• Tribology and Lubricants
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• v.36 no.2
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• pp.88-95
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• 2020

In this study, we investigate the mechanical properties of high manganese steel, and the friction and wear characteristics of brake friction material containing this steel, for passenger car application, with the aim of replacing copper and copper alloys whose usage is expected to be restricted in the future. These steels are prepared using a vacuum induction melting furnace to produce binary and ternary alloys. The hardness and tensile strength of the high manganese steel decrease and the elongation increases with increase in manganese content. This material exhibits high values of hardness, tensile strength, and elongation; these properties are similar to those of 7-3 brass used in conventional friction materials. We fabricate high manganese steel fibers to prepare test pad specimens, and evaluate the friction and wear characteristics by simulating various braking conditions using a 1/5 scale dynamometer. The brake pad material is found to have excellent friction stability in comparison with conventional friction materials that use 7-3 brass fibers; particularly, the friction stability at high temperature is significantly improved. Additionally, we evaluate the wear using a wear test method that simulates the braking conditions in Europe. It is found that the amount of wear of the brake pad is the same as that in the case of the conventional friction material, and that the amount of wear of the cast iron disc is reduced by approximately 10. The high manganese steel is expected to be useful in the development of eco-friendly, copper-free friction material.

• Journal of Surface Science and Engineering
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• v.46 no.1
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• pp.9-15
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• 2013

The effect of the additionally applied electrical current on the adhesion strength between electroless Cu and polyimide films was investigated. Peel tests were performed after applying electrical current within the range from 0.1 to 100 mA for the duration from 1 to 30 minutes. Sample with more than 1 mA of additional electrical current for 1 minute showed higher adhesion strength than that without additional electrical current. However, samples with 10 mA of additional electrical current for more than 10 miniutes showed the degradation of adhesion strength. Ra and RMS values of the peeled polyimide surface were proportional to the adhesion strength though there were no significant changes in the morphology of the peeled surfaces with varied amount and time-length of additional electrical current. Applying electrical current could increase the density of chemical bonding, which results in increase of the adhesion strength between copper and polyimide. However, in the case of applying additional electrical current for excessive amount or time, the degradation of the adhesion strength owing to the formation of copper oxide at the interface could occur.

• Journal of the Korean Wood Science and Technology
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• v.33 no.3 s.131
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• pp.53-63
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• 2005

This study attempted to obtain the basic data of utilizable possibility of preservative treated wood as a material used in a marine ranch. To evaluate the leaching stability of CCA-, CCFZ-, and ACQ-treated woods in seawater, the specimens treated with 2% and 3% (w/v) of CCA, CCFZ, and ACQ were exposed to deionized water, synthetic seawater and natural seawater for 41 days and then each component released was periodically determined. There was little amount of copper and chromium released from CCA-treated wood exposed in both deionized and seawater. Although relatively large amount of arsenic was released from CCA-treated wood, the release rate in seawater was lower than that in deionized water. The release rate of chromium and zinc from CCFZ-treated wood were somewhat greater in deionized water, but lower in seawater than in deionized water. Retention level and salinity of synthetic seawater had little effect on the release rate of components. The ACQ-treated wood had greater copper release than CCA- and CCFZ-treated wood, and the amount of copper released did not affected by leaching media used.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.2
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• pp.619-626
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• 2020

The development of new antifreeze mixtures containing non-amine-type corrosion inhibitors, which considers environmental protection, has become a major issue. In this study, four non-amine-type corrosion inhibitors were synthesized and used to produce five kinds of new antifreeze for automobiles to evaluate the rate of copper corrosion. The effects were evaluated by the weight change, surface observation, roughness measurement, and measurement of copper elution in the solution. The amount of copper eluted measured by ICP from Sample 4 was small, and the elution rate was prolonged. Sample 4 showed the best anti-corrosion performance owing to a corrosion suppression effect by passivating copper because the metal surface was smooth after the test, and the corrosion product layer was formed evenly on the surface as small local corrosion was observed. The major corrosion inhibitor added to Sample 4 was 1-aminomethyl(N',N'-di(2-hydroxyethyl)benzotrazole, which contained a certain amount in Sample 5 to show relatively high local corrosion but passivation in progress. Therefore, among the four corrosion inhibitors, 1-aminomethyl(N',N'-di(2-hydroxyethyl)benzotrazole had the highest corrosion inhibitory effect. This corrosion inhibitor prevents corrosion by promoting the passivation of copper on the antifreeze.

• Journal of the Korean Chemical Society
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• v.51 no.2
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• pp.141-146
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• 2007

The present paper describes a procedure for separation, preconcentration and determination of trace amount of copper in natural water samples by using 2-mercaptobenzimidazol as the complexing agent. The proposed method is based on the surfactant aggregation formed on γ-alumina by mixing sodium dodecyl sulfate and γ-alumina in water; 2-mercaptobenzimidazol was incorporated into inner hydrophobic part of produced ad-micelles in acidic media to produce an assemble suitable for preconcentration and determination of copper ion. Optimum experimental conditions for adsorption of μg/ml levels of copper ions from aqueous solution by the adsorbent have been reported. The copper ions were quantitively adsorbed by the sorbent over the pH range of 7.1-8.0 and were quantitatively desorbed afterward by using sulfosalycilic acid as the eluent. The determination of copper was not interfered in the presence of common metal ions. The procedure was applied for analysis of river water sample. Relative standard deviation was found to be 4.91%.

