• 대한토목학회논문집
• /
• 제11권3호
• /
• pp.85-93
• /
• 1991

실트질 접토의 심강(沈降) 특성(特性)에 미치는 초기농도(初期濃度)($C_o$) 및 저면전단응력(底面剪斷應力)(${\tau}_b$)의 효과에 대한 연구를 하기 위해 황해안 영광해역에서 채취한 실트질 점토를 사용하여 순환식 개수로에서 퇴적실험(堆積實驗)을 하였다. 상대농도(相對濃度) $C/C_o$(C=수심 평균한 농도) 및 상대평형농도(相對平衡濃度) $C_{eq}/C_o$($C_{eq}$=평형상태에서 수심 평균한 농도)는 저면전단응력(底面剪斷應力)에 강하게 좌우되며, 초기농도(初期濃度)에는 큰 영향을 받지 않는 것으로 나타났고, 또한 이들 값은 저면전단응력(底面剪斷應力)이 클수록 증가하였다. 황해안 영광해역 퇴적물(堆積物)의 퇴적한계저면전단응력(堆積限界底面剪斷應力)의 최소치는 ${\tau}_{bmin}{\simeq}0.017N/m^2$, 퇴적한계저면전단응력(堆積限界底面剪斷應力)의 최대치는 ${\tau}_{bmax}{\simeq}1.25N/m^2$이며, 이들 값은 퇴적물(堆積物)의 구성성분에 강하게 좌우된다. ${\tau}_b{\geq}{\tau}_{bmin}$ 범위에서 상대농도(相對濃度)($C_{eq}/C_o$)와 겉보기 중앙심강속도(中央沈降速度)($W_{s50}{^{\prime}}$)에 대한 식을 유도하였다. 겉보기 중앙심강속도(中央沈降速度)는 초기농도(初期濃度)보다 저면전단응력(底面剪斷應力)에 훨씬 더 강한 영향을 받고, 저면전단응력(底面剪斷應力)이 증가할수록 지수적으로 감소하였다.

• 한국해양학회지
• /
• 제18권1호
• /
• pp.21-28
• /
• 1983

堆積物 流動의 再現과 豫測을 위한 數値模型의 開發에는 堆積物의 浮上機作 과 沈澱過程의 究明이 先決要件이 된다. 따라서 이의 究明을 爲한 一蓮 의 水理實驗이 企圖하였다. 硏究結果, 堆積物의 浮上은 전단응력과 퇴적물에 함유된 수분량 및 堆積物의 구성종류에 따라 좌우되고 있음이 밝혀 졌으며, 침전은 퇴적물의 농도와 점토광물질의 함유량에 따라 크게 변하고 있음이 밝혀 졌다.

• 한국수자원학회논문집
• /
• 제45권2호
• /
• pp.151-163
• /
• 2012

산지하천의 자갈하상재료 분포는 최근 특정규모 홍수의 수류력에 의한 유사 이송 및 퇴적 과정에 의해 형성되며, 장갑화된 하천에서 한계수류력을 평가하는 것은 안정하도설계를 위해 중요하다. 자갈하상 하천 종단지점과 만곡부 일정구간의 세부지점에대한하상재료의입도분포를조사하고, 한계유속 및 한계수류력을 평가하였다. 자갈하상 재료에 대한 Yang의 한계단위수류력과 Bagnold의 한계수류력은 상류로 갈수록 급격히 증가했다. 계획홍수량에 근거한 무차원 전단응력은 Shields 도표에서대부분조사지점의자갈하상재료가소류사형태로이동하는것으로평가되었다. 만곡부에 대한 평균입경은 상류 유입수의 1차 수충지점에서 가장 컸으며, 반사흐름에 의한 2차 수충지점에서 두 번째로 큰 입경을 보였다. 수충직하류지점들에서상대적으로작은평균입경을보였다. 만곡부의 평균한계유속 범위는0.77~2.60m/s의 범위이며, 한계단위수류력은 경사가 급한 1차 수충부에서는 상당히 컸다. 한계수류력의 분포는 7~171W/m2의 범위로 하천 횡단보다는 종단에 따른 변화가 뚜렷했고, 만곡 외측 1차 수충지점과 반사흐름 2차 수충지점에서 크게 작용하는 것으로 평가되었다.

