• Environmental Analysis Health and Toxicology
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• v.5 no.1_2
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• pp.51-55
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• 1990

The ultimate Wastes generated after being treated safely and properly were land-filled in Wha Sung Treatment Plant, that of specific hazardous Wastes. There are three kinds of wastes being landfilled, which are sludges, ashes, and solidificated wastes with cement. This research scrutinizes the variations of leachate which originated from landfilled wastes amount to 30,000 ton with analizing the constituent, pH and concentration of wastes once per month since september, 1987. Now, we have some conclusions as followings; 1. The longer retention time of wastes in landfill site and the more quantity of filling-up, the closer pH of leachate to alkalinity. 2. As the quantity of copper and its compounds is over 90 percent of constituents loundfilled wastes, so the copper of leachate goes above treatment criteria. 3. There lis relationship between pH of leachate and eruption of copper and its compounds. The higher pH of leachate, the more secured copper and its compounds. So, we learn that solidificated wastes with cement is more secured than sludges and ashes. 4. The pH and concentration of copper in leachate is low in July and August, this is passing phenomenon which diluted by rainfall in rainy days. 5. The quantities of cadmium and lead of leachate was not over the treatment criteria.

• Journal of Hydrogen and New Energy
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• v.28 no.1
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• pp.70-76
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• 2017

To synthesize copper nanoparticle a thermal decomposition was adopted. And to solve the problem of surface oxidation of the synthesized copper powder an electroless Ag plating method was used. The size and shape of synthesized Cu nanoparticle were affected by the size of copper oxalate used as a precursor, reaction solvent, reaction temperature and amount of reducing agent. Especially reaction solvent is dominant factor to control shape of Cu nano-particle which can have the shapes of sphere, polygon and rod. In case of glycerol, it produced spherical shape of about 500 nm in size. Poly ethylene produced uniform polygonal shape in about 700 nm and ethylene glycol produced both of polygon and rod having size range between 500 and 1500 nm. The silver coated copper powder showed a high electrical conductivity.

• Korean Journal of Materials Research
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• v.4 no.4
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• pp.393-400
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• 1994

A new process for uniform coating of copper to submicron tungsten powder has been developed. W-Cu alloy where copper can be uniformly distibuted has been made by the liquid phase sintering of thus prepared tungsten powder. It has been found that copper content can be lowered less than IOwt. % in our new process, maintaining the uniform distribution of copper in W-Cu alloy. Relative density above 96% was obtained after the liquid phase sintering when small amount of cobalt was added. It was revealed that the rapid increase of densification rate was due to the enhancement of wettability between tungsten particle and liquid copper.

• Journal of Mechanical Science and Technology
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• v.15 no.12
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• pp.1808-1815
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• 2001

The characteristics of a pulsed plasma jet originating from an electrothermal capillary discharge have been investigate using laser-induced fluorescence (LIF) measurement. Previous emission measurements of a 3.1 kJ plasma jet show trial upstream of the Mach disk the temperature and electron number density are about 14,000 K and and 10$\^$17/ cm$\^$-3/, while downstream of the Mach dick tole values are about 25,000 K and 10$\^$18/ cm$\^$-3/, respectively. However, these values are barred on line-of-sight integrated measurements that may be misleading. Hence, LIF is being used to provide both spatially and temporally resolved measurements. Our recent work has been directed at using planar laser-induced fluorescence (PLIF) imaging of atomic copper in the plasma jet flow field. Copper is a good candidate for PLIF studies because it is present throughout the plasma and has electronic transitions that provide an excellent pump-detect strategy. Our PLIF results to date show that emission measurements may give a misleading picture of the flow field, as there appeals to be a large amount of relatively low temperature copper outside the barrel shock. which may lead to errors in temperature inferred from emission spectroscopy. In this paper, the copper LIF image is presented and at the moment, relative density of atomic copper, which is distributed in the upstream of the pulsed plasma jet, is discussed qualitatively.

• Bulletin of the Korean Chemical Society
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• v.23 no.6
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• pp.861-865
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• 2002

A sensitive method for the determination of trace copper(II) after the preconcentration by adsorbing its cupferron complex onto microcrystalline benzophenone was developed.Several experimental conditions such as the pH of sample solution,concentration of cupferron, amount of benzophenone and atirring time were optimized. Trace compper(II) in 100mL solution was chelated with $3.0\;{\times}\;10^3$ M cupferron at pH 5.0. After 0.20g benzophenone, The benzophenone adsorbing Cu-cupferron complex was filtered and then Cu-cupferron complex was desorbed in 10 mL ethanol. Copper was determined by a flame atomic absorption spectrophotomethry. The interfering effects of diverse concomitant ions were investigated. Fe(III) interfered seriously with, but the interference by Fe(III) was completely eliminated by adjusting the concentration of copferron to $5.0\;{\times}\;10^3$ M. The detection limit of this method was 8.6${\times}$10 M(5.5 ngmL$^1$). Recoveries of 97% and 96% were obtained for Cu(II) in a stream water and a brass sample, respectively. Based on the results from the experiment. this proposed technique could be applied to the determination of copper(II) in real samples.