• Journal of The Korean Society of Clinical Toxicology
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• v.13 no.1
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• pp.36-39
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• 2015

Copper sulfate is a copper compound used widely in the chemical and agriculture industries. Most intoxication occurs in developing countries of Southeast Asia particularly India, but rarely occurs in Western countries. The early symptoms of intoxication are nausea, vomiting, diarrhea, and abdominal cramps, and the most distinguishable clue is bluish vomiting. The clinical signs of copper sulfate intoxication can vary according to the amount ingested. A 75-year old man came to our emergency room because he had taken approximately 250 ml copper sulfate per oral. His Glasgow Coma Scale (GCS) score was 14 and vital signs were blood pressure 173/111 mmHg, pulse rate 24 bpm, respiration rate 24 bpm, and body temperature $36.1^{\circ}$ .... Arterial blood gas analysis (ABGa) showed mild hypoxemia and just improved after 2 L/min oxygen supply via nasal cannula. Other laboratory tests and chest CT scan showed no clinical significance. Three hours later, the patient's mental status showed sudden deterioration (GCS 11), and ABGa showed hypercarbia. He was arrested and his spontaneous circulation returned after 8 minutes CPR. However, 22 minutes later, he was arrested again and returned after 3 minutes CPR. The family did not want additional resuscitation, so that he died 5 hours after ED visit. In my knowledge, early deaths are the consequence of shock, while late mortality is related to renal and hepatic failure. However, as this case shows, consideration of early definite airway preservation is reasonable in a case of supposed copper sulfate intoxication, because the patients can show rapid deterioration even when serious clinical manifestation are not presented initially.

• Archives of Pharmacal Research
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• v.19 no.3
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• pp.178-182
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• 1996

Using superoxide dismutase (SOD)-deficient mutants of Saccharomyces cerevisiae, the oxidative stresses induced by 0.1 mM of copper ion $(Cu^{++})$ was studied. In aerobic culture condition, yeasts lacking MnSOD (mitochondrial SOD) showed more significant growth retardation than CuZnSOD (cytoplasmic SOD)-deficient yeasts. However, not so big differences in growth pattern of those mutants compared withwild type were observed under anaerobic condition. It was found that, under aerobic condition, the supplementation of 0.1 mM copper ioh:(Cu") into culture medium caused the remarkable increase of CuZnSOD but not so significant change in MnSOD. It was also observed that catalase activities appeared to be relatively high in the presence of copper ion in spite of the remarkable reduction of glutathion peroxidase in CuZnSOD-deficient yeasts, but the slight increments of catalase and glutathion peroxidase were detected in MnSOD-deficient strains. It implies that the lack of cytoplasmic SOD could be compensated mainly by catalase. However, these phenomena resulted in the significantincrease of cellular lipid peroxides content in CuZnSOD-deficient yeasts and the slight increment of lipid peroxides in MNSOD-deficient cells. In anaerobic cultivation supplementing copper ion, the cellular enzyme activities of catalase and glutathion peroxidase in SOD-deficient yeasts were slightly increased without any significant changes of lipid peroxides in cell membrane. It suggests that a little amount of free radicals generated by copper ion under anaerobic condition could be sufficiently overcome by catalase as well as glutathion peroxidase.dase.

• Resources Recycling
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• v.14 no.6 s.68
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• pp.16-20
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• 2005

The selective sulphide precipitation of copper from sulphate solution containing nickel and cobalt was studied with adding $Na_{2}S$ solution. Precipitation efficiency of copper increased with raising pH of solution and increasing the amount of $Na_{2}S$ added and lowing its concentration. The increase in reaction time and temperature also improved the precipitation of copper. However, attempts to selectively precipitate copper met with limited success because of co-precipitation of nickel and cobalt. With adding $20\%$ $Na_{2}S$, 3 times equivalent of Cu, at pH 1.0 of solution, $25^{\circ}C$ and 30 minutes of reaction time, precipitation efficiencies of copper, nickel and cobalt were $94.1\%$, $4.3\%$ and $4.5\%$ respectively.

• Resources Recycling
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• v.33 no.4
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• pp.22-28
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• 2024

Waste PCBs contain a large amount of valuable resources, including copper, and technology to recover them is constantly being developed. Generally, to recycle waste PCBs, a physical pretreatment process such as shredding and crushing is required. However, during this stage, the loss rate of metals is high and the sorting efficiency is low, indicating a need for a more efficient recycling pretreatment process. In this study, a high-temperature milling process, which simultaneously employs heat treatment and ball milling, was utilized to efficiently recover copper from waste PCBs. An experiment was conducted at 350 ℃ with milling time, milling speed, and the weight of the balls as variables. The results showed a copper recovery rate of over 90% under the conditions of a ball weight of 500 g, a milling speed of 70 RPM, and a milling time of 5 hours. The purity of the recovered copper was approximately 93%, and through post-processing after the high-temperature milling process, the feasibility of reusing the recovered copper as a high-purity material was confirmed.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.139-140
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• 2002

This paper discusses the effect of plating condition on the mechanical property of electroplated Cu film. Current density, the amount of the organic additives was found to affect the residual stress of electroplated copper film. The result show that, in the case of residual stress, the copper film deposited at higher additive result in lower residual stress and plating current by $15mA/cm^2$ induced a better result than any other ones.