• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.323-323
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• 2010

Saw damage of crystalline silicon wafer is unavoidable factor. Usually, alkali treatment for removing the damage has been carried out as the saw damage removal (SDR) process for priming the alkali texture. It usually takes lots of time and energy to remove the sawed damages for solar grade crystalline silicon wafers We implemented two different mixed acidic solution treatments to obtain the improved surface structure of silicon wafer without much sacrifice of the silicon wafer thickness. At the first step, the silicon wafer was dipped into the mixed acidic solution of $HF:HNO_3$=1:2 ration for polished surface and at the second step, it was dipped into the diluted mixed acidic solution of $HF:HNO_3:H_2O$=7:3:10 ratio for porous structure. This double treatment to the silicon wafer brought lower reflectance (25% to 6%) and longer carrier lifetime ($0.15\;{\mu}s$ to $0.39\;{\mu}s$) comparing to the bare poly-crystalline silicon wafer. With optimizing the concentration ratio and the dilution ratio, we can not only effectively substitute the time consuming process of SDR to some extent but also skip plasma enhanced chemical vapor deposition (PECVD) process. Moreover, to conduct alkali texture for pyramidal structure on silicon wafer surface, we can use only nitric acid rich solution of the mixed acidic solution treatment instead of implementing SDR.

• Journal of Powder Materials
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• v.18 no.2
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• pp.168-171
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• 2011

We investigate grain growth behavior of poly-crystalline Mg sheet having strong basal fiber texture using phase field model for grain growth and micro-elasticity. Strong initial basal texture was maintained when external load was not imposed, but was weaken when external biaxial strain was imposed. Elastic interaction between elastic anisotropy of Mg grain and external load is the reason why texture evolution occurs.

• Korean Journal of Materials Research
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• v.20 no.12
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• pp.649-653
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• 2010

In this paper, double texturization of multi crystalline silicon solar cells was studied with laser and reactive ion etching (RIE). In the case of multi crystalline silicon wafers, chemical etching has problems in producing a uniform surface texture. Thus various etching methods such as laser and dry texturization have been studied for multi crystalline silicon wafers. In this study, laser texturization with an Nd:$YVO_4$ green laser was performed first to get the proper hole spacing and $300{\mu}m$ was found to be the most proper value. Laser texturization on crystalline silicon wafers was followed by damage removal in acid solution and RIE to achieve double texturization. This study showed that double texturization on multi crystalline silicon wafers with laser firing and RIE resulted in lower reflectance, higher quantum yield and better efficiency than that process without RIE. However, RIE formed sharp structures on the silicon wafer surfaces, which resulted in 0.8% decrease of fill factor at solar cell characterization. While chemical etching makes it difficult to obtain a uniform surface texture for multi crystalline silicon solar cells, the process of double texturization with laser and RIE yields a uniform surface structure, diminished reflectance, and improved efficiency. This finding lays the foundation for the study of low-cost, high efficiency multi crystalline silicon solar cells.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.199-202
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• 2006

The hardening and anisotropy based on the crystal plasticity is considered in the numerical simulation of hemispherical sheet forming process to find more realistic simulation results For calculating the yield shear stresses of each crystal, Taylor's model of the crystalline aggregate is employed. The yield stress of crystalline aggregate is computed by averaging the yield stresses of the crystal. The hardening is evaluated by using the Taylor factor and the critical resolved shear stress of the crystal. In addition, by observing the crystallographic texture and slip system, the anisotropy of the sheet is traced during the forming process. The anisotropy and hardening behaviors of the sheet found by the crystal plasticity are described better than those of obtained from the Hill's quadratic criterion based on the continuum plasticity.

• Current Photovoltaic Research
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• v.6 no.3
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• pp.86-90
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• 2018

To generate more current in crystalline silicon solar cells, surface texturing is adopted by reducing the surface reflection. Conventionally, random pyramid texturing by the wet chemical process is used for surface texturing in crystalline silicon solar cell. To achieve higher efficiency of solar cells, well ordered inverted pyramid texturing was introduced. Although its complicated process, superior properties such as lower reflectance and recombination velocity can be achieved by optimizing the process. In this study, we investigated optical and passivation properties of inverted pyramid texture. Lifetime, implied-Voc and reflectance were measured with different width and size of the texture. Also, effects of chemical rounding at the valley of the pyramid were observed.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.6
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• pp.261-266
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• 2003

The presence of ultrasonic wave in the caustic etching process enhances the etching rate and results in finer and more homogeneous textured structure of the crystalline silicon surface. The silicon solar cell textured in the caustic solution at $60^{\circ}C$ with ultrasonic wave gives higher cell performance than the cell textured at $70^{\circ}C$ without ultrasonic wave. This result indicates a strong possibility of lowering the production cost of the silicon solar cell through saving the thermal budget or expensive chemical normally employed in the texturisation of the crystalline silicon.

