• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.206.1-206.1
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• 2014

최근 전자 장비의 금속 전도성 패턴 제작에 있어서 직접적인 프린트가 가능한 프린팅 기술이 기존의 복잡한 photolithography 를 대체할 기술로 주목 받고 있다. 이와 함께 금속 전도성 패턴 제작에 사용되는 고가의 전도성 물질인 Ag ink 및 paste 를 저가의 Cu ink 및 paste 로 대체하기 위한 연구가 진행되고 있다. 하지만 일반적으로 copper 는 대기 중 에서 쉽게 산화되어 높은 저항을 야기시킨다. 따라서 Cu ink 또는 paste 를 제작할 때 copper nanoparticles 을 유기 용매에 분산하여 inert atmosphere에서 합성하거나 [1] copper ink 또는 paste 를 substrate 에 프린트하여 reduction atmosphere 에서 소성시킨다 [2]. 이번 연구에서 Cu paste 를 유리 기판에 screen printing 하여 혼합가스(질소 95%, 수소 5%)와 질소 가스 분위기에서 소성하여 Cu 전극의 소성 거동과 전기적 특성을 분석하였다. 4-point probe를 통해 소성된 Cu 전극의 저항을 측정하여 전도도를 조사하였으며 Thermal Gravimetric Analysis (TGA), Fourier Transform Infrared(FTIR)를 통해 소성된 Cu 전극의 유기물 분해가 전도도에 미치는 영향을 분석하고 Field Emission Scanning Electron Microscopy (FESEM)과 High Resolution Transmission Electron Microscopy (HRTEM)을 통해 Cu nanoparticles 의 grain growth가 전도도에 미치는 영향을 조사하였다.

• Applied Chemistry for Engineering
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• v.35 no.2
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• pp.96-99
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• 2024

A sintering paste for bonding copper plates was synthesized using Cu formate nanofibers on Cu microparticles, mixed with formic acid. Copper oxide nanofibers of 10 ㎛ grown at 400 ℃ on Cu microparticles on the surface were transformed into copper formate nanofibers through the mixing of formic acid. Compared to Cu bulk particles or nanoparticles, Cu formate on Cu microparticles decomposed into metallic Cu at a lower temperature of 210 ℃, facilitating the sintering of copper paste. The growth of nanofiber on Cu microparticles allowed for an increase in the reaction rate of formation to copper formate, aggregating surface area, and decomposition rate of copper formate, resulting in fast sintering.

• Analytical Science and Technology
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• v.8 no.4
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• pp.611-615
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• 1995

The design of appropriate chemically modified electrodes should allow development of new voltammetric measurement schemes with enhanced selectivity and sensitivity. Microorganism like algae has high ability to trap toxic and heavy metal ions and different affinities for metal ions. A copper(II) ion-selective carbon paste electrode was constructed by incorporating alga Anabaena into a conventional carbon paste mixture, and then the film of 10% Nafion was coated to avoid the swelling of the electrode surface. Copper ion could be deposited at the 25% algamodified electrode for 15 min without the applied potential while stirring the solution by only immersing the electrode in a buffer (pH 4.0) cot1taining copper(II). Temperature was controlled at $35^{\circ}C$. After preconcentration was carried out the electrode was transferred to a 0.1 M potassium chloride solution and was reduced at -0.6 volt at $25^{\circ}C$. The differential pulse anodic stripping voltammetry was employed. A well-defined oxidation peak could be obtained at -0.1 volt (vs SCE). In five deposition / measurement / regeneration cycles, the responses were reproducible and relative standard deviations were 3.3% for $8.0{\times}10^{-4}M$ copper(II). Calibration curve for copper was linear over the range from $2.0{\times}10^{-4}M$ to $1.0{\times}10^{-3}M$. The detection limit was $7.5{\times}10^{-5}M$. Studies of the effect of diverse ions showed that the coexisting metal ions had little or no effect for the determination of copper. But anions such as cyanide. oxalate and EDTA seriously interfered.

