• Journal of Welding and Joining
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• 제16권3호
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• pp.74-84
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• 1998

The microstructures of the HAZ (Heat Affected Zone) are generally different from the base metal due to rapid thermal cycle during welding process. Particuraly, CGHAZ (Coarsened Grain Heat Affected Zone) near the fusion line is the most concerned region in which many metallurgical and mechanical discontinuities have been normally generated. A computer program by the numerical formularization of phase transformation during cooling with different rates was developed to generate the CCT diagram, and to predict microstructural (phase) changes in the CGHAZ. In order to verify simulated results, isothermal and continuous cooling transformation experiments were conducted. The simulated and experimental results showed that the developed computer model could successfully predict the room temperature microstructural changes (changes in volume fraction of phases) under various welding conditions (heat input & cooling rate $(Δt_{8/5})$).

• 대한기계학회논문집B
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• 제28권4호
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• pp.415-424
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• 2004

Cooling the electronic equipment is one of the major focal points of the design process and the key to successful product launch. The two-phase loop thermosyphone which is a good candidate among many available options was investigated fur cooling of the high power amplifiers. The system is composed of evaporator which contains 6 parallel cold plates, fan cooled condenser, gas-liquid separator, and interconnecting tubes. Experiments were performed for several refrigerant charging values, hs and as a experiment result, the optimum charging value fur this system was proposed. In order to optimize the system design, the operating cycle pressure and inlet/outlet temperatures of evaporator and condenser are measured and analyzed. The effect of the three parameters such as flow rate and temperature of condenser cooling air, and thermal load on the evaporator are investigated. The lower the operating pressure and the cycle temperatures are also better to prevent the leakage of the system. The system invesigated in this paper can be directly used for cooling of a real unmanned wireless communication station.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2322-2327
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• 2008

This paper is to provide analysis model that can be used to investigate the improvement in energy efficiency for cooling tower by using fresh air. Numerical analysis of Air-cooled heat exchanger for single-phase flow with variations of outdoor air temperature has been performed. A complete set of correlations of the heat transfer in both refrigerant and air sides was employed for predicting the heat transfer rate. The numerical results derived from the correlations were verified with experimental results. The energy consumption for a hybrid cooling tower has been compared for variation of a outdoor air temperature. The results showed that the hybrid cooling tower in low outdoor temperature offers a significant improvement in energy efficiency. The thermal analysis aids significantly in the solution of the design problem of hybrid cooling tower.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2043-2052
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• 2008

The increasing heat generation rates in CPU of notebook computers motivate a research on cooling technologies with low thermal resistance. This paper develops a closed-loop two-phase cooling system using a micropump to circulate a dielectric liquid(PF5060). The cooling system consists of an evaporator containing a boiling enhancement microstructure connected to a condenser with mini fans providing external forced convection. The cooling system is characterized by a parametric study which determines the effects of volume fill ratio of coolant, existence of a boiling enhancement microstructure and pump flow rates on thermal performance of the closed loop. Experimental data shows the optimal parametric values which can dissipate 33.9W with a film heater maintained at $95^{\circ}C$.

• 한국기계가공학회지
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• 제10권3호
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• pp.53-59
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• 2011

In this study, a two-phase closed loop cooling system is desinged and tested for a laptop computer using a FC-72. The cooling system is characterized by a parametric study which determines the effects of existence of a boiling enhancement microstructure, initial system pressure, volume fill ratio of coolant and inclination angle of condenser on the thermal performance of the closed loop. Experimental data show the optium condition when the volume ratio of working fluid is 70%, the pump flowing is 6ml/min, and the inclination angle of condenser is $0^{\circ}$. This research shows the maximum values which can dissipate 33W of chip power with a chip temperature maintained at $95^{\circ}C$.

