• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.37-42
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• 2007

Copper deposition studies have been actively studied since interests on 3D SiP were increased. The defects inside via can be easily formed due to the current density differences on entrance, bottom and wall of via. So far many different additives and current types were discussed and optimized to obtain void-free copper via filling. In this research acid cupric sulfate plating bath containing additives such as PEG, SPS, JGB, PEI and wave current applied electroplating were examined. The size and shape of grain were influenced by the types of organic additives. The cross section of specimen were analyzed by FESEM. When PEI was added, the denser copper deposits were obtained. Electroplaing time was reduced when 2 step via filling was employed.

• Journal of the Korean Chemical Society
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• v.36 no.1
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• pp.95-99
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• 1992

A spectrophotometric method for the determination of copper using N,N'-Oxalylbis(salicylaldehyde hydrazone) as a chromogenic reagent has been developed. Determination has been performed by measuring the absorbances of the copper complexes in solutions containing 60% dimethylformamide (pH 2) at 422 nm. The method allows the determination of 0.4${\sim}$1.8 ${\mu}$g/ml of copper and has been applied to its determination in synthetic mixtures and alloy samples.

• Corrosion Science and Technology
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• v.15 no.6
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• pp.311-313
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• 2016

The anodic dissolution behavior of copper and brass in an electrolyte solution of 0.5M NaCl containing 0.5 mM $NaHCO_3$ was investigated by electrochemical impedance spectroscopy. The Nyquist plots of the copper impedance described a small loop in the high-frequency range and a large locus in the low-frequency range. Additionally, the features of the impedance spectrum of the brass were similar to those of the copper. This indicates that the copper-enriched layer formed on the brass surface due to the selective dissolution of the zinc from the surface. In addition, the rest potential and the anodic polarization curve for each sample were measured in order to discuss the selective dissolution of the zinc from the brass surface.

• Bulletin of the Korean Chemical Society
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• v.30 no.4
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• pp.853-856
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• 2009

Highly polycrystalline copper indium diselenide (CuInSe2, CIS) thin films were deposited on glass or ITO glass substrates by two-stage metal organic chemical vapor deposition (MOCVD) at relatively mild conditions, using Cuand In/Se-containing precursors. First, pure Cu thin film was prepared on glass or ITO glass substrates by using a single-source precursor, bis(ethylbutyrylacetate)copper(II) or bis(ethylisobutyrylacetato)copper(II). Second, on the resulting Cu films, tris(N,N-ethylbutyldiselenocarbamato)indium(III) was treated to produce CuInSe2 films by MOCVD method at 400 ${^{\circ}C}$. These precursors are very stable in ambient conditions. In our process, it was quite easy to obtain high quality CIS thin films with less impurities and uniform thickness. Also, it was found that it is easy to control the stoichiometric ratio of relevant elements on demands, leading to Cu or In rich CIS thin films. These CIS films were analyzed by XRD, SEM, EDX, and Near-IR spectroscopy. The optical band gap of the stoichiometric CIS films was about 1.06 eV, which is within an optimal range for harvesting solar radiation energy.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.6
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• pp.372-378
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• 2019

Traditional ceramic glazes formulated with copper oxide (CuO) exhibited antibacterial properties on Staphylococcus aureus (Gram Positive) and Escherichia coli (Gram Negative). All the ceramic glazes containing CuO showed antibacterial behavior when fired in reducing atmosphere. However, some of copper glazes presented antibacterial behavior and had no antibacterial properties at all when sintered in an oxidizing atmosphere. To elucidate the antibacterial mechanism, ceramic glazes were studied for phase and microstructure analysis, dissolution behavior and surface zeta potential. Metallic copper was precipitated in the glaze layer when sintered in reducing atmosphere. Less than 0.05 ppm of Cu ion was dissolved from glazes. Ca ion was most dissolved among all the samples. Glaze surface was highly negatively charged when CuO was added over 3 wt.% regardless of the sintering atmosphere. The antibacterial behavior of ceramic glazes seemed to be directly related to the dissolution behavior of cations, but the antibacterial behavior of oxidized specimens was not explained by the dissolution behavior. Surface potential of ceramic glazes appeared to play an auxiliary role in antibacterial properties.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1999.06a
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• pp.255-264
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• 1999

Friction characteristics of automotive friction materials containing different metallic fibers rubbing against Al-MMC and cast iron disk specimens have been studied. Friction materials containing aluminum, copper or low steel carbon fiber were tested. Friction tests were composed of three different phases to investigate the effect of temperature, pressure, speed, and drag time. The results showed that the friction material containing Al fibers has lower friction force and wear amount than the others with Cu or Steel fiber. On the other hand, the wear of friction material was severe in the case of using Al-MMC rotors. These results showed that the thermal decomposition of solid lubricants (and organic components), formation of transfer layer, and SiC particles in the AI-MMC rotor play crucial roles in determining the friction characteristics.