• 한국수자원학회:학술대회논문집
• /
• 한국수자원학회 2012년도 학술발표회
• /
• pp.34-34
• /
• 2012

Heavy storms rainfall has caused many landslides and slope failures especially in the mountainous area of the world. Landslides and slope failures are common geologic hazards and posed serious threats and globally cause billions in monetary losses and thousands of casualies each year so that studies on slope stability and its failure mechanism under rainfall are being increasing attention of these days. Rainfall-induced slope failures are generally caused by the rise in ground water level, and increase in pore water pressures and seepage forces during periods of intense rainfall. The effective stress in the soil will be decreased due to the increased pore pressure, which thus reduces the soil shear strength, eventually resulting in slope failure. During the rainfall, a wetting front goes downward into the slope, resulting in a gradual increase of the water content and a decrease of the negative pore-water pressure. This negative pore-water pressure is referred to as matric suction when referenced to the pore air pressure that contributes to the stability of unsaturated soil slopes. Therefore, the importance is the study of saturated unsaturated soil behaviors in evaluation of slope stability under heavy rainfall condition. In an actual field, a series of failures may occur in a slope due to a rainfall event. So, this study attempts to develop a numerical model to investigate this failure mechanism. A two-dimensional seepage flow model coupled with a one-dimensional surface flow and erosion/deposition model is used for seepage analysis. It is necessary to identify either there is surface runoff produced or not in a soil slope during a rainfall event, while analyzing the seepage and stability of such slopes. Runoff produced by rainfall may result erosion/deposition process on the surface of the slope. The depth of runoff has vital role in the seepage process within the soil domain so that surface flow and erosion/deposition model computes the surface water head of the runoff produced by the rainfall, and erosion/deposition on the surface of the model slope. Pore water pressure and moisture content data obtained by the seepage flow model are then used to analyze the stability of the slope. Spencer method of slope stability analysis is incorporated into dynamic programming to locate the critical slip surface of a general slope.

• 한국초전도ㆍ저온공학회논문지
• /
• 제16권4호
• /
• pp.49-52
• /
• 2014

REBCO coated conductor (CC) tapes with superior mechanical and electromechanical properties are preferable in applications such as superconducting coils and magnets. The CC tapes should withstand factors that can affect their performance during fabrication and operation of its applications. In coil applications, CC tapes experience different mechanical constraints such as tensile or compressive stresses. Recently, the critical current ($I_c$) degradation of CC tapes used in coil applications due to delamination were already reported. Thermal cycling, coefficient of thermal expansion mismatch among constituent layers, screening current, etc. can induce excessive transverse tensile stresses that might lead to the degradation of $I_c$ in the CC tapes. Also, CC tapes might be subjected to very high magnetic fields that induce strong Lorentz force which possibly affects its performance in coil applications. Hence, investigation on the delamination mechanism of the CC tapes is very important in coiling, cooling, operation and design of prospect applications. In this study, the electromechanical properties of REBCO CC tapes fabricated by reactive co-evaporation by deposition and reaction (RCE-DR) under transversely applied loading were investigated. Delamination strength of the CC tape was determined using the anvil test. The $I_c$ degraded earlier under transverse tensile stress as compared to that under compressive one.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
• /
• pp.84-87
• /
• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Nuclear Engineering and Technology
• /
• 제45권4호
• /
• pp.513-522
• /
• 2013

The ODSCC detected in the TSP position of Ulchin 3&4 SGs are typical ODSCC of Alloy 600MA tubes. The causative chemical environment is formed by concentration of impurities inside the occluded region formed by the tube surface, egg crate strips, and sludge deposit there. Most cracks are detected at or near the line contacts between the tube surface and the egg crate strips. The region of dense crack population, as defined as between $4^{th}$ and $9^{th}$ TSPs, and near the center of hot leg hemisphere plane, coincided well with the region of preferential sludge deposition as defined by thermal hydraulics calculation using SGAP computer code. The cracks developed homogeneously in a wide range of SGs, so that the number of cracks detected each outage increased very rapidly since the first detection in the $8^{th}$ refueling outage. The root cause assessment focused on investigation of the difference in microstructure and manufacturing residual stress in order to reveal the cause of different susceptibilities to ODSCC among identical six units. The manufacturing residual stress as measured by XRD on OD surface and by split tube method indicated that the high residual stress of Alloy 600MA tube played a critical role in developing ODSCC. The level of residual stress showed substantial variations among the six units depending on details of straightening and OD grinding processes. Youngwang 3&4 tubes are less susceptible to ODSCC than U3 and U4 tubes because semi-continuous coarse chromium carbides are formed along the grain boundary of Y3&4 tubes, while there are finer less continuous chromium carbides in U3 and U4. The different carbide morphology is caused by the difference in cooling rate after mill anneal. There is a possibility that high chromium content in the Y3&4 tubes, still within the allowable range of Alloy 600, has made some contribution to the improved resistance to ODSCC. It is anticipated that ODSCC in Y5&6 SGs will be retarded more considerably than U3 SGs since the manufacturing residual stress in Y5&6 tubes is substantially lower than in U3 tubes, while the microstructure is similar with each other.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
• /
• pp.700-702
• /
• 2005