• 한국에너지공학회:학술대회논문집
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• 한국에너지공학회 2006년도 에너지.가스.기후변화학회 연합춘계학술대회 및 특별심포지움
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• pp.317-324
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• 2006

This study aims to find out cooling characteristics of TMA(Tri-Methyl-Amine, ($CH_{3})_{3}N$) 25wt%-clathrate compound with ethanol($CH_{3}CH_{2}OH$) such as supercooling, phase change temperature and specific heat. For this purpose, ethanol is added as per weight concentration and cooling experiment is performed at $-6{\sim}-8^{\circ}C$, cooling heat source temperature, and it leads the following result. (1) Phase change temperature is decreased due to freezing point depression phenomenon. Especially, it is minimized as $3.8^{\circ}C$ according to cooling source temperature in case that 0.5w% of ethanol is added. (2) If 0.5wt% of ethanol is added, average supercooling degree is $0.9^{\circ}C $ and minimum supercooling is $0.8,\;0.7^{\circ}C$ according to cooling heat source temperature. The restraint effect of supercooling is shown. (3) Specific heat shows tendency to decrease if ethanol is added. It is $3.013{\sim}3.048\;kJ/kgK$ according to cooling heat source temperature if 0.5wt% of ethanol is added. Phase change temperature higher than that of water and inhibitory effect against supercooling can be confirmed through experimental study on cooling characteristics of TMA 25wt%-water clathrate compound by adding additive, ethanol. This can lead to shorten refrigerator operation time of low temperature thermal storage system and improve COP of refrigerator and efficiency of overall system. Therefore energy can be saved and efficiency can be improved much more.

• 한국주조공학회지
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• 제26권1호
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• pp.17-26
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• 2006

The substitution of cooling method from water quenching to air cooling after solution heat treatment was aimed for the development of a convenient and economical heat treatment process of duplex stainless steels without deterioration of mechanical and corrosion resistant properties for the industry. In order to achieve this goal, the mechanical properties and corrosion properties of a ASTM A890-4A duplex stainless steel were systematically investigated as functions of casting condition and cooling method after solution heat treatment. A 3-stepped sand mold and a permanent Y-block mold were used to check the effects of solidification structure and cooling rate after solution heat treatment. The microstructural characteristics such as the ferrite/austenite phase ratio and the precipitation behavior of ${\sigma}$ phase and carbides were investigated by combined analysis of OM and SEM-EDX with an aid of TTT diagram. Hardness and tension test were performed to evaluate the mechanical properties. Impact property at $-40^{\circ}C$ and corrosion resistance were also examined to check the possibility of the industrial application of this basic study. Throughout this investigation, air-cooling method was proved to effectively substitute for water-quenching process after the solution heat treatment, when the duplex stainless steel was sand mold cast with a thickness below 15 mm or permanent mold cast with a thickness below 20 mm.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 춘계학술대회논문집
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• pp.172-175
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• 2003

Run-Out-Table is the region between EDT and CT. Hot killed strip is cooled by air and water in ROT. In this procedure, phase transformation and shape deformation occur due to temperature drop. Because of un-ideal cooling condition, deformation of strip and non-uniform phase distribution come into existence. This phenomenon affects the strip property and lead th the existence of residual stress. And it exerts effects on the Coiling process, Coil Cooling process, and Un-coiling process. Through these process, the residual stresses of strip are more larger and unbalance of these stresses become more severe. Finite element (FE) based models for the analysises of non-steady state heat transfer and elastoplastic deformation are described in this investigation. The analysises of thermodynamics and phase transformation kinetics are suggested also. Using the ROT simulation result coiling process and coil cooling process simulations are carried out.

• 소성∙가공
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• 제12권4호
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• pp.302-307
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• 2003

Hot rolled strip is cooled by air and water in Run-Out-Table. In this process, phase transformation and shape deformation occurs due to temperature drop. Because of un-ideal cooling condition of ROT, irregular shape deformation and phase transformation arise in the strip. which affect the strip property and lead to the residual stress of strip. And these exert effects on the following processes, coiling process, coil cooling process, and re-coiling process. Through these processes, the residual stress becomes higher and severe. For the prediction of residual stress distribution and shape deformation of final product, Finite element(FE) based model was used. It consists of non-steady state heat transfer analysis, elasto-plastic analysis. thermodynamic analysis and phase transformation kinetics. Successive FEM simulation were applied from ROT process to coil cooling process. In each process simulation, previous process simulation results were used for the next process simulation. The simulation results were matched well with the experimental results.

• 설비공학논문집
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• 제22권9호
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• pp.614-619
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• 2010

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of a slimness of the devices, so it is not easy to find the optimal thermal management solution for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint of the applications. In the present study, the silicon flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. The normal isothermal characteristics created by vapor-liquid phase change was confirmed through the experimental study. The cooling device with 70 mm of total length showed 6.8 W of the heat transfer rate within the range of $4{\sim}5^{\circ}C/W$ of thermal resistance. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of the silicon and glass cooling device.