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Development of Digital 3D Real Object Duplication System and Process Technology (디지털 3차원 실물복제기 시스템 및 공정기술 개발)

  • Kim D.S.;An Y.J.;Lee W.H.;Choi B.O.;Chang M.H.;Baek Y.J.;Choi K.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.732-737
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    • 2005
  • Distal 3D Real Object Duplication System(RODS) consists of 3D Scanner and Solid Freeform Fabrication System(SFFS). It is a device to make three-dimensional objects directly from the drawing or the scanning data. In this research, we developed an office type SFFS based on Three Dimensional Printing Process and a industrial SFFS using Dual Laser. An office type SFFS applied sliding mode control with sliding perturbation observer(SMCSPO) algorithm for control of this system. And we measured process variables about droplet diameter measurement and powder bed formation etc. through experiments. Also, in order to develop more elaborate and speedy system for large objects than existing SLS process, this study applies a new Selective Multi-Laser Sintering(SMLS) process and 3-axis dynamic Focusing Scanner for scanning large area instead of the existing $f\theta$ lens. In this process, the temperature has a great influence on sintering of the polymer. Also the laser parameters are considered like that laser beam power, scan speed, scan spacing. Now, this study is in progress to eveluate the effect of experimental parameters on the sintering process.

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A study on the core technologies for industrial type digital 3D SFF system

  • Kim, Dong-Soo;An, Young-Jin;Kim, Sung-Jon;Choi, Byung-Oh;Lim, Hyun-Eui
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.2170-2174
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    • 2005
  • Selective Laser Sintering (SLS) is a useful rapid prototyping technique for the manufacture of three dimensional (3D) solid objects directly from a scanning data. A new approach called a Selective Multi-Laser Sintering (SMLS) system has been developed at Korea Institute Machinery & Materials (KIMM) as an industrial type SFFS. This SMLS machine is built with a frame, heaters, nitrogen supply part, laser system. This system uses the dual laser and 3D scanner made in $Solutionix^{TM}$ to improve the precision and speed for large objects. The three-dimensional solid objects are made of polyamide powder. The investigation on each part of SMLS system is performed to determine the proper theirs design and the effect of experimental parameters on making the 3D objects. The temperature of the system has a great influence on sintering the polymer. Because the stability of the powder temperature prevents the deformation of each layer, the controls of the temperature in both the system and the powders are very important during the process. Therefore, we simulated the temperature distribution of build room using the temperature analysis with ANSYS program. Selected radiant heater is used to raise temperature of powder to melting point temperature. The laser parameters such as scan spacing, scan speed, laser power and laser delay time affect the production the 3D objects too. The combination of the slow scan speed and the high laser power shows the good results without the layer curling. The work is under way to evaluate the effect of experimental parameters on process and to produce the various objects. We are going to experiment continuously to improve the size accuracy and surface roughness.

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A design of silicon based vertical interconnect for 3D MEMS devices under the consideration of thermal stress (3D MEMS 소자에 적합한 열적 응력을 고려한 수직 접속 구조의 설계)

  • Jeong, Jin-Woo;Kim, Hyeon-Cheol;Chun, Kuk-Jin
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.2
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    • pp.112-117
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    • 2008
  • Vertical interconnection scheme using novel silicon-through-via for 3D MEMS devices or stacked package is proposed and fabricated to demonstrate its feasibility. The suggested silicon-through-via replaces electroplated copper, which is used as an interconnecting material in conventional through-via, with doped silicon. Adoption of doped silicon instead of metal eliminates thermal-mismatch-induced stress, which can make troubles in high temperature MEMS processes, such as wafer bonding and LP-CVD(low pressure chemical vapor deposition). Two silicon layers of $30{\mu}m$ thickness are stacked on the substrate. The through-via arrays with spacing $40{\mu}m$ and $50{\mu}m$ are fabricated successfully. Electrical characteristics of the through-via are measured and analyzed. The measured resistance of the silicon-through-via is $169.9\Omega$.

