• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.808-809
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• 2006

The decrease of the distance between particle centers due to the growth of the sinter necks can be explained by the well known two-particle model. Unfortunately this model fails to provide a comprehensive description of the processes for 3D specimens. Furthermore, there is a significant discrepancy between the calculated and the measured shrinkage because particle rearrangements are not considered. Only the recently developed analysis of the particle movements inside of 3D specimens using micro focus computed tomography $({\mu}CT)$, combined with photogrammetric image analysis, can deliver the necessary experimental data to improve existing sintering theories. In this work, ${\mu}CT$ analysis was applied to spherical copper powders. Based on photogrammetric image analysis, it is possible to determine the positions of all particle centers for tracking the particles over the entire sintering process and to follow the formation and breaking of the particle bonds. In this paper, we present an in-depth analysis of the obtained data. In the future, high resolution synchrotron radiation tomography will be utilized to obtain in-situ data and images of higher resolution.

• 한국분말재료학회지
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• 제19권3호
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• pp.204-209
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• 2012

In this work, powder metallurgy and severe plastic deformation by high-pressure torsion (HPT) approaches were combined to achieve both full density and grain refinement at the same time. Pure Cu powders were mixed with 5 and 10 vol% diamonds and consolidated into disc-shaped samples at room temperature by HPT at 1.25 GPa and 1 turn, resulting in ultrafine grained metallic matrices embedded with diamonds. Neither heating nor additional sintering was required with the HPT process so that in situ consolidation was successfully achieved at ambient temperature. Significantly refined grain structures of Cu metallic matrices with increasing diamond volume fractions were observed by electron backscatter diffraction (EBSD), which enhanced the microhardness of the Cu-diamond composites.

• 한국재료학회지
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• 제15권12호
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• pp.765-772
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• 2005

PAS(Plasma Activated Sintering) process was tried to apply for the fabrication of BMG(Bulk Metallic Glasses) of $Ni_{57}Zr_{20}Ti_{18}Si_5}\;and\;Ni_{57}Zr_{20}Ti_{18}Si_3Sn_2$ from the as-atomized amorphous powder. Compressive strength for the BMG(bulk Metallic Glasses) of $Ni_{57}Zr_{20}Ti_{18}Si_5$ were lower than those of BMG rods produced by warm extrusion ,or copper mold casting method. Microstructural examination by optical microcope, SEM ana EDS showed that oxidation had occurred during PASintering. In order to prevent the powder from the oxidation during PASintering, Ni coating for $Ni_{57}Zr_{20}Ti_{18}Si_5$ amorphous powder by electroless-plating method was performed. Microstructural examination for Ni coated layers after PASintering indicated that the Ni coating had been so effective to prevent powder from oxidation during PASintering. Sintering behaviors of $Ni_{57}Zr_{20}Ti_{18}Si_3Sn_2$ represent the same as those of $Ni_{57}Zr_{20}Ti_{18}Si_5$.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.295-296
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• 2006

High hardness of P/M parts can be obtained in the cooling section of the sintering furnace by using sinter hardenable materials, thus the post-sintering heat treatment can be eliminated. However, the sinter hardened materials would have difficulties in secondary machining if it is required, which will limit the applications of sinter hardenable materials in the machined parts. Recent development in warm compaction technology can enable us not only to achieve the high green density up to $7.4\;g/cm^3$, but also the high green strength which is needed for green machining. Therefore by using warm compaction technology, the green machining can be applied to sinter hardenable materials for the high density, strength and hardness P/M parts. In the present study, a pre-alloyed steel powder, ATOMET4601, was used by mixing with 2.0% copper, 1.0% nickel, 0.9% graphite and a proprietary lubricant using a binder treatment process - FLOMET. The specimens were compacted and green machined with different machining parameters. The machined surface finish and part integrity were evaluated in selecting the optimal conditions for green machining. The possibility of applying the green machining to the high-density structural parts was explored.