• Transactions of Materials Processing
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• v.21 no.4
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• pp.252-257
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• 2012

Crystallographic texture evolution during forming processes has a significant effect on the anisotropic flow behavior of crystalline material. In this study, a crystal plasticity finite element method (CPFEM), which incorporates the crystal plasticity constitutive law into a three-dimensional finite element method, was used to investigate texture evolution of a face-centered-cubic material - an aluminum alloy. A rate-dependent polycrystalline theory was fully implemented within an in-house program, CAMPform3D. Each integration point in the element was considered to be a polycrystalline aggregate consisting of a large number of grains, and the deformation of each grain in the aggregate was assumed to be the same as the macroscopic deformation of the aggregate. The texture evolution during three different deformation modes - uniaxial tension, uniaxial compression, and plane strain compression - was investigated in terms of pole figures and compared to experimental data available in the literature.

• Journal of the Korean Vacuum Society
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• v.19 no.2
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• pp.114-120
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• 2010

Conventional surface texturing in crystalline silicon solar cell have been use wet texturing by Alkali or Acid solution. But conventional wet texturing has the serious issue of wafer breakage by large consumption of wafer in wet solution and can not obtain the reflectance below 10% in multi crystalline silicon. Therefore it is focusing on RIE texturing, one method of dry etching. We developed large scale plasma RIE (Reactive Ion Etching) equipment which can accommodate 144 wafers (125 mm) in tray in order to provide surface texturing on the silicon wafer surface. Reflectance was controllable from 3% to 20% in crystalline silicon depending on the texture shape and height. We have achieved excellent reflectance below 4% on the weighted average (300~1,100 nm) in multi crystalline silicon using plasma texturing with gas mixture ratio such as $SF_6$, $Cl_2$, and $O_2$. The texture shape and height on the silicon wafer surface have an effect on gas chemistry, etching time, RF frequency, and so on. Excellent conversion efficiency of 16.1% is obtained in multi crystalline silicon by RIE process. In order to know the influence of RF frequency with 2 MHz and 13.56 MHz, texturing shape and conversion efficiency are compared and discussed mutually using RIE technology.

• Transactions of Materials Processing
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• v.16 no.4 s.94
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• pp.276-281
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• 2007

The hardening and the constitutive equation based on the crystal plasticity are introduced for the numerical simulation of hemispherical sheet metal forming. For calculating the deformation and the stress of the crystal, Taylor's model of the crystalline aggregate is employed. The hardening is evaluated by using the Taylor factor, the critical resolved shear stress of the slip system, and the sum of the crystallographic shears. During the hemispherical forming process, the texture of the sheet metal is evolved by the plastic deformation of the crystal. By calculating the Euler angles of the BCC sheet, the texture evolution of the sheet is traced during the forming process. Deformation texture of the BCC sheet is represented by using the pole figure. The comparison of the strain distribution and punch force in the hemispherical forming process between the prediction using crystal plasticity and experiment shows the verification of the crystal plasticity-based formulation and the accuracy of the hardening and constitutive equation obtained from the crystal plasticity.

• Steel and Composite Structures
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• v.47 no.5
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• pp.601-613
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• 2023

Numerous methods have been proposed in predicting formability of sheet metals based on microstructural and macro-scale properties of sheets. However, there are limited number of papers on the optimization problem to increase formability of sheet metals. In the present study, we aim to use novel optimization algorithms in neural networks to maximize the formability of sheet metals based on tensile curve and texture of aluminum sheet metals. In this regard, experimental and numerical evaluations of effects of texture and tensile properties are conducted. The texture effects evaluation is performed using Taylor homogenization method. The data obtained from these evaluations are gathered and utilized to train and validate an artificial neural network (ANN) with different optimization methods. Several optimization method including grey wolf algorithm (GWA), chimp optimization algorithm (ChOA) and whale optimization algorithm (WOA) are engaged in the optimization problems. The results demonstrated that in aluminum alloys the most preferable texture is cube texture for the most formable sheets. On the other hand, slight differences in the tensile behavior of the aluminum sheets in other similar conditions impose no significant decreases in the forming limit diagram under stretch loading conditions.