasticity data also showed the same tendency in a shear stress range of 0.1 to 2.0 Pa. These results demonstrated that the rheological properties of polymer solutions had a strong correlation with the sedimentation of capsules. When polymer I and AV were used, there was a synergistic effect and the correlation between rheological properties and sedimentation of capsules was very complicated. It was assumed that the characteristics of polymer structure and interaction between polymers caused this phenomena.

• Journal of Microbiology and Biotechnology
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• v.29 no.3
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• pp.401-409
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• 2019

Heat-resistant microbial hosts are required for bioprocess development using high cell density cultivations at the industrial scale. We report that the thermotolerance of Escherichia coli can be enhanced by overexpressing ybeD, which was known to encode a hypothetical protein of unknown function. In the wild-type E. coli BL21(DE3), ybeD transcription level increased over five-fold when temperature was increased from $37^{\circ}C$ to either $42^{\circ}C$ or $46^{\circ}C$. To study the function of ybeD, a deletion strain and an overexpression strain were constructed. At $46^{\circ}C$, in comparison to the wild type, the ybeD-deletion reduced cell growth half-fold, and the ybeD-overexpression promoted cell growth over two-fold. The growth enhancement by ybeD-overexpression was much more pronounced at $46^{\circ}C$ than $37^{\circ}C$. The ybeD-overexpression was also effective in other E. coli strains of MG1655, W3110, DH10B, and BW25113. These findings reveal that ybeD gene plays an important role in enduring high-temperature stress, and that ybeD-overexpression can be a prospective strategy to develop thermotolerant microbial hosts.

• Journal of the Korean Society of Safety
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• v.16 no.1
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• pp.18-24
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• 2001

The fatigue crack growth behavior of the SA516/70 steel which is used for pressure vessels was examined experimentally at room temperature, $-60^{\circ}C$,$-80^{\circ}C$ and $-100^{\circ}C$ with stress ratio of R=0.05, 0.1 and 0.3. Fatigue crack propagation rate da/dN related with stress intensity factor range ${\Delta}K$ was influenced by stress ratio in stable of fatigue crack growth (Region II) with an increase in ${\Delta}K$. The resistance of fatigue crack growth at low temperature is higher compared with that at room temperature, which is attributed to the extent of plasticity-induced by compressive residual stress according to the cyclic loads. Fractographic examinations reveal that the differences of the fatigue crack growth characteristics between room and low temperatures are mainly explained by the crack closure and the strengthening due to the plasticity induced and roughness induced.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.135-135
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• 1999

It is well known that Raman spectroscopy is powerful tool in analysis of sp3/sp3 bonding fraction in diamond-like carbon(DLC) films. Raman spectra of DLC film is composed of D-peak centered at 1350cm-1 and G-peak centered at 1530cm-1. The sp3/sp3 fraction is qualitatively acquired by deconvolution method. However, in case of DLC film, it is generally observed that G-peak position shifts toward low wavenumber as th sp3 fraction increases. However, opposite results were frequently observed in ta-C films. ta-C film has much higher residual compressive stress due to its high sp3 fraction compared to the DLC films deposited by CVD method. Effect of residual stress on G-peak position is most recommendable parameter in Raman analysis of ta-C, due to its smallest fitting error among many parameters acquired by peak deconvolution of symmetric spectra. In current study, the effect of residual stress on Raman spectra was quantitatively evaluated by free-hang method. ta-C films of different residual stress were deposited on Si-wafer by modifying DC-bias voltage during deposition. The variation of the G-peak position along the etching depth were observed in the free-hangs of 20~30${\mu}{\textrm}{m}$ etching depth. Mathematical result based on Airy stress function, was compared with experimental results. The more reliable analysis excluding stress-induced shift was possible by elimination of the Raman shift due to residual compressiove stress.