• Title/Summary/Keyword: copper-containing

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Preparation of PVA-D2EHPA/TOPO Beads by Immobilizing Extractants D2EHPA and TOPO with PVA and Removal Characteristics of Copper Ions from Aqueous Solution (추출제 D2EHPA와 TOPO를 PVA에 고정화한 PVA-D2EHPA/TOPO 비드의 제조와 수중의 구리 이온 제거 특성)

  • Kam, Sang-Kyu;Park, Jeong-Min;Lee, Min-Gyu
    • Journal of Environmental Science International
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    • v.23 no.9
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    • pp.1583-1591
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    • 2014
  • PVA-D2EHPA/TOPO beads containing two extractants, di-(2-ethylhexyl) phosphoric acid (D2EHPA) and trioctylphoshine oxide (TOPO) were prepared for the removal of copper ions from aqueous solution. The prepared PVA-D2EHPA/TOPO beads were characterized by SEM and FT-IR. The removal characteristics of copper ions by PVA-D2EHPA/TOPO beads was investigated using batch and continuous systems. In batch experiments, the maximum removal capacity calculated from Langmuir isotherm model was 18.6 mg/g and the optimal pH was in the range of 4.5~6. The continuous experiments showed that the removal capacity of copper ions increased with increasing inlet copper ion concentrations and bed heights, but decreased with increasing inlet flow rates.

The Effect of Hydroxy Ethyl Cellulose(HEC) on the Surface Morphology and Mechanical Characteristis of Copper Electrodeposition (구리 전해도금 시 표면형상과 기계적 특성에 미치는 HEC효과)

  • Woo, Tae-Gyu;Park, Il-Song;Lee, Hyun-Woo;Seol, Kyeong-Won
    • Korean Journal of Materials Research
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    • v.16 no.11
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    • pp.710-714
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    • 2006
  • The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/$cm^2$ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).

Total value recovery in the copper smelting and refining operations

  • Kim Joe. Y.;Kong Bong S.
    • 한국지구물리탐사학회:학술대회논문집
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    • 2003.11a
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    • pp.590-597
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    • 2003
  • Processing and smelting of copper containing sulphide concentrates result in the accumulation of impurities into various process streams. All primary copper smelters and refineries around the world produce significant amounts of slag, dust, sludge, residues and others, which contain copper and precious metals. The recovery of these valuable metals is essential to the overall economics of the smelting process. Physical, chemical and mineralogical characterization of particular slag and Cottrell dusts from primary smelters and $Dor\'{e}$ furnace (TBRC) slag and Pressure Leached Anode slimes from a copper refinery have been carried out to understand the basic behind the recovery processes. Various process options have been evaluated and adapted for the treatment of slag from different smelting furnaces and Cottrell dusts as well as the intermediate products from copper refineries. Besides the hydro- or pyro-metallurgical treatments, the above mentioned physical separation options such as magnetic, gravity separation, flotation and precipitation flotation processes have been successfully identified and adapted as the possible process options to produce a Cu-rich or precious metal-rich concentrates for in-house recycling and other valued by-product for further treatment. The results of laboratory, pilot plant and production operations are presented, and incorporation of several alternative flowsheet is discussed in this paper.

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MINERAL PROCESSING and COPPER EXRACTIVE METALLURGY Complete Metal Recovery

  • Kim, J.Y.
    • Proceedings of the Korean Institute of Resources Recycling Conference
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    • 2003.10a
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    • pp.22-34
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    • 2003
  • Processing and smelting of copper containing sulphide concentrates result in the accumulation of impurities into various process streams. All primary copper smelters and refineries around the world produce significant amounts of slag, dust, sludge, residues and others, which contain copper and precious metals. The recovery of these valuable metals is essential to the overall economics of the smelting process. Physical, chemical and mineralogical characterization of particular slag and Cottrell dusts from primary smelters and Dore furnace (TBRC) slag and Pressure Leached Anode slimes from a copper refinery have been carried out to understand the basic behind the recovery processes. Various process options have been evaluated and adapted for the treatment of slag from different smelting furnaces and Cottrell dusts as well as the intermediate products from copper refineries. Besides the hydro- or pyre-metallurgical treatments, the above mentioned physical separation options such as magnetic, gravity separation, flotation and precipitation flotation processes have been successfully identified and adapted as the possible process options to produce a Cu-rich or precious metal-rich concentrates for in-house recycling and other valued by-product for further treatment. The results of laboratory, pilot plant and production operations are presented, and incorporation of several alternative flowsheet is discussed in this paper.

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The Heavy Metal Tolerant Soil Bacterium Achromobacter sp. AO22 Contains a Unique Copper Homeostasis Locus and Two mer Operons

