• 콘크리트학회논문집
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• 제28권5호
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• pp.535-544
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• 2016

본 연구에서는 디지털 이미지를 사용하여 DIC(Digital Image Correlation) 기법 및 부착파괴면 분석을 통해 부착파괴에너지와 부착강도의 정량적 분석뿐만 아니라 계면의 부착 면 파괴 양상의 정성적 접근을 통해 지속 하중과 온도의 복합 하중에 대한 FRP 부착 실험체의 거동을 분석하였다. 이를 위해 CFRP 쉬트를 부착한 일면전단실험체를 제작하여 사용하였다. 일면전단실험체의 지속 하중 기간의 거동은 에폭시 크리프의 영향을 상당히 받으며 지속 하중 기간 동안에 에폭시의 점탄성 특징으로 인해 응력완화가 발생하였다. 응력완화는 지속 하중 이후 실시한 계면전단실험에서 사용한 DIC 기법을 통해 관찰 하였으며 지속하중 기간 동안의 응력완화로 인해 지속하중 실험체의 최대부착파괴하중 및 계면파괴에너지가 대조실험체보다 증가하였다. 모든 실험체의 부착 파괴 면을 디지털 이미지화하여 파괴 면의 양상을 정성적/정량적으로 분석 하였다. 디지털 이미지 분석 결과 지속 하중 기간 동안 파괴 형태가 콘크리트면내파괴에서 계면부착파괴 형태로 전이가 발생하였으며 이러한 전이로 인해 지속하중 기간이 증가할수록 지속하중의 최대부착파괴하중에 대한 긍정적인 효과 감소하였다.

• 콘크리트학회논문집
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• 제14권4호
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• pp.521-529
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• 2002

콘크리트의 크리프와 건조수축에 의한 장기변형의 일부가 구속되는 합성단면에 대해 콘크리트에 발생되는 잔류응력과 이로 인한 콘크리트 단면에 선압축력의 손실을 계산하기 위해 콘크리트 장기변형의 구속계수가 유도되었으며, 선압축력의 손실률을 계산하기 위한 식을 제안하였다. 제안된 구속계수는 재령수정 유효탄성계수가 적용된 환산단면특성으로부터 계산되며, 복잡한 형태의 합성단면에 대해서도 쉽게 적용될 수 있다. 기존 설계기준에서 콘크리트의 장기변형과 관련된 조항을 검토하기 위해서 도로설계편람의 일반 합성단면에 대해 이 구속계수와 선압축력의 손실 계산식이 적용되었다. 부정정력과 신축이음량의 계산에 적용되는 건조수축변형률 $150 ~ 200$\times$10^{-6}$ 은 장기변형의 구속정도가 적은 경우에 과소 계산될 수 있으며, 잔류응력의 계산에 는 적용되는 $180$\times$10^{-6}$ 은 비정상적으로 작은 값이다. 이 논문에서 적용된 PSC 합성단면에 대한 도로교 설계기준의 손실률 16.3%는 ACI 209에 대해서는 안전측으로 계산되었으나 Eurocode 2에 대해서는 안전을 보장할 수 없었다. 강합성 단면의 콘크리트 바닥판에 일반 보강철근의 긴장에 의해 선압축력이 도입되면 철근비의 증가로 긴장에 의한 경우보다 상당히 큰 손실이 발생되었으며, 강재거더의 구속에 의해 긴장된 보강재 선인장력의 손실은 감소한 반면에, 콘크리트 선압축력의 손실은 증가하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국세라믹학회지
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• 제45권9호
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• pp.549-555
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• 2008

The thermal barrier coating must withstand erosion when subjected to flowing gas and should also maintain good stability and mechanical properties while it must also protect the turbine component from high temperature, hot corrosion, creep, and oxidation during operation. In this study we investigated the influence of subsurface layer, $Al_2O_3$ or NiCrCoAIY bond coat layer, on the indentation damage behavior of YSZ thermal barrier coating layers deposited by electron beam physical vapor deposition (EB-PVD). The bond coat is deposited using different process such as air plasma spray (APS) or spray of high velocity oxygen fuel (HVOF) and the thickness is varied. Hertzian indentation technique is used to induce micro damages on the coated layer. The stress-strain behaviors are characterized by results of the indentation tests.

• Journal of Welding and Joining
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• 제33권4호
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• pp.30-36
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• 2015

Austenite stainless steel(SA213-TP347H) has widely been used for the superheater & reheater tube in USC(ultra-supercritica) coal boiler because of its high creep rupture strength and anti-oxidation. But recently, the short-term failures have happened frequently in heat affected zone for only 4,000~15,000hours of service. Many investigations have been conducted to understand the failure mechanism. The root cause of failure was comfirmed to "strain induce participation hardening crack" or "reheat cracking". This mechanism often occurred due to weld residual stress and precipitation of the Cr, Nb carbides in the stabilized stainless steel such as TP347H. This paper presents an analysis of failure tube and effect of the sample tubes that conducting stabilizing heat treatment in site after 11,380hours & 16,961hours of service. Visual inspection was performed. In addition, microscopic characteristics was identified by O.M, SEM, and hardness test was carried out to find out the heat treatment effects. Failures seem to happen because of being not conducted stabilizing heat treatment in site. And another cause is inadequate weld parameter such as pass, ampere, voltage, inter-pass temperature. Thus, this paper has the purpose to describe that how to prevent similar failures in those weld-joints.

