• Journal of Powder Materials
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• v.16 no.5
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• pp.351-357
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• 2009

A two-step recovery method was developed to produce copper powders from copper chloride waste solution as byproducts of MoO$_3$ leaching process. The first step consisted of replacing noble copper ions with external Fe$^{3+}$ ions which were formed by dissolving iron scraps in the copper chloride waste solution. The replaced copper ions were subsequently precipitated as copper powders. The second step was cementation of entire solution mixture to separate (pure) copper powders from aqueous solution of iron chloride. Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRD, SEM-EDS and laser diffraction and scattering methods.Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99% purity and average 1$\sim$2$\mu$m in size.

• Korean Journal of Metals and Materials
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• v.47 no.2
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• pp.79-90
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• 2009

A study has been made about the effects of powder content, reaction temperature, reaction time, and stirring speed on the preparation of the stainless steel(STS) 304L powders plating with copper by an electroless plating method. The behavior of corrosion resistance of the sintered STS-Cu composite powders was also investigated by the salt spraying test The electroless plating technique was an effective method to manufactur the copper-uniform plating composite powders, the corrosion resistance of this sintered specimen was improved bysuppressing Cr precipitates on grain boundaries in the sintered compacts of composite powders.

• Transactions of Materials Processing
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• v.16 no.5 s.95
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• pp.360-363
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• 2007

Microstructure and microhardness of metallic powders of pure copper were studied after high pressure torsion(HPT) processing with 10 turns of die rotation and high pressure of 6 GPa. The grain size of copper decreases drastically after HPT and reaches nanometer size ranges. During HPT, the hardness of consolidates of copper powders increases with increasing the temperature of HPT processing. Examinations of the fracture surfaces indicated evidence of ductile fracture. The results proved that HPT of copper powders has a beneficial effect for homogeneous deformation with reducing grain size.

• Journal of Powder Materials
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• v.22 no.4
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• pp.247-253
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• 2015

The sintering mechanisms of nanoscale copper powders have been investigated. A molecular dynamics (MD) simulation with the embedded-atom method (EAM) was employed for these simulations. The dimensional changes for initial-stage sintering such as characteristic lengths, neck growth, and neck angle were calculated to understand the densification behavior of copper nano-powders. Factors affecting sintering such as the temperature, powder size, and crystalline misalignment between adjacent powders have also been studied. These results could provide information of setting the processing cycles and material designs applicable to nano-powders. In addition, it is expected that MD simulation will be a foundation for the multi-scale modeling in sintering process.

• Korean Journal of Materials Research
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• v.16 no.5
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• pp.285-291
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• 2006

Copper powders have been widely used in electrically conductive coatings, electrode materials et al. and are very prospective since they are cheaper than noble metal powders such as silver or palladium. In this study, copper powders for metal filler of EMI shielding have been prepared using a solvothermal process from $CuSO_4$, NaOH, Glucose, mixed solvent ($H_2O$: Ethanol) and hydrazine which was used as a reducing agent at various reaction conditions. The prepared copper powders showed finely dispersed spherical shape without agglomerate, uniform morphology, narrow size distribution, high purity and were about 400-700 nm in size. The prepared powders were characterized using XRD, SEM, TGA, XPS, particle size measurement and EMI shielding efficiency.

• Journal of Powder Materials
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• v.19 no.6
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• pp.405-411
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• 2012

Recovery of copper powder from copper chloride solution used in $MoO_3$ leaching process was carried out using a cementation method. Cementation is a simple and economical process, necessitating less energy compared with other recovery methods. Cementation utilizes significant difference in standard reduction potential between copper and iron under standard condition. In the present research, Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated using bench-scale cementation reaction system. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRF, SEM-EDS and laser diffraction and scattering methods. Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99.65% purity and average $1{\mu}m$ in size.

• Bulletin of the Korean Chemical Society
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• v.29 no.2
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• pp.445-449
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• 2008

Micrometer-sized copper (mCu) powders are weakly surface-enhanced Raman scattering (SERS) active by the excitation at 632.8 nm, but nearly ineffective as a SERS substrate at 514.5 nm excitation. The SERS activity of mCu powders at both excitation wavelengths can be increased dramatically by a simple method of the galvanic exchange reaction with AgNO3 in aqueous medium. In this work, the SERS activity of the Ag-exchanged Cu powders (mCu@Ag) has been evaluated by taking a series of Raman spectra using benzenethiol (BT) as the probe molecule. It is clearly confirmed by field emission scanning electron microscopy and X-ray diffractometry that the SERS activity of mCu@Ag powders is, in fact, highly dependent on the extent of galvanic reaction.

• Journal of Powder Materials
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• v.10 no.2
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• pp.136-141
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• 2003

In the present study, $TiO_2$ imbedded copper matrix powders have been successfully prepared from the ($CuSO_4+TiO_2+Zn$) composite salt solution. The composite $Cu/TiO_2$ powders were formed by drying the solution at $200{\sim}~400^{\circ}C$ in the hydrogen atmosphere. Photocatalytic characteristics was evaluated by detecting TOC (total organic carbon) amount with TOC analyzer (model 5000A Shimadzu Co). Phase analysis of $Cu/TiO_2$ composite powders was carried out by XRD, DSC and powder size was measured with TEM. The mean particle size of composite powders was about 100 nm and a few zinc and copper oxide phases was included. The reduction ratio of TOC amount was 60% by the composite $Cu/TiO_2$ powders under the UV irradiation for 8 hours.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.826-827
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• 2006

Copper infiltration is demonstrated as a viable solution to achieve higher mechanical properties by filling the interconnected porosities of a ferrous structure with copper infiltrant. This paper will present the results of a design of experiments study based on the selected processing variables in the copper infiltration process. The variables are the following: Infiltrating temperatures, infiltrating time at pre-heat zone and hot zone, the green density of iron part, the migration of copper into the iron part at different processing conditions. The results show the flexibility of the infiltration process to attain certain mechanical properties by changing the processing conditions.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.3 no.1
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• pp.75-84
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• 1993

Copper coating on graphite powders was carried out by cementation process from copper sulfate solution. Effects of operation variables such as copper ion concentration, stirring speed, reaction time and temperature were investigated to obtain optimum conditions for continuous and uniform copper coating on graphite powders. The activation energy of the copper coating process was found to be 3. 59kcal/mole.