SFCFOS Uniform and Chebyshev Amplitude Distribution Linear Array Antenna for K-Band Applications

  • Kothapudi, Venkata Kishore;Kumar, Vijay
    • Journal of electromagnetic engineering and science
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    • v.19 no.1
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    • pp.64-70
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    • 2019
  • In this study, a compact series-fed center-fed open-stub (SFCFOS) linear array antenna for K-band applications is presented. The antenna is composed of a single-line 10-element linear array. A symmetrical Chebyshev amplitude distribution (CAD) is used to obtain a low sidelobe characteristic against a uniform amplitude distribution (UAD). The amplitude is controlled by varying the width of the microstrip patch elements, and open-ended stubs are arranged next to the last antenna element to use the energy of the radiating signal more effectively. We insert a series-fed stub between two patches and obtain a low mutual coupling for a 4.28-mm center-to-center spacing ($0.7{\lambda}$ at 21 GHz). A prototype of the antenna is fabricated and tested. The overall size of the uniform linear array is $7.04{\times}1.05{\times}0.0563{\lambda}_g^3$ and that of the Chebyshev linear array is $9.92{\times}1.48{\times}0.0793{\lambda}_g^3$. The UAD array yields a ${\mid}S_{11}{\mid}$ < -10 dB bandwidth of 1.33% (20.912-21.192 GHz) and 1.45% (20.89-21.196 GHz) for the CAD. The uniform array design gives a -23 dB return loss, and the Chebyshev array achieves a -30.68 dB return loss at the center frequency with gains of 15.3 dBi and 17 dBi, respectively. The simulated and measured results are in good agreement.

3D numerical analysis of piled raft foundation for Ho Chi Minh City subsoil conditions

  • Amornfa, Kamol;Quang, Ha T.;Tuan, Tran V.
    • Geomechanics and Engineering
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    • v.29 no.2
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    • pp.183-192
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    • 2022
  • Piled raft foundations are widely used and effective in supporting high-rise buildings around the world. In this study, a piled raft system was numerically simulated using PLAXIS 3D. The settlement comparison results between the actual building measurements and the three-dimensional (3D) numerical analysis, were in good agreement, indicating the usefulness of this approach for the evaluation of the feasibility of using a piled raft foundation in Ho Chi Minh City subsoil. The effects were investigated of the number of piles based on pile spacing, pile length, raft embedment on the settlement, load sharing, bending moments, and the shear force of the piled raft foundation in Ho Chi Minh City subsoil. The results indicated that with an increased number of piles, increased pile length, and embedding raft depth, the total and differential settlement decreased. The optimal design consisted of pile numbers of 60-70, corresponding to pile spacings is 5.5-6 times the pile diameter (Dp), in conjunction with a pile length-to-pile diameter ratio of 30. Furthermore, load sharing by the raft, by locating it in the second layer of stiff clay, could achieve 66% of the building load. The proposed model of piled raft foundations could reduce the total foundation cost by 49.61% compared to the conventional design. This research can assist practicing engineers in selecting pile and raft parameters in the design of piled raft foundations to produce an economical design for high-rise buildings in Ho Chi Minh City, Viet Nam, and around the world.

Application of Feed-forward Linearization Method to A Transmitter System (Feed-forward 선형화 방식을 적용한 송신 시스템 설계)

  • 김경태;김상규
    • The Journal of the Acoustical Society of Korea
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    • v.23 no.4
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    • pp.303-308
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    • 2004
  • In this Paper a transmitter system for IMr-2000 using feed-forward linearization method was Proposed to linearize power amplifier. The feed-forward structure needs a reference signal to compare and neutralize distortion : this is achieved through the second modulator which is operated at very low input level to obtain a signal with a negligible distortion. Therefore, this structure can reduce distortion of modulator as well as Power amplifier. This is the advantage over the existing system structure. The Proposed transmitter system is designed and simulated by Agilent ADS ver.2002. A two tone test for the system is done at 1.98GHz center frequency with frequency spacing of 2MHz. The reduction of Inter-Modulation Distortion(IMD) is around 49.95dB. This proposed system offers an excellent combination of linearity and simplicity.

Mechanical and Thermal Behavior of Polyamide-6/Clay Nanocomposite Using Continuum-based Micromechanical Modeling

  • Weon, Jong-Il
    • Macromolecular Research
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    • v.17 no.10
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    • pp.797-806
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    • 2009
  • The mechanical and thermal behaviors of polyamide-6/clay nanocomposites were studied using the continuum-based, micromechanical models such as Mori-Tanaka, Halpin-Tsai and shear lag. Mechanic-based model prediction provides a better understanding regarding the dependence of the nanocomposites' reinforcement efficiency on conventional filler structural parameters such as filler aspect ratio ($\alpha$), filler orientation (S), filler weight fraction (${\Psi}_f$), and filler/matrix stiffness ratio ($E_f/E_m$). For an intercalated and exfoliated nanocomposite, an effective, filler-based, micromechanical model that includes effective filler structural parameters, the number of platelets per stack (n) and the silicate inter-layer spacing ($d_{001}$), is proposed to describe the mesoscopic intercalated filler and the nanoscopic exfoliated filler. The proposed model nicely captures the experimental modulus behaviors for both intercalated and exfoliated nanocomposites. In addition, the model prediction of the heat distortion temperature is examined for nanocomposites with different filler aspect ratio. The predicted heat distortion temperature appears to be reasonable compared to the heat distortion temperature obtained by experimental tests. Based on both the experimental results and model prediction, the reinforcement efficiency and heat resistance of the polyamide-6/clay nanocomposites definitely depend on both conventional (${\alpha},\;S,\;{\Psi}_f,\;E_f/E_m$) and effective (n, $d_{001}$) filler structural parameters.

