• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.374.2-374.2
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• 2016

Volatile organic compounds (VOCs) in the atmosphere are harmful materials which influence indoor air environment and human health. Titanium dioxide ($TiO_2$) is photocatalyst extensively used in degradation of organic compound. To improve the photocatalytic activity in the visible light region, doping with non-metals element or loading noble metals on the surface of $TiO_2$ is generally proposed. In this study, N- doped $TiO_2$ having photocatalytic activity in visible light region was attached noble metal such as Pt, Ag, Pd, Au by coupling method. Catalytic activities of Noble metal coupled $N-TiO_2$ powders were evaluated by the improvement of their photocatalytic activities and the degradation of VOC gas. A UV-Vis spectrophotometer was used to measure the diffuse reflectance spectra of coupled $N-TiO_2$ sample. The photocatlytic activities of as prepared samples were characterized by the decoloration of aqueous MB solution under Xenon light source (UV and visible light). To measure of decomposition VOCs, ethylbenzene was selected for target VOC material and the concentration was monitored under UVLED irradiation in a closed chamber system. Adjusting the initial concentration of 10~12 ppm, to evaluate the removal characteristics by using the coupled $N-TiO_2$.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.227.1-227.1
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• 2015

산업이 발달하면서 다양한 화학물질이 배출되고 이로 인하여 환경이 오염되고 있으며, 특히, 대부분의 유기 화합물은 대기오염에 많은 영향을 주는 물질로 알려져 있다. 최근 유기 화합물을 제거하기 위해서 UV와 가시광에서 반응하는 광촉매 연구가 진행되고 있다. 본 연구에서는 밴드갭에 변화를 주는 doped $TiO_2$와 가시광에서 반응하는 조촉매를 이용하여 광촉매의 특성을 향상시키는 coupled $TiO_2$를 제조하였다. Doped $TiO_2$를 제조하기 위해서 비금속 물질인 질소(nitrogen)을 사용하였고, coupled $TiO_2$는 graphine oxide(GO)를 환원하여 $TiO_2$-RGO 촉매를 제조하였다. N-$TiO_2$와 $TiO_2$-RGO의 광학 특성을 평가하기 위해서 UV/Vis 분광광도계를 사용하였다. Methylene blue(MB)와 methyl orange(MO)가 분해되는 반응을 통해서 N-$TiO_2$와 $TiO_2$-RGO의 광촉매 특성을 평가하였다. 또한, MB와 MO 분해 테스트에 395 nm long pass filter를 이용하여 가시광에서의 광촉매 활성을 평가하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.9
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• pp.681-685
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• 2012

We investigated the dry etching characteristics of TiN in $TiN/Al_2O_3$ gate stack using a inductively coupled plasma system. TiN thin film is etched by BCl3/He plasma. The etching parameters are the gas mixing ratio, the RF power, the DC-bias voltages and process pressures. The highest etch rate is in $BCl_3/He$ (25%:75%) plasma. The selectivity of TiN thin film to $Al_2O_3$ is pretty similar with $BCl_3/He$ plasma. The chemical reactions of the etched TiN thin films are investigated by X-ray photoelectron spectroscopy. The intensities of the Ti 2p and the N 1s peaks are modified by $BCl_3$ plasma. Intensity and binding energy of Ti and N could be changed due to a chemical reaction on the surface of TiN thin films. Also we investigated that the non-volatile byproducts such as $TiCl_x$ formed by chemical reaction with Cl radicals on the surface of TiN thin films.

• Transactions on Electrical and Electronic Materials
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• v.12 no.4
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• pp.144-147
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• 2011

In this work, we present a study regarding the etching characteristics on titanium nitride (TiN) thin films using an inductively coupled plasma system. The TiN thin film was etched using a $N_2/BCl_3$/Ar plasma. The studied etching parameters were the gas mixing ratio, the radio frequency (RF) power, the direct current (DC)-bias voltages, and the process pressures. The baseline conditions were as follows: RF power = 500 W, DC-bias voltage = -150 V, substrate temperature = $40^{\circ}C$, and process pressure = 15 mTorr. The maximum etch rate and the selectivity of the TiN to the $SiO_2$ thin film were 62.38 nm/min and 5.7, respectively. The X-ray photoelectron spectroscopy results showed no accumulation of etching byproducts from the etched surface of the TiN thin film. Based on the experimental results, the etched TiN thin film was obtained by the chemical etching found in the reactive ion etching mechanism.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.74-74
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• 2009

Titanium nitride has been used as hardmask for semiconductor process, capacitor of MIM type and diffusion barrier of DRAM, due to it's low resistivity, thermodynamic stability and diffusion coefficient. Characteristics of the TiN film are high intensity and chemical stability. The TiN film also has compatibility with high-k material. This study is an experimental test for better condition of TiN film etching process. The etch rate of TiN film was investigated about etching in $BCl_3/Ar/O_2$ plasma using the inductively coupled plasma (ICP) etching system. The base condition were 4 sccm $BCl_3$ /16 sccm Ar mixed gas and 500 W the RF power, -50 V the DC bias voltage, 10 mTorr the chamber pressure and $40\;^{\circ}C$ the substrate temperature. We added $O_2$ gas to give affect etch rate because $O_2$ reacts with photoresist easily. We had changed $O_2$ gas flow rate from 2 sccm to 8 sccm, the RF power from 500 W to 800 W, the DC bias voltage from -50 V to -200 V, the chamber pressure from 5 mTorr to 20 mTorr and the substrate temperature from $20\;^{\circ}C$ to $80\;^{\circ}C$.

