• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Composites Research
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• v.23 no.1
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• pp.44-50
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• 2010

In this paper, two different experiments, namely, salt water spray and salt water immersion, were performed to reproduce the contact of composites with the seawater for three kinds of woven fabric composite material systems which would be used for the WIG(wing in ground effect)craft. After aging 140 days in the salt water environment, material properties of carbon/epoxy and glass/epoxy composite such as tensile, compressive and shear stiffness and strength, and inter-laminar shear strength (ILSS) were measured. By comparing baseline material properties with degraded ones, the effects of the salt water environment on the composite mechanical properties were evaluated. From the experiments, it was confirmed that the difference in aging conditions had very small influence on composite properties. And it was found that tensile strength of carbon/epoxy composites showed little degradation, but much more degradation was observed in glass/epoxy composites. And large degradations on matrix dominant properties were observed. The salt water could damage the fiber-matrix interface, matrix properties and the glass fiber.

• Polymer(Korea)
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• v.28 no.2
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• pp.103-110
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• 2004

The biodegradable poly($\varepsilon$-caprolactone) (PCL) microcapsules containing tocopherol were prepared by oil-in-water emulsion solvent evaporation method. The features of the microcapsules were investigated in the manufacturing conditions and degradation behaviors. The form and structural feature of the microcapsules were measured by scanning electron microscope and X-ray diffraction, respectively. The surface free energy of the microcapsules was executed using contact angle measurement. As a result, the microcapsules were more stable and spherical with poly(vinyl alcohol) given in a surfactant. The surface free energy and crystallinity of microcapsules were decreased with increasing the core concentration, and degradation of PCL was occurred after 21 days. The release behaviors were examined by Uv/vis. spectrophotometer. It was found that the release rate of the microcapsules was increased with increasing the stirring rate, due to the increased interface between microcapsules and release media.

• Current Photovoltaic Research
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• v.1 no.2
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• pp.82-89
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• 2013

$Cu_2ZnSnS_4$ thin film have been fabricated by rapid thermal annealing of dc-sputtered metal precursor with Cu/ZnSn/Cu stack in sulfur ambient. A CZTS film with a good uniformity was formed at $560^{\circ}C$ in 6 min. $Cu_2SnS_3$ and $Cu_3SnS_4$ secondary phases were present at $540^{\circ}C$ and a trace amount of $Cu_2SnS_3$ secondary phase was present at $560^{\circ}C$. Single-phase large-grained CZTS film with rough surface was formed at $560^{\circ}C$. Solar cell with best efficiency of 4.7% ($V_{oc}=632mV$, $j_{sc}=15.8mA/cm^2$, FF = 47.13%) for an area of $0.44cm^2$ was obtained for the CZTS absorber grown at $560^{\circ}C$ for 6 min. The existence of second phase at lower-temperature annealing and rough surface at higher-temperature annealing caused the degradation of cell performance. Also poor back contact by void formation deteriorated cell performance. The fill factor was below 0.5; it should be increased by minimizing voids at the CZTS/Mo interface. Our results suggest that CZTS absorbers can be grown by rapid thermal annealing of metallic precursors in sulfur ambient for short process times ranging in minutes.

• Tribology and Lubricants
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• v.30 no.2
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• pp.108-115
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• 2014

The friction behaviors of bulk amorphous thermal spray coating (BAC) and second phase-reinforced composite coatings using a high velocity oxy-fuel spraying process were investigated using a ball-on-disk test rig that slides against a ceramic ball in an atmospheric environment. The surface temperatures were measured using an infrared thermometer installed 50 mm from the contact surface. The crystallinities of the coating layers were determined using X-ray diffraction. The morphologies of the coating layers and worn surfaces were observed using a scanning electron microscope and energy-dispersive spectroscopy. The results show that the friction behavior of the monolithic amorphous coating was sensitive to the testing conditions. Under lower than normal loads, a low and stable friction coefficient of about 0.1 was observed, whereas under a higher relative load, a high and unstable friction coefficient of greater than 0.3 was obtained with an instant temperature increase. For the composite coatings, a sudden increase in friction coefficient did not occur, i.e., the transition region did not exist and during the friction test, a gradual increase occurred only after a significant delay. The BAC morphology observations indicate that viscous plastic flow was generated with low loads, but severe surface damage (i.e., tearing) occurred at high loads. For composite coatings, a relatively smooth surface was observed on the worn surface for all applied loads.