• 한국분말재료학회지
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• 제8권4호
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• pp.245-252
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• 2001

Recent remarkable progress in the semiconductor industry has promoted smaller size of semiconductor chips and increased amounts of heat generation. So, the demand for a substrate material to meet both the characteristics of thermal expansion coefficient and heat radiation has been on the increase. Under such conditions, tungsten(W)-copper(Cu) has been proposed as materials to meet both of the above characteristics. In the present study, the W-10wt.%Cu powders were synthesised by the mixing and hydrogen reduction of the starting mixture materials such as W-Cu, $W-CuCl_2$and $WO_3-CuCl_2$ in order to obtain the full densification. The W-10wt.%Cu produced by hydrogen reduction showed the higher interparticle friction than the simple mixed W-10wt%Cu because of the W agglomerates. In the dilatometric analysis the W-10wt.%Cu prepared from the $W-CuCl_2$was largely shrank by heating up $1400^{\circ}C$ at the constant heating rate of $5^{\circ}C$/min. The possibility of application of metal injection molding (MIM) was also investigated for mass production of the complex shaped W-Cu parts in semiconductor devices. The relationship between the temperature of molding die and the pressure of injection molding was analyzed and the heating up stage of 120-$290^{\circ}C$ in the debinding process was controlled for the most suitable MIM condition.

• 한국주조공학회지
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• 제17권5호
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• pp.480-487
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• 1997

Particle reinforced metal matrix composites(MMCs) via a centrifugal spray-cast deposition(CSD) process were fabricated by injecting second phase particles($Al_2O_3$<40${\mu}m$, W<17.3${\mu}m$) into copper melt on the atomizing disc. Compositing modes were investigated by combining microstructures and mathematical modeling between Cu droplets and the reinforced particles injected. The $Cu/W_P$ powders were shown that the W particles penetrate and get embedded in the Cu droplets. It is considered that the W particles composite preferentially in Cu melt on the atomizing disc. On the other hand, the $Al_2O_3$, particles did not penetrate into the Cu droplets on the atomizing disc but get attached in surface of Cu droplets during the flight. It is considered that the compositing may be attained in the flight distance which the relative velocity between Cu droplet and $Al_2O_3$, particle is maximum. The microstructure of the $Cu/W_P$ and the $Cu/(Al_2O_3)_p$ composite preform was strongly influenced by compositing modes of droplets, and after subsequent deposition it was comprised as it is called the dispersed type and the cell type of microstructure, respectively.

• 한국수소및신에너지학회논문집
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• 제9권4호
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• pp.169-176
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• 1998

Ni/MH 2차전지의 음극용 금속간화합물전극의 부식특성에 미치는 합금원소와 결합제의 영향을 조사하였다. 전극의 재료는 $(LM)Ni_{4.49}Co_{0.1}Mn_{0.205}Al_{0.205}$와 $(LM)Ni_{3.6}Co_{0.7}Mn_{0.3}Al_{0.4}$의 $AB_5$ type합금을 모재로 하였다. 여기에 Si sealant 또는 PTFE를 결합제로 첨가한 것과 원재료 분말에 구리를 20% 무전해도금한 것을 냉간 압착하여 전극을 제조하였다. 부식특성을 조사하기위해 탈공기된 6M의 KOH 용액에서 동전위법과 순환전위법을 이용하여 부식전류와 전류밀도를 측정하였다. 모재에 Co가 많이 함유되면 전극의 내식성을 향상시키고 Ni이 많이 함유되면 충전과 방전을 반복하는 동안에 전극의 안정성을 저하시켰다. 부식전류밀도는 Si sealant를 결합제로 사용한 전극의 경우가 PTFE를 사용한 전극의 경우보다 낮았고 Cu가 도금된 전극은 내식성에서 가장 우수하게 나타났다.