• Transactions on Electrical and Electronic Materials
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• v.13 no.3
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• pp.144-148
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• 2012

In this work, we investigated to the etching characteristics of $TiO_2$ thin film and the selectivity using the inductively coupled plasma system. The etch rate and the selectivity were obtained with various gas mixing ratios. The maximum etch rate of $TiO_2$ thin film was 61.6 nm/min. The selectivity of $TiO_2$ to TiN, and $TiO_2$ to $SiO_2$ were obtained as 2.13 and 1.39, respectively. The etching process conditions are 400 W for RF power, -150 V for DC-bias voltage, 2 Pa for the process pressure, and $40^{\circ}C$ for substrate temperature. The chemical states of the etched surfaces were investigated with X-ray photoelectron spectroscopy (XPS). Its analysis showed that the etching mechanism was based on the physical and chemical pathways in the ion-assisted physical reaction.

• Journal of the Korean institute of surface engineering
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• v.41 no.5
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• pp.189-193
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• 2008

In this study, we carried out an investigation of the etching characteristics (etch rate, selectivity to $SiO_2$ and $HfO_2$) of TiN thin films in the $CH_4$/Ar inductively coupled plasma. The maximum etch rate of $274\;{\AA}/min$ for TiN thin films was obtained at $CH_4$(80%)/Ar(20%) gas mixing ratio. At the same time, the etch rate was measured as function of the etching parameters such as RF power, Bias power, and process pressure. The X-ray photoelectron spectroscopy analysis showed an efficient destruction of the oxide bonds by the ion bombardment as well as showed an accumulation of low volatile reaction products on the etched surface. Based on these data, the ion-assisted chemical reaction was proposed as the main etch mechanism for the $CH_4$ containing plasmas.

• Transactions on Electrical and Electronic Materials
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• v.12 no.3
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• pp.106-109
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• 2011

We investigated the etching characteristics of titanium nitride (TiN) thin film in $BCl_3$/Ar inductively coupled plasma. The etching parameters were the gas mixing ratio, radio frequency (RF) power, direct current (DC)-bias voltages and process pressures. The standard conditions were as follows: total flow rate = 20 sccm, RF power = 500 W, DC-bias voltage = -100 V, substrate temperature = $40^{\circ}C$, and process pressure = 15 mTorr. The maximum etch rate of TiN thin film and the selectivity of TiN to $Al_2O_3$ thin film were 54 nm/min and 0.79. The results of X-ray photoelectron spectroscopy showed no accumulation of etch byproducts from the etched surface of TiN thin film. The TiN film etch was dominated by the chemical etching with assistance by Ar sputtering in reactive ion etching mechanism, based on the experimental results.

• Bulletin of the Korean Chemical Society
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• v.32 no.8
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• pp.2607-2610
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• 2011

Monodispersed Ag/$TiO_2$ core/shell nanoparticles were synthesized in solution via colloid-seeded deposition process using Ag nanoparticles as colloid seeds and $Ti(SO_4)_2$ as Ti-source respectively. Silver nitrate was reduced to Ag nanoparticles with $N_2H_4{\cdot}H_2O$ in the presence of CTAB as stabilizing agent. The titania sols hydrolyzed by the $Ti(SO_4)_2$ solution deposited on the surface of Ag nanoparticles to form the Ag/$TiO_2$ core/shell nanoparticles. Inductively coupled plasma atomic emission spectrometry (ICP-AES) showed low amount of Ag ion leaching from the Ag/$TiO_2$ core/shell nanoparticles. The Ag/$TiO_2$ core/shell nanoparticles indicated excellent antibacterial effects against Escherichia coli and maintained long-term antibacterial property.

• Korean Journal of Materials Research
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• v.9 no.11
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• pp.1129-1136
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• 1999

TIN films were prepared on Si(100) substrate by ICP-CVD(inductive1y coupled plasma enhanced chemical vapor deposition) using TEMAT(tetrakis ethylmethamido titanium : Ti$[\textrm{N}\textrm{(CH)}_{3}\textrm{C}_{2}\textrm{H}_{5}]_{4}$) precursor at various deposition conditions. Phase, microstructure, and the electrical properties of TIN films were characterized by x-ray diffraction (XRD), x-ray photoelectron spectroscopy (XPS), high resolution transmission electron microscopy (HRTEM) and electrical measurements. Polycrystalline TiN films with B1 structure were grown at temperatures over $200^{\circ}C$. Preferentially oriented along TiN(111) films were obtained at temperatures over $300^{\circ}C$ with the flow rates of 10, 5, and 5 sccm for TEMAT, $\textrm{N}_{2}$ and Ar gas. The TiN/Si(100) interface was flat and no chemical reaction between TIN and $\textrm{SiO}_2$ was found. The resistivity, carrier concentration and the carrier mobility for the TiN sample prepared at $500^{\circ}C$ are 21 $\mu\Omega$cm, 9.5$\times\textrm{10}^{18}\textrm{cm}^{-3}$ and $462.6\textrm{cm}^{2}$/Vs, respectively.