• International Journal of Korean Welding Society
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• v.2 no.2
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• pp.19-25
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• 2002

In recent years, techniques for micro-assembly with high repeatability under a scanning electron microscope (SEM) are required to construct highly functional micro-devices. Adhesion phenomenon is more significant for smaller objects, because adhesional force is proportional to size of the objects while gravitational force is proportional to the third power of it. It is also known that adhesional force between micro-objects exposed to Electron Beam irradiation of SEM increases with the elapsed time. Therefore, mechanical manipulation techniques using a needle-shaped tool by adhesional force are often adopted in basic researches where micro-objects are studied. These techniques, however, have not yet achieved the desired repeatability because many of these could not have been supported theoretically. Some techniques even need the process of trial-and-error. Thus, in this paper, mechanical and adhesional micro-manipulation are analyzed theoretically by introducing new physical factors, such as adhesional force and rolling-resistance, into the kinematic system consisting of a sphere, a needle-shaped tool, and a substrate. Through this analysis, they are revealed that how the micro-sphere behavior depends on the given conditions, and that it is possible to cause the fracture of the desired contact Interfaces selectively by controlling the force direction in which the tool-tip loads to the sphere. Based on the acquired knowledge, a mode diagram, which indicates the micro-sphere behavior for the given conditions, is designed. By referring to this mode diagram, the practical technique of the pick and place manipulation of a micro-sphere under an SEM by the selective interface fracture is proposed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.4
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• pp.379-384
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• 2014

The most critical rotating parts of a gas turbine engine are turbine blades and disc, given that they must operate under severe conditions such as high turbine inlet temperature, high speeds, and high compression ratios. Owing to theses operating conditions and high rotational speed energy, some failures caused by turbine disks and blades are categorized into catastrophic and critical, respectively. To maximize the margin of structural integrity, we aim to optimize the vulnerable area of disc-blade interface region. Then, to check the robustness of the obtained optimized solution, we evaluated structural reliability under uncertainties such as dimensional tolerance and fatigue life variant. The results highlighted the necessity for and limitations of optimization which is one of deterministic methods, and pointed out the requirement for introducing reliability-based design optimization which is one of stochastic methods. Thermal-structural coupled-filed analysis and contact analysis are performed for them.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.933-937
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• 2002

The fiber reinforced composite material is widely used in the multi-industrial field where the weight reduction of the infrastructure is demanded because of their high specific modulus and specific strength. Pressure vessels using this composite material in comparison with conventional metal vessels can be applied in the field where lightweight and the high pressure are demanded from the defense and aerospace industry to rocket motor case due to the merits which are energy cutdown the weight reduction and decrease of explosive damage preceding to the sudden explosion which is generated by the pressure leakage condition). In this paper, for nonlinear finite element analysis of E-glass/epoxy filament winding composite pressure vessel receiving an internal pressure, the standard interpretation model is developed by using the ANSYS, general commercial software, which is verified as the accuracy and useful characteristic of the solution based on Auto LISP and ANSYS APDL. Both the preprocessor for doing exclusive analysis of filament winding composite pressure vessel and postprocessor that simplifies result of analysis have been developed to help the design engineers.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

• Korean Journal of Materials Research
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• v.14 no.6
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• pp.389-393
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• 2004

The silicide layer used as a diffusion barrier in microelectronics is typically required to be below 50 nm-thick and, the same time, the silicides also need to have low contact resistance without agglomeration at high processing temperatures. We fabricated Si(100)/15 nm-Ni/15 nm-Co samples with a thermal evaporator, and annealed the samples for 40 seconds at temperatures ranging from $700^{\circ}C$ to $1100^{\circ}C$ using rapid thermal annealing. We investigated microstructural and compositional changes during annealing using transmission electron microscopy and auger electron spectroscopy. Sheet resistance of the annealed sample stack was measured with a four point probe. The sheet resistance measurements for our proposed Co/Ni composite silicide was below 8 $\Omega$/sq. even after annealing $1100^{\circ}C$, while conventional nickel-monosilicide showed abrupt phase transformation at $700^{\circ}C$. Microstructure and auger depth profiling showed that the silicides in our sample consisted of intermixed phases of $CoNiSi_{x}$ and NiSi. It was noticed that NiSi grew rapidly at the silicon interface with increasing annealing temperature without transforming into $NiSi_2$. Our results imply that Co/Ni composite silicide should have excellent high temperature stability even in post-silicidation processes.