• Title/Summary/Keyword: crimping connection

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A study on waveforms with press conditions of Harness terminal (단자(Terminal) 압착조건에 따른 파형의 고찰)

  • Shin, Young-Lok;Yang, Yun-Suk;Kim, Chul-Han;SaGong, Geon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.04b
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    • pp.172-175
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    • 2000
  • The crimping connection is a permanent connection that maintains mechanical and electrical property for a long time by crimping two conductors. In this paper, we have done a basic study to decide normal or abnormal condition depending on crimping. Using PZT piezo-sensor, we have analyzed crimping waveforms according to the crimping height. And hence the normal or abnormal condition of crimping connections in real time could be decided by comparison of crimping waveforms in the cases of normal crimping, over crimping, under crimping and core omitting.

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A study and analysis of waveforms with press conditions of terminal (단자(Terminal) 압착 조건에 따른 파형의 고찰 및 분석)

  • Shin, Young-Lok;Yang, Yun-Suk;Kim, Chul-Han;SaGong, Geon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.05b
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    • pp.65-69
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    • 2000
  • The crimping connection is a permanent connection that maintains mechanical and electrical property for a long time by crimping two conductors. In this paper, we have done a basic study to make a decision the normal or abnormal condition depending on crimping. By using PZT piezo-sensor, we have compared and analyzed crimping waveforms of abnormal conditions(core ommiting, cover biting) at the normal crimping height. And hence the normal or abnormal condition of crimping connections in real time could be determined by comparison of crimping waveforms in the cases of normal crimping, core omitting and cover biting.

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A variation of tensile force with the terminal height (단자(Terminal) 압착고에 따른 인장력 변화에 대한 고찰)

  • Shin, Young-Lok;Yang, Yun-Suk;Kim, Chul-Han;SaGong, Geon
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.1690-1692
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    • 2000
  • The principle of crimping connection is to produce a compressive connection force between terminal and cores(wire conductor). Compressive connection force is produced by pushing each other on that stress(crimping force) of barrel by restored elastic strain after plastic deformation and the expansion force of cores' elastic stress. And resistance and tension force between terminal and cores are determined according to the condition of compressive connection force. In this study, we've found out that the adaptive height which has maximum tensile force by measuring a tensile force with a height of terminal.

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Applications of a Quadrant plane Amorphous Silicon Photo Position Sensor (4분면 아몰퍼스 실리콘 Photo 위치센서의 응용)

  • 김철한;신영록;사공건
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.11a
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    • pp.445-447
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    • 2000
  • The terminal and core(wire conductor) in a Harness processing is connected by putting them in a applicator by virtue of a manual operation. A normal or abnormal condition of crimping connections is nearly determined by a skilled worker. In general, a skilled worker operates a press motor with a foot switch by pressing on foot and puts a wire conductor into a press with one hand. By doing so, sufficient efficiency is not obtained by a worker. In this paper, a basic study has done to make improve an efficiency by finding the normal arrangement out as to whether a terminal and wire conductor in Harness are placed on the right position or not with a quadrant plane photo position sensor.

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Bonding Technologies for Chip to Textile Interconnection (칩-섬유 배선을 위한 본딩 기술)

  • Kang, Min-gyu;Kim, Sungdong
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.4
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    • pp.1-10
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    • 2020
  • This paper reviews the recent development of electronic textile technology, mainly focusing on chip-textile bonding. Before the chip-textile bonding, a circuit on the textile should be prepared to supply the electrical power and signal to the chip mounted on the fabrics. Either embroidery with conductive yarn or screen-printing with the conductive paste can be applied to implement the circuit on the fabrics depending on the circuit density and resolution. Next, chip-textile bonding can be performed. There are two choices for chip-textile bonding: fixed connection methods such as soldering, ACF/NCA, embroidery, crimping, and secondly removable connection methods like a hook, magnet, zipper. Following the chip-textile bonding process, the chip on the textile is generally encapsulated using PDMS to ensure reliability like water-proof.