Journal of Powder Materials (한국분말재료학회지)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
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Effects of Surfactant and Preplate Process on Electroless Copper Plating on Carbon Nano-fiber

탄소나노섬유 표면 구리 무전해 도금에 미치는 분산제와 도금 전처리의 영향

  • Han, Jun-Hyun (Advanced Functional Materials Research Center, Korea Institute of Science & Technology) ;
  • Seok, Hyun-Kwang (Advanced Functional Materials Research Center, Korea Institute of Science & Technology) ;
  • Lee, Sang-Soo (Hybrid Materials Research Center, Korea Institute of Science & Technology) ;
  • Jee, Kwang-Koo (Advanced Functional Materials Research Center, Korea Institute of Science & Technology)
  • 한준현 (한국과학기술연구원 기능금속 연구센터) ;
  • 석현광 (한국과학기술연구원 기능금속 연구센터) ;
  • 이상수 (한국과학기술연구원 하이브리드재료 연구센타) ;
  • 지광구 (한국과학기술연구원 기능금속 연구센터)
  • Published : 2009.04.28
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Abstract

This paper deals with the effects of the surfactant and preplate process (sensitization and activation) on electroless copper plating on carbon nano-fiber (CNF). Ultrasonic irradiation was applied both during dispersion of CNF and during electroless plating containing preplate process. The dispersion of CNF and flatness of the plated copper film were discussed based on the changes in surfactant concentration and preplate process time. It was clearly shown that high concentration of surfactant and long time of preplate process could promote the agglomeration of CNF and uneven copper plating on CNF.

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References

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