• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• Progress in Superconductivity and Cryogenics
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• v.20 no.4
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• pp.26-30
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• 2018

The turn-to-turn contact resistance of 2G high temperature superconducting (HTS) coils with metal insulation (MI) is closely related to the stability of the coils, current charging rate and delay time [1]. MI coils were fabricated using five kinds of metal tapes such as aluminum (Al) tape, brass tape, stainless steel (SS) tape, copper (Cu)-plated tape and one-sided Cu-plated SS tape. The turn-to-turn contact surface resistances of co-winding model coils using Al tape, brass tape, and SS tape were 342.6, 343.6 and $724.8{\mu}{\Omega}{\cdot}cm^2$, respectively. The turn-to-turn contact resistance of the model coil using the one-sided Cu-plated SS tape was $ 248.8{\mu}{\Omega}{\cdot}cm^2$, which was lower than that of Al and brass tape. Al or brass tape can be used to reduce contact resistance and improve the stability of the coil. Considering strength, SS tape is recommended. For strength and low contact resistance, SS tape with copper plating on one side can be used.

• Progress in Superconductivity and Cryogenics
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• v.1 no.1
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• pp.7-14
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• 1999

Wekk oriented $Bi_{2} Sr_{2} CaCu_{2} O_{8}$ suppercondcting thick films were fabricared on copper tape by LiReac-PreCu (liquid reaction between a Cu-free precousor and Cu tape) method. Cu-free precursor power which is composed of $Bi_{2}Sr_{2}Ca_{5}$ was printed on a copper tape by screen printing and was heat-treated. The speciment were partially in a molten state at the heat treatment temperature (85$0^{\circ}C$~87$0^{\circ}C$). The heat heat treatments for the reaction were performed in air or low oxygen pressure in several stages. XRD analyses of the resulting Bi2Sr2CaCu2O8 superconducting tapes show that the $Bi_{2} Sr_{2} CaCu_{2} O_{8}$ phase is dominant and a small amount of $Bi_{2} Sr_{2} Cu_{2} O_{6}$ phase is detected. Both phases are aligned in the c-axis direction.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.69-72
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• 1999

A Well oriented Bi$_2$re$_2$CaCu$_2$O$\sub$8/(Bi2212) superconductor thick films were formed successfully on a copper substrate by liquid reaction between a Cu-free precursor and Cu tape using method in which Cu-free BSCO powder mixture was printed on copper plate and heat-treated. And we examined the mechanism for the rapid formation of Bi2212 superconducting films from observing the surface microstructure with heat-treatment time. At heat-treatment temperature, the printing layer partially melt by reacting with CuO of the oxidizing copper plate, and the nonsuperconducting phases present in the melt are typically Bi-free phases and Cu-free phases. Following the partial melting, the Bi$_2$Sr$_2$CaCu$_2$O$\sub$8/ superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. It was confirmed that the phase colony from the phase diagram of Bi$_2$O$_3$-(SrO+CaO)/2-CuO system is similar to the observed result.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.315-318
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• 1999

Bi$_{2}Sr_{2}CaCu_{2}O_{\delta}$ superconducting films were rapidly fabricated on copper tape by liquid reaction between a Cu-free precursor and Cu tape (LiReac-PreCu) method. Those thick films were well oriented along the c-axis. The precursor was made by melt-quenched technology using twin roller. The melt-quenched films were transparent and glossy yellow in appearance. These films which were the compostion of Bi$_2SrCaO_y$, Bi$_3Sr_2CaO_z$ were placed on copper tape and then heated at various temperatures for several minutes in air. They were analyzed using X-ray powder diffraction, SEM, a DC four-probe method. The mechanism of superconducting phase formation . from the melt-quenched precursor on Cu tape was studied

• Journal of Welding and Joining
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• v.31 no.3
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• pp.49-53
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• 2013

Recently, studies about application of magnesium alloy sheet to automotive bodies are on the increase. For application to automotive bodies, researches about characteristics of resistance spot welding of magnesium alloy sheet are essential. Electrode life of resistance spot welding of magnesium alloy is very short due to sticking of magnesium alloy to copper alloy electrode. To increase electrode life, most effective method is inserting cover plate between electrode and magnesium sheet. But application of cover plate to actual process is difficult and decreases welding productivity. Process tape supplied automatically as cover plate can minimize lose of productivity and increase welding quality. In this study, resistance spot welding of magnesium alloy is carried out with applying process tape. Acceptable welding current region according to electrode force and welding time is determined.

• Journal of the Korean Society of Industry Convergence
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• v.27 no.3
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• pp.619-627
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• 2024

By analyzing the structure of the currently used Lead Tab tape structure, the outermost layer, low-temperature fusion functionalized olefin, was composed of pp base. To determine whether this could be used as the outermost layer of tab tape, the adhesive strength to metal foils such as copper and aluminum was measured and the adhesive strength was compared with commercially available functionalized olefin. When chlorine was grafted onto PP among the PP used in the composition, the average adhesive strength was similar to that of commercially available LT200T and superior to RE140R and LE320V. The maximum adhesive strength exceeded that of LE200T. When it comes to solvents, xylene has been shown to be better than any other. Physical methods such as substitution of other monomers, switching of additives or let-down hardly changed the adhesion of grafted PP, and the selection of PP is an important factor in preparing functional polymers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.26-27
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• 2006

The fundamental mechanical characteristics under tensile and bending deformations of hermetically-sealed reinforced Bi-2223 tape and CTOP processed Bi-2223 tape were examined at 77K. Also, the Tensile strain dependence of the critical current, $I_c$, was obtained at 77K and self-field. The reinforced hermetic tape showed higher tensile strength and a better Tensile strain tolerance than the CTOP processed tape. For bending tests, a rho-shaped sample holder was used giving multiple bending strains. in increasing order. In the same case under bending deformation, the hermetic tape showed a higher bending strain tolerance than the CTOP processed tape. This higher strength of the hermetic tape can be attributed to the thick hardened copper reinforcement layer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.478-481
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• 2002

We carried out the experiments for fabricating $Bi_{2}Sr_{2}Ca_{2}Cu_{3}O_{x}$(Bi2223) superconductor thick films on Cu tapes. Cu-free (Bi,Pb)-Sr-Ca-0 powder mixtures were screen- printed on Cu tapes and heat-treated at 840-$860^{\circ}C$ for several minutes in air. Surface microstructures and phases of films were analyzed by XRD and optical microscope. The electric properties of superconducting films were examined by the four probe method. At heat-treatment temperature, the printing layers were in a partially molten state by liquid reaction between CuO in the oxidized copper tape and the precursors which were printed on Cu tapes. During the heat-treatment procedure, it is thought that Bi2223 superconducting particles nucleate at interfaces between Bi2212 phase and liquid.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.251-252
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• 2008

In this study, we have investigated electrical properties of semiconductive materials for power cable caused by copper tape shield structure. Volume resistivity of specimens was measured by volume resistivity meter after 10 minutes in the pre-heated oven of both 23 [$^{\circ}C$] and 90 [$^{\circ}C$]. From this experimental results, the volume resistivity had different properties because of PTC/NTC tendency at between 23 [$^{\circ}C$] and 90 [$^{\circ}C$].