• Proceedings of the Korean Institute of Resources Recycling Conference
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• 2005.10a
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• pp.197-197
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• 2005

• Journal of Environmental Science International
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• v.19 no.9
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• pp.1177-1185
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• 2010

To examine the potency of biosorbent, the adsorption capacity of Pseudomonas cepacia H42 isolated from fresh water plant root was compared with Saccharomyces cerevisiae SEY2102 on bases of biomass, concentration of heavy metal, presence of light metals, immobilized cell, and ion exchange resin. P. cepacia H42 biomass of 0.05-0.5 g/L increased adsorption and above 1.0 g/L of yeast biomass was the most effective in adsorption. By applying the same amount of biomass, lead showed the highest adsorption on two strains and the adsorption strength was lead>copper>cadmium on both strains. The high heavy metal concentration induced the high adsorption capacity. P. cepacia H42 adsorption was in the order of copper>lead>cadmium and lead>copper>cadmium by yeast in 10 mg/L. Both strain showed same adsorption strength in the order of lead>copper>cadmium in 100 mg/L and 1000 mg/L. The adsorption capacity of both yeast and P. cepacia H42 was decreased in the presence of light metals and the order of cadmium>copper>lead. $Mg^{2+}$ induced the least adsorption while $Na^+$ induced highest adsorption. The adsorption capacity of immobilized yeast and P. cepacia H42 was detected between 200-400 mL in flow volume and decreased in the presence of light metals. Ion exchange containing light metals caused 30-50% adsorption reduction on both strains.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.19.2-19.2
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• 2010

Printed electronics using printing process has broadened in all respects such as electrics (lighting, batteries, solar cells etc) as well as electronics (OLED, LCD, E-paper, transistor etc). Copper is considered to be a promising alternative to silver for printed electronics, due to very high conductivity at a low price. However, Copper is easily oxidized, and its oxide is non-conductive. This is the highest hurdle for making copper inks, since the heat and humidity that occurs during ink making and printing simply accelerates the oxidation process. A variety of chemical treatments including organic capping agents and metallic coating have been used to slow this oxidation. We have established synthetic conditions of copper nanoparticles (CuNPs) which are resistant to oxidation and average diameter of 20 to 50nm. Specific resistivity should be less than $4\;{\mu}{\Omega}{\cdot}cm$ when sintered at lower temperature than $250^{\circ}C$ to be able to apply to conductive patterns of FPCBs using ink-jet printing. Through this study, the parameters to control average diameter of CuNPs were found to be the introduction of additive agent, the feeding rate of reducing agent, and reaction temperature. The CuNPs with various average diameters (58, 40, 26, 20nm) could be synthesized by controlling these parameters. The dispersed solution of CuNPs with an average size of 20 nm was made with nonpolar solvent containing 3 wt% of binder, and then coated onto glass substrate. After sintering the coated substrates at $250^{\circ}C$ for 30 minutes in nitrogen atmosphere, metallic copper film resulted in a specific resistivity of $4.2\;{\mu}{\Omega}{\cdot}cm$.

• The Korean Journal of Pesticide Science
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• v.19 no.3
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• pp.323-328
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• 2015

Control efficacy was investigated with fungicides as 3 copper compound, 3 antibiotic fungicides and one fungicide containing to quinolone against the growth of Ralstonia solanacearum on NA medium and the disease occurrence on pepper seedlings. Among 7 fungicides, oxytetracycline was shown the highest activity against a growth of the pathogen in the agar diffusion method, but validamycin showed no activity against the pathogen. With $1000{\mu}g\;mL^{-1}$ of each copper fungicide as copper hydroxide, copper oxychloride+ dithianone and copper sulfate, 2.2, 1.3 and 1.5 mm in size of clear zone only could be found, respectively. In pepper seedling test, oxytetracycline showed a perfect activity in all treatments 7 days after inoculation. However, its activity was decreased from $500{\mu}g\;mL^{-1}$ of treatment over the time. Copper fungicides showed the control efficacy lower than antibiotic fungicides except for validamycin. Based on the results, it was suggested that it would be better to use antibiotic fungicides than copper fungicides to control pepper bacterial wilt in the fields.