Fabrication and Characterization of Multi-Channel Electrode Array (MEA) (다중 채널 전극의 제작 및 특성 평가)

  • Seong, Rak-Seon;Gwon, Gwang-Min;Park, Jeong-Ho
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.51 no.9
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    • pp.423-430
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    • 2002
  • The fabrication and experimentation of multi-channel electrodes which enable detecting and recording of multi-site neuronal signals have been investigated. A multi-channel electrode array was fabricated by depositing 2000${\AA}$ thick Au layer on the 1000${\AA}$ thick Ti adhesion layer on a glass wafer. The metal paths were patterned by wet etching and passivated by depositing a PECVD silicon nitride insulation layer to prevent signals from intermixing or cross-talking. After placing a thin slice of rat cerebellar granule cell in the culture ring located in central portion of the multi-channel electrode plate, a neuronal signal from an electrode which is in contact with the cerebellar granule cell has been detected. It was found that the electrode impedance ranges 200㏀∼1㏁ and the impedance is not changed by cleaning with nitric acid. Also, the impedance is inversely proportion to the exposed electrode area and the cross-talk is negligible when the electrode spacing is bigger than 600$\mu\textrm{m}$. The amplitude and frequency of the measured action potential were 38㎷ and 2㎑, which are typical values. From the experimental results, the fabricated multi-channel electrode array proved to be suitable for multi-site neuronal signal detection for the analysis of a complicated cell network.

An Experimental Study on the Inner Crack Growth of Welded Connections of Steel Structures (강구조용접연결부(鋼構造鎔接連結部)의 내부구열성장(內部龜裂成長)에 관한 실험적(實驗的) 연구(硏究))

  • Min, Chang Dong;Kim, Ki Du;Chang, Dong Il
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.5 no.2
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    • pp.121-131
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    • 1985
  • The characteristic of fatigue crack growth in the homogeneous or the soft welded connections used SWS-53 steel and HT-80 steel as base metals is examined by fractographic analysis. As a result of this analysis, the fact that the characteristic of fatigue crack growth which is observed and measured at the surface has wide application to engineering practice is verified. Also, the fact that the welded parts of HT-80 steel have much danger of brittle fracture is prooved. Considering that the striations are observed at the welded parts of SWS-58 steel and the spacing of striations has higher numerical value than da/dN, we can prove that inner fatigue crack growth may develop in zig-zag directions.

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Reynolds number effect on the flow past two tandem cylinders

  • Derakhshandeh, Javad Farrokhi;Alam, Md. Mahbub
    • Wind and Structures
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    • v.30 no.5
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    • pp.475-483
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    • 2020
  • This work investigates Reynolds number Re (= 50 - 200) effects on the flows around a single cylinder and the two tandem (center-to-center spacing L= L/D = 4) cylinders, each of a diameter D. Vorticity structures, Strouhal numbers, and time-mean and fluctuating forces are presented and discussed. For the single cylinder, with increasing Re in the range examined, the vorticity magnitude, Strouhal number and fluctuating lift all monotonically rise but time-mean drag, vortex formation length, and lateral distance between the two rows of vortices all shrink. For the two tandem cylinders, the increase in Re leads to the formation of three distinct flows, namely reattachment flow (50 ≤ Re ≤ 75), transition flow (75 < Re < 100), and coshedding flow (100 ≤ Re ≤ 200). The reattachment flow at Re = 50 is steady. When Re is increased from 75 to 200, the Strouhal number of the two cylinders, jumping from 0.113 to 0.15 in the transition flow regime, swells to 0.188. The two-cylinder flow is more sensitive to Re than the single cylinder flow. Fluctuating lift is greater for the downstream cylinder than the upstream cylinder while time-mean drag is higher for the upstream cylinder than for the other. The time-mean drags of the upstream cylinder and single cylinder behaves similar to each other, both declining with increasing Re.