• 한국자기학회지
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• 제16권1호
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• pp.34-39
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• 2006

졸-겔 방법을 이용하여 Fe첨가된 CuO박막 및 파우더 시료들을 제작하여 그 구조적, 전기적, 자기적 특성들을 순수한 CuO에서와 비교 분석하였다 순수한 CuO 박막은 monoclinic 구조를 가지며 상온에서 Cu 결핍으로 인한 p-type 전기전도성$(\~10^{-2}\;{\Omega^{-1}\;cm^{-1}$을 나타내었다 반면에 CuO:Fe박막은 부도체 성질을 나타내었고, 소량의 Li첨가에 의하여 p-type전도성 및 상온 강자성(ferromagnetism)을 나타내었다. 이와 같은 CuO: Fe, Li박막에서 나타난 결과는 $Li^+$ 이온의 $Cu^{2+}$ 자리 치환으로 인한 hole생성으로 전도성이 증대됨과 동시에 그 defect상태를 매개로 한 $Fe^{3+}$ 이온들간의 원거리 상호작용(long-range interaction)에 의한 강자성 효과의 증대에 기인한 것으로 해석된다. CuO: Fe파우더의 경우 박막에서와 비교하여 증대된 강자성을 나타내는데, 후열처리 온도의 증가가 자기 모멘트의 증대에 기여하였다. 뫼스바우어 측정을 통하여 CuO: Fe박막 및 파우더에서 주로 $Fe^{3+}$ 이온이 팔면체 $Cu^{2+}$ 자리를 치환하였음을 알 수 있었다.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.105-109
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• 2018

본 연구는 구리의 이산화탄소 환원 촉매 특성을 향상시키기 위해 전극 촉매 물질인 다공성 구리에 그래핀을 적용하였다. Thermal Chemical Vapor Deposition(TCVD)법을 이용하여 직접적으로 그래핀이 혼합된 다공성 구리를 제조하였다. 0.1 M $KHCO_3$ 전해액을 사용하여, -1.0 V ~ -1.4 V의 인가전위로 전기화학 실험을 수행한 결과, 그래핀이 혼합된 다공성 구리 전극의 전류 밀도는 다공성 구리에 비해 1.8 배 이상 증가하였다. 생성물을 평가한 결과, 다공성 구리 전극에서 CO와 $H_2$만 생성된 반면 그래핀이 포함된 다공성 구리의 생성물은 CO 뿐만이 아닌 $CH_4$와 $C_2H_4$가 생성되었다. 이는 그래핀으로 인해 이산화탄소 흡착 시간이 길어짐으로써 반응 중 생성된 중간체들이 전극 표면에 머무르는 시간이 길어졌으며, 결과적으로 C2 화합물 생성 반응까지 연속적으로 진행될 수 있었다고 판단된다.

• 한국수소및신에너지학회논문집
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• 제7권2호
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• pp.157-164
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• 1996

The AB5-type metal hydride electrodes using $(LM)Ni_{4.49}Co_{0.1}Mn_{0.205}Al_{0.205}$(LM : Lanthaniumrich Mischmetal) alloy powders(${\leq}200$mesh) which were coated with 25wt% copper in an acidic bath were prepared with or without addition of 10wt% PTFE as a binder. Prior to electrochemical measurements, the electrodes were sintered at $40^{\circ}C$ for 1 and 2hrs in vacuum with Mm(mischmetal) and sponge type Ti getters. The properties such as maximum capacity, cycle life and mechanical strength of the negative electrode have been investigated. The surface analysis of the electrode was also obtained before and after charge-discharge cycling using scanning electron microscope(SEM). From the observations of electrochemical behavior, it was found that the sintered electrode shows a lower maximum discharge capacity compared with non-sintered electrode but it shows a better cycle life. For the both electrodes with or without addition of PTFE binder, the values of mechanical strength were obtained, and their values increased with increasing sintering time. However, there is little difference of discharge capacity for both electrodes.