• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.29.2-29.2
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• 2009

구리는 낮은 비저항, 높은 열전도도, 우수한 electromigration(EM)저항특성 등을 바탕으로 차세대 nano-scale집적회로의 interconnect application에 적합한 금속재료로서 각광받고 있다. copper interconnect는 damascene process 를주로 이용하는데 CVD를 이용하면 step coverage가우수한 seed layer얻을 수 있어 고집적 소자의 구현이 가능하다. 최근에 비 균등화 반응(disproportionationreaction)을 이용하여 고 순도 구리박막을 제조하기위해 $\beta$-diketonate Cu(I) Lewis-base의 전구체를 많이 이용하는데 그중에서 hexafluoroacetylacetonate(hfac)Cu(I)vinyltrimethylsilane (VTMS)가 널리 이용되고 있다. 그러나 (hfac)Cu(I)(VTMS) 또는 유사계열의 전구체들은 열적안정성및 보관안정성이 부족하여 실제 양산공정에 적합하지 못한 단점이 있었다. 본 연구에 이용된 2가 전구체Cu(dmamb)2는 높은 증기압($70^{\circ}C$, 0.9torr)을 가지며 종래에 주로 이용하던 1가 전구체 (hfac)Cu(VTMS)에 비해 높은 활성화 에너지(~113 kJ/mol)를가짐으로서 열적안정성 및 보관안정성이 우수하다. 다른 한편으로 2가전구체는 안정성이 우수한 만큼 낮은 증기압을 극복하기 위해 리간드에 플루오르를 주로 치환하여 증기압을 높이는데 플루오르는 성장하는 박막의 접착력을약하게 하는 단점을 가진다. 하지만 본 연구에 사용된 Cu(dmamb)2는 리간드에 플루오르를 포함하지 않으며, 따라서 고품질의 박막을 용이한성장환경에서 제조할 수 있는 장점들을 제공한다. 비활성가스 분위기에서 2가전구체는 열에너지에 의해 리간드의 자가환원에따라 금속-리간드 분해가 발생한다. 하지만 수소분위기에서는수소가 환원제로 작용하여 리간드의 분해를 용이하게 하는 특징을 가지며 따라서 비활성분위기일 때 비해 낮은 성장온도를 가진다. 또한 수소는 잔류하는 리간드 및 불순물과 결합하여 휘발성화학종들을 생성하여 고순도의 구리박막제조를 가능하게한다.

• Proceedings of the Korean Vacuum Society Conference
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• 1995.02a
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• pp.36-36
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• 1995

The cubic (zinc blende) CdSe eppilayers were grown on GaAs(100) substrates by electron beam (e-beam) evapporation technique. X-ray scans with copper $K\alpha$ radiation indicate that the CdSe eppilayers are zinc blende. The lattice pparameter obtained from the (400) reflection is 6.077$\AA$, which is in excellent agreement with the value repported in the literature for zinc blende CdSe. The orientation of as-grown CdSe eppilayer is determined by electron channeling ppatterns(ECpp). The crystallinity of heteroeppitaxial CdSe layers were investigated based on the double crystal x-ray rocking curve(DCRC). The deppendence of the rocking curve width on layer thickness was studied. The FWHM(full width at half maximum) of CdSe eppilayers grown on GaAs(100) substrates is decreasing with increasing eppilayer thickness. The carrier concentration and mobility of the as-grown eppilayers deduced Hall data by van der ppauw method, are about 7$\times$1017 cm-3 and 2$\times$102 $\textrm{cm}^2$ / sec at room tempperature, resppectively. The energy gapp was determinded from the pphotocurrent sppectrum. In pphotocurrent sppectrum of a 1-${\mu}{\textrm}{m}$-thick CdSe eppilayer at 30K, the ppeak at 1.746 eV is due to the free exciton of cubic CdSe. In summary, We have shown that eppilayers of zinc blende CdSe can be grown on GaAs(100) substrates by e-beam, desppite the large mismatch between eppilayer and substrate, as well as the natural ppreference for CdSe to form in the wurtzite structure.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.29-33
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• 2011

Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.

• Transactions on Electrical and Electronic Materials
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• v.8 no.1
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• pp.5-10
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• 2007

Using a reference slurry, ammonium dodecyl sulfate (ADS), an anionic and environmentally friendly surfactant, was investigated as an alternative to BTA for its inhibition and lubrication characteristics. Results demonstrated that the inhibition efficiency of ADS was superior to that of BTA. Coefficient of friction (COF) was the lowest when the slurry contained ADS. This suggested that adsorbed ADS on the surface provided lubricating action thereby reducing the wear between the contacting surfaces. Temperature results were consistent with the COF and removal rate data. ADS showed the lowest temperature rise again confirming the softening effect of the adsorbed surfactant layer and less energy dissipation due to friction. Spectral analysis of shear force showed that increasing the pad-wafer sliding velocity at constant wafer pressure shifted the high frequency spectral peaks to lower frequencies while increasing the variance of the frictional force. Addition of ADS reduced the fluctuating component of the shear force and the extent of the pre-existing stick-slip phenomena caused by the kinematics of the process and collision event between pad asperities with the wafer. By contrast, in the case of BTA, there were no such observed benefits but instead undesirable effects were seen at some polishing conditions. This work underscored the importance of real-time force spectroscopy in elucidating the adsorption, lubrication and inhibition of additives in slurries in CMP.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.3
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• pp.194-198
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• 2010

