• Tribology and Lubricants
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• v.36 no.4
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• pp.207-214
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• 2020

In this study, we investigated the effects of copper and copper-alloy on the frictional and wear properties of low-steel friction material. The proportions of copper and copper-alloy in the brake friction materials used in passenger cars are very high (approximately 5-20% weight), and these materials have significant effects on friction and wear characteristics. In this study, the effects of cupric ingredients, such as the copper fiber and brass fiber, are investigated using the friction materials based on commercial formulations. After the copper and brass fibers from the same formulation were removed, the frictional and wear characteristics were evaluated to determine the influence of the copper and copper-alloy. We evaluated the frictional and wear characteristics by simulating various braking conditions using a 1/5 scale dynamometer. The results show that the friction material containing copper and brass fibers have excellent frictional stability and a low wear rate compared to the friction material that does not contain copper and brass fibers. These results are attributed to the excellent ductility, moderate melting point, high strength, and excellent thermal conductivity of copper and copper-alloy. We analyzed the surfaces of the friction materials before and after the performing the friction tests using a scanning electron microscope-energy dispersive X-ray spectroscope, confocal microscope, and roughness tester to verify the frictional behavior of copper and copper-alloy. In future studies, it will be applied to the development of copper-free friction materials based on the results of this study.

• Journal of Microbiology and Biotechnology
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• v.11 no.6
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• pp.964-972
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• 2001

The kinetics of copper ion biosorption by Pseudomonas stutzeri cells immobilized in alginate was investigated. During the first few minutes of the metal uptake, the copper biosorption was rapid and then became progressively slower until an equilibium was rapid, and then became progressively slower until an equilibrium was reached. At a biomass concentration of 100g/l, the copper biosorption reaction reached approximately 90% of the equilibrium position within 30 min. A Freundich-type adsorption isotherm model was constructed based on kinetics with different amounts of biomass. When using this model, the experimental values only agreed well with the predicted values in a solution containing less than 200 mg/l Cu(II). Desorption of the bound copper ions was achieved using electrolytic solutions of HCl, $H_2SO_4$, EDTA, and NTA (0.1 or 0.5 M). Metal desorption with 0.1 M NTA allowed the reuse of the biosorbent for at least ten consecutive biosorption/desorption cycles, without an apparent decrease in its metal biosorption capability. A packed-bed column reactor of the immobilized biomass removed approximately 95% of the metal in the first 30 liter of wastewater [containing 100 mg/l Cu(II)] delivered at a rate of 20 L/day, and, thereafter, the rate gradually decreased.

• Bulletin of the Korean Chemical Society
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• v.34 no.12
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• pp.3615-3620
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• 2013

Two novel copper(II) bromide complexes with pyridine containing Schiff base ligands, $Cu(pmed)Br_2$ and $Cu(pmed)Br_2$ where pmed = N'-((pyridin-2-yl)methylene)ethane-1,2-diamine (pmed) and dpmed = N,N-diethyl-N'-((pyridin-2-yl)methylene)ethane-1,2-diamine (dpmed) were synthesized and characterized using X-ray single crystal structure analysis, optical and magnetic susceptibility measurements. Crystal structural analysis of $Cu(pmed)Br_2$ showed that the copper(II) ion has a distorted square-pyramidal geometry with the trigonality index of ${\tau}=0.35$ and two intermolecular hydrogen bonds, which result in the formation of two dimensional networks in the ab plane. On the other hand, $Cu(pmed)Br_2$ displayed a near square-pyramidal geometry with the value of ${\tau}=0.06$. In both compounds, the NNN Schiff base and one Br atom occupy the basal plane, whereas the fifth apical position is occupied by the other Br atom at a greater Cu-Br apical distance. The reported complexes show $g_{\mid}$ > $g_{\perp}$ > 2.0023 with a $d_{x2-y2}$ ground state and a penta-coordinated square pyramidal geometry. Variable temperature magnetic susceptibility measurements showed that the developed copper(II) complexes follow the Curie-Weiss law, that is there are no magnetic interactions between the copper(II) ions since the Cu--Cu distance is too far for magnetic contact.