• Journal of Electrochemical Science and Technology
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• v.13 no.2
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• pp.186-198
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• 2022

Heavy metals recovery from Printed Circuit Boards industrial wastewater is crucial because of its cost effectiveness and environmental friendliness. In this study, a copper recovery route combining the sequential processes of acid leaching and LIX 984N extracting with an electrowinning technique from Printed Circuit Boards production's sludge was performed. The used residual sludge was originated from Hanoi Urban Environment One Member Limited Company (URENCO). The extracted solution from the printed circuit boards waste sludge containing a high copper concentration of 19.2 g/L and a small amount of iron (0.575 ppm) was used as electrolyte for the subsequent electrolysis process. By using a simulation model for multi-step current electrolysis, the reasonable current densities for an electrolysis time interval of 30 minutes were determined, to optimize the specific consumption energy for the copper recovery. The mathematical simulation model was built to calculate the important parameters of this process.

• Journal of Powder Materials
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• v.10 no.2
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• pp.136-141
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• 2003

In the present study, $TiO_2$ imbedded copper matrix powders have been successfully prepared from the ($CuSO_4+TiO_2+Zn$) composite salt solution. The composite $Cu/TiO_2$ powders were formed by drying the solution at $200{\sim}~400^{\circ}C$ in the hydrogen atmosphere. Photocatalytic characteristics was evaluated by detecting TOC (total organic carbon) amount with TOC analyzer (model 5000A Shimadzu Co). Phase analysis of $Cu/TiO_2$ composite powders was carried out by XRD, DSC and powder size was measured with TEM. The mean particle size of composite powders was about 100 nm and a few zinc and copper oxide phases was included. The reduction ratio of TOC amount was 60% by the composite $Cu/TiO_2$ powders under the UV irradiation for 8 hours.

• Journal of Environmental Science International
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• v.21 no.11
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• pp.1333-1338
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• 2012

In order to measure the minute amount of Cu(II) in our environment, cyclic voltammetry (CV) and square-wave stripping voltammetry (SWSV) were performed for a trace copper assay using bismuth immobilized on a carbon nanotube paste electrode. An analytical working range of 30 to $240{\mu}g/L$ Cu(II) was obtained for CV and SWSV. The SWSV precision obtained was 0.47 % (n = 15) RSD in $30.0{\mu}g/L$ Cu(II). The detection limit obtained was 3.1 ng/L Cu(II) using SWSV, while the CV yielded the nano-range detection limit through the pre-concentration step. By using this research method, Cu(II) value could be determined in the urine of human sample and in the brain of fish sample. This research can be effectively applied to other cases of measuring minute amount of Cu(II) in living organisms.

• Journal of Korea Foundry Society
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• v.29 no.2
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• pp.86-94
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• 2009

The effect of austenitizing temperature and time on the processing window of 3.60wt%C - 2.50wt%Si - 0.80wt%Cu ductile cast iron and that of the amount of copper added were investigated. The second stage reaction at 400oC was retarded with increased austenitizing temperature. The widest processing window was obtained at the lower austempering temperature with the increased time at the same austenitizing temperature. The width of the widest processing window was decreased with the increase of time at the same austenitizing temperature. The width of processing window was increased with the increased amount of copper added.

• Korean Journal of Materials Research
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• v.29 no.5
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• pp.311-316
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• 2019

Transparent conducting electrodes are essential components in various optoelectrical devices. Although indium tin oxide thin films have been widely used for transparent conducting electrodes, silver nanowire network is a promising alternative to indium tin oxide thin films owing to its lower processing cost and greater suitability for flexible device application. In order to widen the application of silver nanowire network, the electrical conductance has to be improved while maintaining high optical transparency. In this study, we report the enhancement of the electrical conductance of silver nanowire network transparent electrodes by copper electrodeposition on the silver nanowire networks. The electrodeposited copper lowered the sheet resistance of the silver nanowire networks from $21.9{\Omega}{\square}$ to $12.6{\Omega}{\square}$. We perform detailed X-ray diffraction analysis revealing the effect of the amount of electrodeposited copper-shell on the sheet resistance of the core-shell(silver/copper) nanowire network transparent electrodes. From the relationship between the cross-sectional area of the copper-shell and the sheet resistance of the transparent electrodes, we deduce the electrical resistivity of electrodeposited copper to be approximately 4.5 times that of copper bulk.