Recently as the electronic devices are getting to be more and more smaller, transformers are needed to be micro fabricated using MEMS technology. In this paper transformers have been fabricated and measured by depositing insulation layer to reduce the loss of eddy current and in the middle core a high permeability permalloy was designed based on the turns ratio between primary coil and secondary coil which are 1:1 transformers. (the number of turns of primary coil and secondary coil: 3/3, 5/5, 7/7). The size of the transformers including ground shield are $1mm{\times}1.5mm$, $1mm{\times}1.95mm$, $1mm{\times}2.35mm$ respectively. The line width, pitch and the height of post are 50um. Based on the measured data from the micro fabricated transformers, the 3/3 turns in the primary coil and secondary coil showed the lowest insertion loss with 1.5 dB at 480 MHz and the 7/7 turns in the primary coil and secondary coil showed the highest insertion loss with 2.5 dB at 280 MHz. Also confirmed that the bandwidth goes up as the number of turns goes down. There was some difference between the actual measured data and the HFSS simulation result. It looks as if it is an error of the difference between oxidation of copper or the permeability of SU-8.

• Composites Research
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• v.28 no.5
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• pp.254-259
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• 2015

Carbon fiber/aluminum (CF/Al) composites were successfully fabricated without pressure casting using wettability modification of carbon fiber. The wettability of liquid aluminum on carbon fibers was enhanced through electroless plating of copper on carbon fibers. Liquid aluminum was well infiltrated into carbon fiber bundles with Cu coating layer due to low wetting angle, and a lot of pores that existed in CF/Al composite without Cu coating on CF were greatly removed. However, a few tiny pores existed in carbon fiber bundles, which is due to not bad wettability between CF and Al but shrinkage cavity that was generated during cooling of CF/Al composite. The tiny pores could be effectively removed by a subsequent rolling.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1833-1836
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• 2008

Recently as the micro surface features become higher and diverse in their shapes, the releasing of the molded features becomes more crucial for manufacturing of the micro patterned products. The higher aspect ratio of the features or more complex shape of the features results in larger releasing force, elongation or cohesive failure of the features during the releasing. Another issue would be the uniformity of the released surface features after molding, especially for applications with large area surface. The micro patterned optical film, one of typical applications for micro surface features, consists of two layers, the thermoplastic base film and the micro formed UV resin layer. Therefore two interfaces are typically involved during the forming of this micro featured film; one is between the base film and the UV resin and another is between the resin and the pattern master. To improve the releasing of the molded surface features, the adhesive characteristic was investigated at these two interfaces. A PET film was used as a base film and two UV curable resins with different surface energy were prepared for different adhesiveness. Also the two different pattern masters were employed; one is made from brass-copper alloy and fabricated with PMMA. The adhesiveness at each interface was measured for some combinations of these base film, UV resins and the masters and the effect of this adhesiveness on the releasing was investigated.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.10a
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• pp.758-760
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• 2007

Organic field-effect transistors (OFETs) are of interest for use in widely area electronic applications. We fabricated a copper phthalocyanine (CuPc) based field-effect transistor with different metal electrode. So we need the effect of the substituent group attached to the phthalocyanine on the surface potential was investigated by Kelvin probe method with varying temperature of the substrate. We were obtained the positive shift of the surface potential for CuPc thin film. We observed the electron displacement at the interface between Au electrode and CuPc layer and we were confirmed by the surface potential measurement.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.158-158
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• 2011

$Cu(In_xGa_{1-x})Se_2$ (CIGS) thin film solar cell is one of the most promising solar cells in photovoltaic devices. CIGS has a direct band gap which varied from 1.0 to 1.26 eV, depending on the Ga to In ratio. Also, CIGS has been studying for an absorber in thin film solar cells due to their highest absorption coefficient which is $1{\times}10^5cm^{-1}$ and good stability for deposition process at high temperature of $450{\sim}590^{\circ}C$. Currently, the highest efficiency of CIGS thin film solar cell is approximately 20.3%, which is closely approaching to the efficiency of poly-silicon solar cell. The deposition technique is one of the most important points in preparing CIGS thin film solar cells. Among the various deposition techniques, the sputtering is known to be very effective and feasible process for mass production. In this study, CIGS thin films have been prepared by rf magnetron sputtering method using a single target. The optical and structural properties of CIGS films are generally dependent on deposition parameters. Therefore, we will explore the influence of deposition power on the properties of CIGS films and the films will be deposited by rf magnetron sputtering using CIGS single target on Mo coated soda lime glass at $500^{\circ}C$. The thickness of CIGS films will be measured by Tencor-P1 profiler. The optical properties will be measured by UV-visible spectroscopy. The crystal structure will be analyzed using X-ray diffraction (XRD). Finally the optimal deposition conditions for CIGS thin films will be developed.

• Korean Journal of Materials Research
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• v.10 no.8
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• pp.551-557
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• 2000

Cu-based leadframe sheets were oxidized ic a hot alkaline solution to black-oxide layer on the surface and molded with epoxy molding compound(EMC), and finally machined to form sandwiched double-cantilever beam(SDCB) and sandwiched Brazil-nut(SBN)specimers to measure the adhesion strength of leadframe-EMC interface. The SDCB and the SBN specimens were designed to measure the adhesion strength in terms fracture toughness under puasi-mode I and mixed mode loadinf, respectively. After the tests, fracture surfaces were analyzed paths were observed in the SDCB-tested speciments, failure paths varied with crack speed and loading conditions.