• Journal of Powder Materials
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• v.16 no.2
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• pp.131-137
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• 2009

This paper deals with the effects of the surfactant and preplate process (sensitization and activation) on electroless copper plating on carbon nano-fiber (CNF). Ultrasonic irradiation was applied both during dispersion of CNF and during electroless plating containing preplate process. The dispersion of CNF and flatness of the plated copper film were discussed based on the changes in surfactant concentration and preplate process time. It was clearly shown that high concentration of surfactant and long time of preplate process could promote the agglomeration of CNF and uneven copper plating on CNF.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.203-206
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• 2004

Copper-based bulk amorphous alloy composite was synthesized by using the copper-coated $Cu_{54}Ni_{6}Zr_{22}Ti_{18}$ amorphous powder which was obtained by argon gas atomization. The amorphous powder having a super-cooled liquid region of 53 K was coated by crystalline copper by electroless coating. The consolidation was carried out by manufacturing performs and by the subsequent warm extrusion at 743 K. During the compression test at the room temperature, the composite containing a large fraction of crystalline copper displayed a larger plastic strain after yielding. FEM simulation revealed change in fracture modes in the composites depending on the amount of crystalline copper in the composites.

• Journal of Surface Science and Engineering
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• v.39 no.5
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• pp.223-228
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• 2006

The current efficiency of copper anode containing impurities in copper sulfate solution for electrorefining was studied at various current type such as direct current, variable current and periodic reverse current. The passivity behavior was investigated by galvanostatic technique. The results obtained were that current efficiency of variable current was higher than those of direct current and periodic reverse current. The increased current efficiency could be explained by the formation of slime structure with lower average resistance due to variable current. The frequency of various factors in variable current condition has a greatest effect on current efficiency. It appeared that frequency increased current efficiency when increased from 1 to 4, but further increases did not have an effect.

• Journal of the Korean Chemical Society
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• v.20 no.4
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• pp.277-279
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• 1976

A potentiometric titration method has been developed for the titration of copper with 2,5-dimercapo-1,3,4-thiadizole in aqueous solution using a silver electrode as an indicator electrode vs. the standard calomel electrode as a reference electrode. The 2,5-dimercapto-1,3,4-thiadiazole is very sensitive reagent for copper, which has been found to be highly selective for potentiometric determination of copper. Direct titration of trace amount of copper (0.02${\sim}$0.1 mg) is possible in the presence of a number of foreign ions in aqueous solution containing potassium hydrogen phthalate and sodium fluoride as masking agent under atmosphere.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2000.11a
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• pp.318-331
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• 2000

Electrical and tribological behaviours of a copper-graphite brush in a slipring-brush assembly were investigated to evaluate the characteristics of electric signal transmission between a slipring and a brush. Five brush materials containing different amounts of copper and graphite were studied. The result showed that a copper-graphite brush at a particular graphite content exhibited the most stable frictional and electrical behaviour suggesting an optimum amount of a solid lubricant in a metal-graphite brush system. Microscopic observation and the surface analysis showed good agreements with this phenomena. In addition, the deviation of the friction coefficient and electric signal distortion has a close relationship with a microscopic mechanical vibration and the change of a real contact area.

• Journal of Environmental Science International
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• v.12 no.10
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• pp.1055-1060
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• 2003

Adsorption on goethite of individual component from a solution containing phosphate, sulfate, or copper ion was investigated. Competitive adsorption in the binary and ternary solution systems composed of phosphate, sulfate, and copper ions was also investigated. In competitive adsorption systems with phosphate and sulfate ions, the presence of phosphate ion reduced the adsorption of sulfate ion largely. On the other hand, the presence of sulfate ion caused only a small decrease in phosphate adsorption. This result suggests that phosphate ion is a stronger competitor for adsorption on goethite than sulfate ion, which is consistent with the higher affinity of phosphate for the surface compared to sulfate ion. Compared to the results from single-sorbate systems, adsorption of copper ion in the binary system of sulfate ion and copper ion was found to be enhanced in the presence of sulfate ion. Addition of sulfate ion to the binary system of copper ion and phosphate ion resulted in a small enhancement in copper sorption. This result implies that the presence of sulfate ion promotes adsorption of the ternary complex FeOHCuSO$_4$. The adsorption isotherms could be well described by the Langmuir adsorption equation.

• Korean Journal of Metals and Materials
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• v.48 no.3
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• pp.218-224
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• 2010

Direct copper electroplating on Mg alloy AZ31B was carried out in a traditional pyrophosphate copper bath containing potassium fluoride. Electrochemical impedance spectroscopy and polarization methods were used to study the effects of added potassium fluoride on electrochemical behavior. The chemical state of magnesium alloy in the electroplating bath was analyzed by X-ray photoelectron spectroscopy. Adhesion of the copper electroplated layer was also tested. Due to the added potassium fluoride, a magnesium fluoride film was formed in the pyrophosphate copper bath. This fluoride film inhibits dissolution of Mg alloy and enables to electroplate copper directly on it. A dense copper layer was formed on the Mg alloy. Moreover, this copper layer has a good adhesion with Mg alloy substrate.