• Journal of the Korean institute of surface engineering
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• v.56 no.5
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• pp.335-340
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• 2023

Quinary component of 3㎛ thick Ti-Al-Si-Cu-N films were deposited onto WC-Co and Si wafer substrates by using an arc ion plating(AIP) system. In this study, the influence of copper(Cu) contents on the mechanical properties and microstructure of the films were investigated. The hardness of the films with 3.1 at.% Cu addition exhibited the hardness value of above 42 GPa due to the microstructural change as well as the solid-solution hardening. The instrumental analyses revealed that the deposited film with Cu content of 3.1 at.% was a nano-composites with nano-sized crystallites (5-7 nm in dia.) and a thin layer of amorphous Si₃N₄ phase.

• Journal of the Korean institute of surface engineering
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• v.57 no.3
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• pp.140-154
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• 2024

As the trend towards miniaturization in semiconductor integration process, the limitations of interconnection metals such as copper, tungsten have become apparent, prompting research into the emergence of new materials like cobalt and emphasizing the importance of studying the corresponding process conditions. During the chemical mechanical polishing (CMP) process, corrosion inhibitors are added to the slurry, forming passivation layers on the cobalt surface, thereby playing a crucial role in controlling the dissolution rate of the metal surface, enhancing both removal rate and selectivity. This review investigates the understanding of the cobalt polishing process and examines the characteristics and behavior of corrosion inhibitors, a type of slurry additive, on the cobalt surface. Among the corrosion inhibitors examined, benzotriazole (BTA), 1,2,4-triazole (TAZ), and potassium oleate (PO) all improved surface characteristics through their interaction with cobalt. These findings provide important guidelines for selecting corrosion inhibitors to optimize CMP processes for cobalt-based semiconductor materials. Future research should explore combinations of various corrosion inhibitors and the development of new compounds to further enhance the efficiency of semiconductor processes.

• Korean Journal of Soil Science and Fertilizer
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• v.43 no.1
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• pp.60-67
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• 2010

Although several studies have reported that Cr, Cu and As can leach from CCA-treated woods, few studies have been conducted on this topic in Korea. Therefore, this study was conducted to monitor Cr, Cu and As leaching from CCA-treated wood products and to develop a rapid identification method for CCA-treated wood products by using indicators such as PAN stain. Soil samples were collected at depths of 0-70 cm and wood samples were collected by thickness of wood layer. The soil and wood samples were then digested and analyzed for Cr, Cu and As concentrations using an atomic absorption spectrometer. The As and Cu concentrations decreased sharply with depth from 34.38 and 33.65 mg $kg^{-1}$ at 0-1 cm to 1.72 and 7.84 mg $kg^{-1}$ at 70 cm, respectively. In general, As was more mobile than Cr and Cu in the soil. For wood samples, the Cr, Cu and As concentrations were higher in the outer layer (0-0.5cm) than the inner layers (0.6-4.5cm). Evaluation of rapid identification methods revealed that 100% acetone with 0.1% PAN indicator was the best combination for detection of CCA-treated wood in the field.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.97-104
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• 2016

In the preparation of Ag-coated Cu flakes using L-ascorbic acid as a reductant for the electroless Ag plating, the effects of pretreatment methods and the reductant concentration on the uniformity of Ag coating layer and the anti-oxidation property of Ag-coated Cu flakes during the heating in air were evaluated. It was found that the removal degree of surface oxide layer during the pretreatment has great influence on the uniformity of Ag coating layer and the formation degree of hole defects in the flakes has slight effect on the anti-oxidation property of Ag-coated Cu flakes. It was also verified that the reductant concentration has great influence on the coverage uniformity and thickness of Ag coating, thus it was could be considered a main process parameter. When the reductant concentration was 0.04 M, high-quality Ag-coated Cu flakes was obtained. When the concentration increased to 0.06 M, however, the anti-oxidation property of Ag-coated Cu flakes became remarkably worse owing to remnant of Cu surface non-coated with Ag by the formation of pure Ag fine particles.

• Journal of Conservation Science
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• v.26 no.2
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• pp.109-120
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• 2010

Four gilded bronze objects and a gilded silver object were examined for elemental diffusion between the gilding layer and the mating matrix. The gilded bronzes consist of three objects from three different historical periods, the Korean Three Kingdoms period, the Koryo and the Choseon periods and one from an unknown period. The gilded silver was from the Koryo period. The amalgam process seems to have been the major technique employed for all of them in gilding. The occurrence of substantial diffusion was observed in all but the anonymous object, particularly in the Choseon artifact where evidence was found that the diffusion phenomenon was intentionally utilized in gilding. The gold content in the gilded bronzes decreases gradually from surface to interior while the copper content increases to the interior, making it difficult to locate the boundary between the gilding layer and the matrix. This gradual change in composition must have resulted from elemental diffusion at elevated temperatures. The oxygen content negligible in the gilding layer precludes the possibility of corrosion being responsible for the varying composition. It is observed that non-uniform diffusion caused variation of colors in the surface of gilded bronzes. The change of colors induced by diffusion, which is always accompanied by the unique surface morphology and chemical compositions, is distinguished from the color change by corrosion. In the gilded silver object, diffusion of mercury was observed along with that of gold and silver.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.3 s.106
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• pp.249-258
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• 2006