• Journal of Powder Materials
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• v.19 no.5
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• pp.343-347
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• 2012

In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.55-64
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• 1995

Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

• Korean Journal of Materials Research
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• v.29 no.1
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• pp.37-42
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• 2019

This study investigates Ag coated $Cu_2O$ nanoparticles that are produced with a changing molar ratio of Ag and $Cu_2O$. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and $Cu_2O$ determination, and SEM image analysis confirms that Ag is partially coated on the surface of $Cu_2O$ nanoparticles. The conductive paste with Ag coated $Cu_2O$ nanoparticles approaches the specific resistance of $6.4{\Omega}{\cdot}cm$ for silver paste(SP) as $(Ag)/(Cu_2O)$ the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of $100{\mu}m$ or less has a surface resistance of 5 to $20{\mu}{\Omega}{\cdot}cm$, while in this research an Ag coated $Cu_2O$ paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of $10{\mu}m$ or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

• Applied Chemistry for Engineering
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• v.29 no.6
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• pp.782-788
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• 2018

Submicron copper-silver core-shell (Cu@Ag) particles were synthesized using the sonochemical combined transmetallation reaction and the application to printed electronics as a low cost conductive paste was evaluated. $Cu_2O$ of the $Cu_2O/Cu$ composite used as a core in the reaction for the synthesis of core-shell was sonochemically reduced to Cu, and Cu atoms functioned as a reducer for silver ions in transmetallation to achieve the copper-silver core-shell structure. The characterization of submicron particles by TEM-EDS and TG-DSC confirmed the core-shell structure. Conductive pastes in which 70 wt% Cu@Ag was dispersed in solvents were prepared using a binder and wetting agents, and coated on the polyamide film using a screen-printing method. Printed paste films containing synthesized Cu@Ag particles with 8 at% and 16 at% Ag exhibited low resistivity of 96.2 and $38.4{\mu}{\Omega}cm$ after sintering at $180^{\circ}C$ in air, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.421-421
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• 2008

Generally, the polymer thick-film resistors for embedded organic or hybrid substrate are patterned by screen printing so that the accuracy of resistor pattern is not good and the tolerance of resistance is too high(${\pm}$20~30%). To reform these demerits, a method using Fodel$^{(R)}$ technology, which is the patterning method using a photosensitive resin to be developable by aqueous alkali-solution as a base polymer for thick-film pastes, was recently incorporated for the patterning of thermosetting thick-film resistor paste. Alkali-solution developable photosensitive resin system has a merit that the precise patterns can be obtained by UV exposure and aqueous development, so the essential point is to get the composition similar to PSR(photo solder resist) used for PCB process. In present research, we made the photopatternable resistor pastes using 8 kinds of epoxy acrylates and a conductive carbonblack (CDX-7055 Ultra), evaluated their developing performance, and then measured the resistance after final curing. To become developable by alkali-solution, epoxy acrylate oligomers with carboxyl group were prepared. Test coupons were fabricated by patterning copper foil on FR-4 CCL board, plating Ni/Au on the patterned copper electrode, applying the resistor paste on the board, exposing the applied paste to UV through Cr mask with resistor patterns, developing the exposed paste with aqueous alkali-solution (1wt% $Na_2CO_3$), drying the patterned paste at $80^{\circ}C$ oven, and then curing it at $200^{\circ}C$ during 1 hour. As a result, some test compositions couldn't be developed according to the kind of oligomer and, in the developed compositions, the measured resistance showed different results depending on the paste compositions though they had the same amount of carbonblack.

• Geomechanics and Engineering
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• v.9 no.2
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• pp.195-205
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• 2015

Barricade failures generally occur at the early times of paste backfill when it is fresh in the stopes. The backfill strength increases and need for barricading pressure decreases as a result of the hydration reactions. In this study, paste backfill barricades of Cayeli copper mine were investigated to design cemented mineral processing plant tailings as barricade body concrete. Paste backfill in sub-level caving stopes of the mine needs to be barricaded for only four or five days. Therefore, short term strength and workability tests were applied on several cemented tailings material designs. Barricade failure mechanisms, important points of barricade designing and details of the new concrete material are explained in this work. According to the results obtained with this experimental study, the tailings were assessed to be used in concrete applied as temporary supports such as cemented paste backfill barricades.