A 5.0-inch transmissive type plastic TFT arrays were successfully fabricated on a plastic substrate at the resolution of $400{\times}3{\times}300$ lines (100ppi). All of the TFT processes were carried out below $150^{\circ}C$ on PES plastic films. After thin film deposition using PECVD, thin film failures such as film delamination and cracking often occurred. For successful growth of thin films (about 1um) without their failures, it is necessary to solve the critical problem related to the internal compressive stress (some GPa) leading to delamination at a threshold thickness value of the films. The Griffith's theory explains the failure process by looking at the excess of elastic energy inside the film, which overcomes the cohesive energy between film and substrate. To increase the above mentioned threshold thickness value there are two possibilities: (i) the improvement of the interface adhesion (for example, through surface micro-roughening and/or surface activation), and (ii) the reduction of the internal stress. In this work, reducing a-Si layer film thickness and optimizing a barrier SiNx layer have produced stable CVD films at 150oC, over PES substrates

• 마이크로전자및패키징학회지
• /
• 제27권3호
• /
• pp.77-81
• /
• 2020

차세대 디스플레이 시장을 선도하기 위해서는 롤러블(rollable), 폴더블(foldable) 디스플레이와 같은 플렉서블(flexible) OLED 디스플레이의 상용화 및 양산화가 필수적이나, 실제 공정 및 굽힘 과정에서 발생하는 극심한 박막 내부 응력 변화로 인한 기계적 파손 문제가 심각한 상황이다. 따라서, 플렉서블 디스플레이 구조에 사용되는 박막 재료의 기계적 물성을 파악하는 것은 제품의 강건한 설계 및 구조 최적화에 필수적이다. 본 논문에서는 물 표면 플랫폼을 이용한 나노 박막 인장 시험법을 적용하여 플렉서블 디스플레이 패널에 적용되는 금속 및 세라믹 박막 소재들의 인장 물성을 정량적으로 측정하였다. 스퍼터링(Sputtering)으로 증착된 Mo, MoTi 나노 박막과, 플라즈마 강화 화학 기상 증착법(Plasma Enhanced Chemical Vapor Deposition, PECVD)으로 증착된 SiN_x 나노 박막의 탄성 계수와 인장 강도 및 연신율을 측정하는 데 성공하였다. 결과적으로 박막의 증착 조건 및 두께에 따라 기계적 물성이 크게 변화할 수 있음을 확인하였으며, 측정된 인장 물성은 기계적으로 강건한 롤러블, 폴더블 디스플레이의 설계를 위한 응력 해석 모델링 데이터로 활용될 수 있을 것으로 기대한다.

• 마이크로전자및패키징학회지
• /
• 제11권3호
• /
• pp.37-45
• /
• 2004

무전해 Ni(P)는 솔더링 특성과 부식저항성이 우수하고 표면 거칠기가 적으며 원하는 금속 상에 선택적으로 도금이 가능하여 전자패키지에서 반도체칩과 기판의 표면 금속층으로 촉 넓게 사용되고 있다. 그러나 솔더와의 반응 중 금속간 화합물의 spalling과 솔더 조인트에서의 취성파괴 문제가 성공적인 적용의 걸림돌이 되어 왔다. 본 연구에서는 각각 조성이 다른 세가지 Ni(P)막 (4.6,9, and $13 wt.\%$ P)을 사용하곡 솔더와의 반응시 무전해 Ni(P)막의 미세구조 및 상 변화와 금속간화합물의 spatting 거동을 면밀히 조사하였다. $Ni_3Sn_4$ 화합물 아래로 침투한 Sn과 P-rich layer ($Ni_3P$)와의 반응에 의해 $Ni_3SnP$ 층이 형성되며 $Ni_3SnP$ 층이 성장함에 따라 $Ni_3Sn_4$가 spalling됨이 관찰되었다. Spalling 후에는 Ni(P)막이 용융된 솔더와 직접 접촉하게 되어 Ni(P)막의 결정화가 가속화되고 $Ni_3P$상이 $Ni_2P$상으로 변태되었다. 또한 이러한 결정화 과정 중 Ni(P)막의 부피가 감소됨에 따라서 인장응력이 발생하여 막 내부에 크랙이 발생하였다.