• Smart Structures and Systems
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• 제13권3호
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• pp.353-374
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• 2014

Recent studies were dedicated to the realization of measurements on stay-cable samples of different geometry and static conditions as available at several facilities. The elaboration of the acquired data showed a a satisfactory efficacy of the dampers made of NiTi wires in smoothing the cable oscillations. A further attempt to investigate the applicability of the achieved results beyond the specific case-studies represented by the tested cable-stayed samples is herein pursued. Comparative studies are carried out by varying the diameter of the NiTi wire so that similar measurements can be taken also from laboratory steel cables of reduced size. Details of the preparation of the Ni-Ti wires are discussed with particular attention being paid to the suppression of the creep phenomenon. The resulting shape of the hysteretic cycle differs according to the wire diameter, which affects the order of the fitting polynomial to be used when trying to retrieve the experimental results by numerical analyses. For a NiTi wire of given diameter, an estimate of the amount of dissipated energy per cycle is given at low levels of maximum strain, which correspond to a fatigue fracture life of the order of millions of cycles. The dissipative capability is affected by both the temperature and the cycling frequency at which the tests are performed. Such effects are quantified and an ageing process is proposed in order to extend the working temperature range of the damper to cold weathers typical of the winter season in Northern Europe and Canada. A procedure for the simulation of the shape memory alloy behavior in lengthy cables by finite element analysis is eventually outlined.

• 한국지반공학회지:지반
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• 제12권2호
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• pp.59-70
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• 1996

도로성토 하중저감공법중의 하나인 EPS공법은 초 경량재(20~30kg/m3)로서 연약지반상에 성토재로 사용하여 지반의 유효응력 증가분을 최소화함으로써 지지력과 침하에 대한 안정성을 쉽게 확보할 수 있고, 옹벽.교대등의 구조물 뒤채움재나 응급 복구용 채움재로 활용할 경우 토압 경감효과를 기대할 수 있다. 그러나 아직까지 국내에서는 공학적 성토 재료로서 활용하기 위한 물성 시험 방법이 정확히 확립되어 있지 않고 보온 재료로서의 시험 방법 및 품질 규정만이 KS에 규정되어 있다. 그로 인해 생산되는 EPS의 체계적인 토질공학적 시험 데이터 없이 성토 재료로 사용하고 있는 실정이다.따라서 본 연구에서는 공학적 재료로 활용하기 위해 필요한 강도특성, 변형특성, 흡수특성, 크리프특성 등에 대해 시험을 통하여 공학적 특성을 규명하였고, 보다 적합한 품질 규정의 제정 필요성과 일축압축강도에 의한 설계기준강도를 제안하였다.

• 한국구조물진단유지관리공학회 논문집
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• 제14권4호
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• pp.119-125
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• 2010

화재시 콘크리트의 성능저하는 재하조건, 열팽창 및 크리프 등과 같은 여러 가지 요인에 대하여 영향을 받을 수 있다. 1950년대부터 일본, 유럽, 미국과 같은 선진외국에서는 고온을 받은 콘크리트의 특성에 관하여 많은 연구들이 행해지고 있으나 재하조건, 가열방법, 시험체의 크기 및 가열장치의 성능 등과 같은 다양한 요인들이 연구자들의 독자적인 방법에 의해 실험이 진행되고 있다. 이에 본 연구에서는 시험체 크기, 가열속도, 시험방법이 유사한 일본 및 국내의 연구를 바탕으로 가열 및 재하를 받은 콘크리트의 역학적 성능에 대하여 분석하였으며, 상온 및 고온에서의 상관관계분석, 압축강도 추정곡선을 산출하여 CEN 및 CEB code와 비교 평가하였다. 그결과 재하가열을 받은 콘크리트는 $100^{\circ}C{\sim}400^{\circ}C$의 범위에서 역학적 특성에 대한 재평가의 필요성을 확인하였다.

• 한국농공학회지
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• 제39권3호
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• pp.72-82
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• 1997

In all inelastic deformations time rate effects are always present to some degree. Whether or not their exclusion has a significant influence on the prediction of the material behaviour depends upon several factors. In the study of structural components under static loading conditions at normal temperature it is accepted that time rate effects are generally not important. However metals, especially under high temperatures, exhibit simultaneously the phenomena of creep and viscoplasticity. In this study, elastoplastic and elasto-viscoplastic models include nonlinear geometrical effects were developed and several numerical examples are also included to verify the computer programming work developed here in this work. Comparisons of the calculated results, for the elasto-viscoplastic analysis of an internally pressurised thick cylinder under plane strain condition, have shown that the model yields excellent results. The results obtained from the numerical examples for an elasto-viscoplastic analysis of the Nuclear Reinforced Concrete Containment Structure(NRCCS) subjected to an incrementally applied internal pressure were summarized as follows : 1. The steady state hoop stress distribution along the shell layer of dome and dome wall junction part of NRCCS were linearly behave and the stress in interior surfaces was larger than that in exterior. 2.However in the upper part of the wall of NRCCS the steady state hoop stress in creased linearly from its inner to outer surfaces, being the exact reverse to the previous case of dome/dome-wall junction part. 3.At the lower part of wall of NRCCS, the linear change of steady state hoop stress along its wall layer began to disturb above a certain level of load increase.