• 한국표면공학회지
• /
• 제29권2호
• /
• pp.140-145
• /
• 1996

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit does not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silver cyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating. However, the consideration of the difference between the values of the stability constants for bath the silver-iodide complex and the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in si]ver-potassium iodide solution, could be comparatively low. To confirm this, the rate of replacement deposition of silver in both a silver-potassium iodide solution ($AgNO_3$0.10 mol/L, KI 2.00 mol/L ) and a strike silver plating bath (AgCN 0.028 mol/L, KCN 1.15 mol/L ) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.

• 대한화학회지
• /
• 제57권3호
• /
• pp.322-328
• /
• 2013

Copper iodide was employed as a modifier for preparation of a new carbon ceramic electrode. For the first time, the catalytic oxidation of amoxicillin (AMX) was demonstrated by cyclic voltammetry, chronoamperometry and amperometry methods at the surface of this modified carbon ceramic electrode. The copper iodide modified sol-gel derived carbon ceramic (CIM-SGD-CC) electrode has very high catalytic ability for electrooxidation of amoxicillin. The catalytic oxidation peak current was linearly dependent on the amoxicillin concentration and the linearity range obtained was 100 to 1000 ${\mu}mol\;L^{-1}$ with a detection limit of 0.53 ${\mu}mol\;L^{-1}$. The diffusion coefficient ($D=(1.67{\pm}0.102){\times}10^{-3}\;cm^2\;s^{-1}$), and the kinetic parameter such as the electron transfer coefficient (${\alpha}$) and exchange current density ($j_0$) for the modified electrode were calculated. The advantages of the modified CCE are its good stability and reproducibility of surface renewal by simple polishing, excellent catalytic activity and simplicity of preparation.

• 자원리싸이클링
• /
• 제25권1호
• /
• pp.3-9
• /
• 2016

요오드용액을 사용하여 노트북 인쇄회로기판 CPU chip 중에 함유된 금을 침출하는 연구를 진행하였다. 150 mesh 이하로 분쇄된 CPU chip을 Iodide/Iodine용액에서 처리한 결과 금의 침출율은 20%로 매우 낮게 나타났다. 이와 같이 낮은 침출율의 원인은 CPU chip 분쇄과정에서 금 입자 표면에 생성된 구리 피막이 침출액과 금의 접촉을 방해하기 때문인 것으로 판단되었다. 한편, CPU chip 분쇄물을 질산용액을 사용하여 전처리 한 후 Iodide/Iodine 용액으로 침출하였을 때 금의 침출율은 약 90%으로 크게 증가하였다. 이 현상을 설명하기 위하여 침출 잔사를 EDS 및 ICP 분석을 통해 관찰한 결과, 금 입자표면에 피복되어 있는 구리의 약 80%가 질산에 의해 제거되었으며 이로 인해 금의 침출율이 향상된 것을 확인할 수 있었다.

• Corrosion Science and Technology
• /
• 제6권4호
• /
• pp.198-205
• /
• 2007

The initial stages of electrochemical oxidative CuI film formation on Cu(111), as studied by means of Cyclic Voltammetry (CV), in-situ Scanning Tunneling Microscopy (STM) and ex-situ Synchrotron X-ray Photoemission Spectroscopy (SXPS), indicate a significant acceleration of copper oxidation in the presence of iodide anions in the electrolyte. A surface confined supersaturation with mobile CuI monomers first leads to the formation of a 2D-CuI film via nucleation and growth of a Cu/I-bilayer on-top of a pre-adsorbed iodide monolayer. Structurally, this 2D-CuI film is closely related to the (111) plane of crystalline CuI (zinc blende type). Interestingly, this film causes no significant passivation of the copper surface. In an advanced stage of copper dissolution a transition from the 2D- to a 3D-CuI growth mode can be observed.

• 대한화학회지
• /
• 제40권5호
• /
• pp.341-346
• /
• 1996

$(Cin)Cu(NO_3)_2$으로 변성된 턴소반죽전극을 제작하여 $I^-$이온을 벗김전압전류법을 이용하여 정량하였다. $I^-$이온은 변성제인 $(Cin)Cu(NO_3)_2$착물에 배위된 $NO_3^-$와 이온교환에 의해 변전극에 감응하며, 산화전위는 +0.72 V였다, $I^-$ 이온의 최적분석 조건은 다음과 같다: 농축용액의 조성은 0.1 M $KNO_3$, 농축시간은 10분, 탄소분말에 대한 변성제의 함량은 40%(w/w). 선형주사 양극벗김전압전류법(Linear Sweep Anodic Stripping Voltammetry)에 의한 $I^-$이온의 검출한계는 $1.0{\times}10^{-6}M$이며, $2.0{\times}10^{-5}M$에서 구한 상대표준편차는 ${\pm}5.5%$였다. 여러 음이온에 대하여 방해작용을 검토한 결과 $Cl^-,\;Br^-,\;C_2O_4^{2-},\;ClO_4^-$ 등은 $I^-$이온의 정량에 영향을 주지 않았지만, $SCN^-$ 이온은 $I^-$ 이온의 산화전류를 약 32% 감소시켰다.

• Bulletin of the Korean Chemical Society
• /
• 제33권8호
• /
• pp.2679-2682
• /
• 2012

A simple one-pot synthesis of two derivatives of 1,4-dihydropyridines has been described under reflux conditions using copper iodide nanoparticles (CuI NPs) as a catalyst in high yields. This method demonstrated four-component coupling reactions of aldehydes and ammonium acetate via two pathways. In one route, the reaction was performed using 2 eq ethyl acetoacetate while in the other one 1 eq ethyl acetoacetate and 1 eq malononitrile were used. The CuI NPs was reused and recycled without any loss of activity and product yield. It is noteworthy to state that wide range of the 1,4-dihydropyridines have attracted large interest due to pharmacological and biological activities.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
• /
• pp.492-495
• /
• 2008

Efficient top-emitting organic light-emitting diodes were fabricated using copper iodide (CuI) doped NPB as a p-doped hole injection layer to improve hole injection from a silver bottom electrode. The enhanced hole injection is originated from the formation of the charge transfer complex between CuI and NPB. The devices result in high efficiency of 69 cd/A with almost Lambertian emission pattern.

• Bulletin of the Korean Chemical Society
• /
• 제30권4호
• /
• pp.961-964
• /
• 2009

• 대한화학회지
• /
• 제57권2호
• /
• pp.169-171
• /
• 2013

• Bulletin of the Korean Chemical Society
• /
• 제25권7호
• /
• pp.1085-1087
• /
• 2004