In this letter, we propose a novel printed helix antenna for RFID reader in UHF band. The printed strip line of the antenna is first wound up outside a polygonal shaped layer and then the winding continues on an inner layer to control the overall gain and the radiation pattern. In addition, the winding pitch angles on each layer have either negative or positive values resulting in the broad CP bandwidth. The detail structure of the antenna was optimized using Pareto genetic algorithm(GA), so as to obtain excellent performances for RFID reader antennas. The optimized two-layered polygonal helix was fabricated on the cardboard of a flexible substrate and the performances were measured and compared with the simulations. The fabricated antenna was made up of copper tape which can adhere to a flexible cardboard and had 21.4 % matching bandwidth, 31.9 % CP bandwidth, readable range of $5.5m^2$ with kr=3.2. Also based on the current distribution of the strip line of the antenna and sensitivity of the antenna bents points, we confirmed that the antenna has the quarter-wave transformer near the feed for the broad matching bandwidth and radiates the traveling wave for the broad CP bandwidth using the bent strip line.

• Journal of Electrochemical Science and Technology
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• v.9 no.4
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• pp.282-291
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• 2018

The pristine fluorine-doped $SnO_2$ (abbreviated as FTO) inverse opal (IO) was developed using a 410 nm polystyrene bead template. The nanolayered copper tungsten oxide ($CuWO_4$) was decorated on the FTO IO film using a facile electrochemical deposition, subsequently followed by annealing at $500^{\circ}C$ for 90 min. The morphologies, crystalline structure, optical properties and photoelectrochemical characteristics of the FTO and $CuWO_4$-decorated FTO (briefly denoted as $FTO/CuWO_4$) IO film were investigated by field emission scanning electron microscopy, X-ray diffraction, UV-vis spectroscopy and electrochemical impedance spectroscopy, showing FTO IO in the hexagonally closed-pack arrangement with a pore diameter and wall thickness of about 300 nm and 20 nm, respectively. Above this film, the $CuWO_4$ was electrodeposited by controlling the cycling number in cyclic voltammetry, suggesting that the $CuWO_4$ formed during 4 cycles (abbreviated as $CuWO_4$(4 cycles)) on FTO IO film exhibited partial distribution of $CuWO_4$ nanoparticles. Additional distribution of $CuWO_4$ nanoparticles was observed in the case of $FTO/CuWO_4$(8 cycles) IO film. The $CuWO_4$ layer exhibits triclinic structure with an indirect band gap of approximately 2.5 eV and shows the enhanced visible light absorption. The photoelectrochemical (PEC) behavior was evaluated in the 0.5 M $Na_2SO_4$ solution under solar illumination, suggesting that the $FTO/CuWO_4$(4 cycles) IO films exhibit a photocurrent density ($J_{sc}$) of $0.42mA/cm^2$ at 1.23 V vs. reversible hydrogen electrode (RHE, denoted as $V_{RHE}$), while the FTO IO and $FTO/CuWO_4$(8 cycles) IO films exhibited a $J_{sc}$ of 0.14 and $0.24mA/cm^2$ at $1.23V_{RHE}$, respectively. This difference can be explained by the increased visible light absorption by the $CuWO_4$ layer and the favorable charge separation/transfer event in the cascading band alignment between FTO and $CuWO_4$ layer, enhancing the overall PEC performance.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.41-48
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• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

• Journal of Korean Society of Environmental Engineers
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• v.30 no.3
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• pp.345-351
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• 2008

Fe-impregnated activated carbon(Fe-AC) was prepared by Fe(III) loading on activated carbon(AC) in various preparation pH. In order to evaluate the stability of Fe-AC, dissolution of iron from Fe-AC in acidic conditions was measured. In addition, batch experiments were conducted to monitor the removal efficiency of copper by Fe-AC. Results of stability test for Fe-AC showed that the amount of extracted iron increased with contact time but decreased with increasing solution pH. The dissolved amount of iron gradually increased at solution pH 2 and finally 13% of the total iron loaded on activated carbon was extracted after 12 hr. However dissolution of iron was negligible over solution pH 3. Removal of Cu(II) by Fe-AC was greatly affected by solution pH and was decreased as solution pH increased as well as initial Cu(II) concentration decreased. Surface complexation modeling was performed by considering inner-sphere complexation reaction and using the diffuse layer model with MINTEQA2 program.

• Journal of Conservation Science
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• v.26 no.2
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• pp.157-169
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• 2010

This study focused on the material characteristics and archaeometric relationship between the molten glass and bronze materials within the crucibles and gilt-bronze Bodhisattva statue excavated from the Ssangbukri site in Buyeo, Korea. Yellowish green to red brown vitreous material in the crucibles was identified as lead glass which contained scarce amount of BaO, and low $Al_2O_3$ and CaO. Metallic molten material was identified as bronze of copper-tin-lead alloy with low amount of impurities that indicated well-refined materials. Also, cassiterite was used for raw metal ore of tin. The Bodhisattva statue consisted of major copper with trace impurities in the core metal, and gold amalgam in the gilded layer. Though lead isotopic analysis showed contradictory results in each lead glass, bronze and Bodhisattva statue that required further examination, it could be stated that the statue was made in the Ssangbukri site based on the high-level technical skills of bronze production.