  • Ng, Shee Ping;Palombo, Enzo A.;Bhave, Mrinal
    • Journal of Microbiology and Biotechnology
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    • v.22 no.6
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    • pp.742-753
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    • 2012
  • Copper-containing compounds are introduced into the environment through agricultural chemicals, mining, and metal industries and cause severe detrimental effects on ecosystems. Certain microorganisms exposed to these stressors exhibit molecular mechanisms to maintain intracellular copper homeostasis and avoid toxicity. We have previously reported that the soil bacterial isolate Achromobacter sp. AO22 is multi-heavy metal tolerant and exhibits a mer operon associated with a Tn21 type transposon. The present study reports that AO22 also hosts a unique cop locus encoding copper homeostasis determinants. The putative cop genes were amplified from the strain AO22 using degenerate primers based on reported cop and pco sequences, and a constructed 10,552 base pair contig (GenBank Accession No. GU929214). BLAST analyses of the sequence revealed a unique cop locus of 10 complete open reading frames, designated copSRABGOFCDK, with unusual separation of copCD from copAB. The promoter areas exhibit two putative cop boxes, and copRS appear to be transcribed divergently from other genes. The putative protein CopA may be a copper oxidase involved in export to the periplasm, CopB is likely extracytoplasmic, CopC may be periplasmic, CopD is cytoplasmic/inner membrane, CopF is a P-type ATPase, and CopG, CopO, and CopK are likely copper chaperones. CopA, B, C, and D exhibit several potential copper ligands and CopS and CopR exhibit features of two-component regulatory systems. Sequences flanking indicate the AO22 cop locus may be present within a genomic island. Achromobacter sp. strain AO22 is thus an ideal candidate for understanding copper homeostasis mechanisms and exploiting them for copper biosensor or biosorption systems.

On the Stannic Oxide Thin Film (산화 주석 박막에 대하여)

  • 박순자
    • Journal of the Korean Ceramic Society
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    • v.13 no.2
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    • pp.8-16
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    • 1976
  • The conductive transparent film is prepared by spraying thin salt solution. In stannic chloride solution as a base solution, various dopants such as Al, Co, Cu and Ni were dissolved respectively as a chloride state and then the films were made by spraying solutions on hot glass plates. The properties of them were compared with those of the stannic salt single component film. The films doped with copper oxide and nickle oxide were improved by decreasing their sheet resistivity and temperature coefficient of resistivity. In comparison with the sheet resistivity and temperature coefficient of resistivity of stannic oxide single component film, being 2.5 K ohm/$\textrm{cm}^2$ and -1650ppm/$^{\circ}C$ respectively, its values of the film containing 15 mol % of copper oxide and formed at 40$0^{\circ}C$ were 2.5K ohm/$\textrm{cm}^2$ and -920ppm/$^{\circ}C$ respectively. The film containing 15 mol % of nickel oxide and formed at 50$0^{\circ}C$ has shown its sheet resistivity and temperature coefficient 0.7 K ohm/$\textrm{cm}^2$ and -940ppm/$^{\circ}C$ respectively.

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Cross-flow Nanofiltration of PCB Etching Waste Solution Containing Copper Ion (구리이온을 함유한 PCB 폐에칭액의 Cross-flow 나노여과)

  • Park, Hye-Ri;Nam, Sang-Won;Youm, Kyung-Ho
    • Korean Chemical Engineering Research
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    • v.52 no.2
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    • pp.272-277
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    • 2014
  • In this study the nanofiltration (NF) membrane treatment of a sulfuric acid waste solutions containing copper ion ($Cu^{+2}$) discharging from the etching processes of the printed circuit board (PCB) manufacturing industry has been studied for the recycling of acid etching solution. SelRO MPS-34 4040 NF membrane from Koch company was tested to obtain the basic NF data for recycling of etching solution and separation efficiency (total rejection) of copper ion. NF experiments were carried out with a cross-flow membrane filtration laboratory system. The permeate flux was decreased with the increasing copper ion concentration in sulfuric acid solution and lowering pH of acid solution, and its value was the range of $4.5{\sim}23L/m^2{\cdot}h$. Total rejection of copper ion was decreased with the increasing copper ion concentration, lowering pH of acid solution and decreasing cross-flow rate. The total rejection of copper ion was more than 70% at the experimental condition. The SelRO MPS-34 4040 NF membrane was represented the stable flux and rejection for 1 year operation.

The Exon 2 Deletion of the COMMD1 Causing Copper Toxicosis in Bedlington Terriers in Korea (한국 베들링턴 테리어에서 구리중독증을 유발하는 COMMD1 유전자의 exon 2 결손변이)

  • Kim, Yun-Gi;Kim, So-Yeon;Yun, Young-Min
    • Journal of Veterinary Clinics
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    • v.32 no.1
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    • pp.1-4
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    • 2015
  • This study was performed to survey prevalence of Copper metabolism domain containing 1 (COMMD1) mutation using molecular diagnostic method in a population of Bedlington terriers in Korea. COMMD1 gene (formerly MURR1) functions as a regulator of sodium transport and copper metabolism. The deletion of exon 2 of the COMMD1 gene causes copper toxicosis in Bedlington terriers. Bedlington terriers with this autosomal recessive disorder were shown to have the elevated liver copper levels due to genetic derangement in the biliary copper excretion pathway. DNA samples were extracted from whole blood collected from 257 Bedlington terriers (109 males, 148 females) of pet dog clubs in Korea. A multiplex PCR was carried out to detect of exon 2 deletion of COMMD1 gene. In this study, it was possible to know the existence and prevalence of exon 2 deletion of COMMD1 in Bedlington terriers in Korea. Of the 257 samples, 131 (51%) were wild type homozygous for the normal COMMD1 gene, 108 (42%) were heterozygous, having both normal and mutated copy of the COMMD1 gene. The eighteen (7%) were mutant type homozygous. The results of genetic analysis could help establish proper management strategy and selective breeding program to prevent COMMD1 mutation in Bedlington terriers in Korea.