• Title/Summary/Keyword: contact interface

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Interfacial Evaluation of Single Ramie and Kenaf Fibers/Epoxy Composites Using Micromechanical Technique (Micromechanical 시험법을 이용한 Kenaf 및 Ramie 섬유 강화 에폭시 복합재료의 계면물성 평가)

  • Park, Joung-Man;Tran, Quang Son;Jung, Jin-Gyu;Kim, Sung-Ju;Hwang, Byung-Sun
    • Journal of Adhesion and Interface
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    • v.6 no.2
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    • pp.13-20
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    • 2005
  • Interfacial shear strength (IFSS) of environmentally friendly natural fiber reinforced polymer composites plays a very important role in controlling the overall mechanical performance. The IFSS of various Ramie and Kenaf fibers/epoxy composites was evaluated using the combination of micromechanical test and nondestructive acoustic emission (AE) to find out optimal conditions for desirable final performance. Dynamic contact angle was measured for Ramie and Kenaf fibers and correlated the wettability properties with interfacial adhesion. Mechanical properties of Ramie and Kenaf fibers were investigated using single-fiber tensile test and analyzed statistically by both uni-and bimodal Weibull distributions. An influence of clamping effect on a real elongation for both Ramie and Kenaf fibers were evaluated as well. Two different microfailure modes, axial debonding and fibril fracture coming from fiber bundles and single fiber composites (SFC) were observed under tension and compression.

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The Contact Characteristics of Ferroelectrics Thin Film and a-Si:H Thin Film (강유전성 박막의 형성 및 수소화 된 비정질실리콘과의 접합 특성)

  • 허창우
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.7 no.3
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    • pp.468-473
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    • 2003
  • In this paper, for enhancement of property on a-Si:H TFTs We measure interface characteristics of ferroelectrics thin film and a-Si:H thin film. First, SrTiO$_3$ thin film is deposited bye-beam evaporation. Deposited films are annealed for 1 hour in N2 ambient at $150^{\circ}C∼600^{\circ}C$. Dielectric characteristics of deposited SrTiO$_3$ films are very good because dielectric constant shows 50∼100 and breakdown electric field are 1 ∼ 1.5 MV/cm. a-SiN:H,a-Si:H(n-type a-Si:H) are deposited onto SrTiO$_3$ film to make MFNS(Meta1/ferroelectric/a-SiN:H/a-Si:H) by PECVD. After the C-V measurement for interface characteristics, MFNS structure shows no difference with MNS(Metal/a-SiN:H/a-Si:H) structure in C-V characteristics but the insulator capacitance value of MFNS structure is much higher than the MNS because of high dielectric constant of ferroelectric.

Interface Treatment Effect of High Performance Flexible Organic Thin Film Transistor (OTFT) Using PVP Gate Dielectric in Low Temperature (저온 공정 PVP게이트 절연체를 이용한 고성능 플렉서블 유기박막 트랜지스터의 계면처리 효과)

  • Yun, Ho-Jin;Baek, Kyu-Ha;Shin, Hong-Sik;Lee, Ga-Won;Lee, Hi-Deok;Do, Lee-Mi
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.1
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    • pp.12-16
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    • 2011
  • In this study, we fabricated the flexible pentacene TFTs with the polymer gate dielectric and contact printing method by using the silver nano particle ink as a source/drain material on plastic substrate. In this experiment, to lower the cross-linking temperature of the PVP gate dielectric, UV-Ozone treatment has been used and the process temperature is lowered to $90^{\circ}C$ and the surface is optimized by various treatment to improve device characteristics. We tried various surface treatments; $O_2$ Plasma, hexamethyl-disilazane (HMDS) and octadecyltrichlorosilane (OTS) treatment methods of gate dielectric/semiconductor interface, which reduces trap states such as -OH group and grain boundary in order to improve the OTFTs properties. The optimized OTFT shows the device performance with field effect mobility, on/off current ratio, and the sub-threshold slope were extracted as $0.63cm^2 V^{-1}s^{-1}$, $1.7{\times}10^{-6}$, and of 0.75 V/decade, respectively.

PC based Immersive Virtual Environment(PIVE) System by Recognizing Human Motion (인체 동작 인식을 통한 PC 기반의 몰입 형 가상 환경 시스템)

  • Oh Young-Il;Jo Kyoung-Hwan;Lee Ji-Hong
    • Journal of the Institute of Electronics Engineers of Korea CI
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    • v.43 no.4 s.310
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    • pp.103-112
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    • 2006
  • In this paper, we propose a PC based immersive virtual environment system with expandability and compatibility in contrary to existing immersive virtual environment(IVE) systems which have been implemented by supercomputer or special computing system. The application based on commercial personal compute may have two major advantage: one is variety of resources, the other is user-friendly interface. This system intends to offer easy contact to IVE system, realistic images, and convenience. Also, the system can handle various virtual reality at real-time and make it easier to interface existing complicated haptic device. Geometric techniques are adopted to calculate and visualize the physical phenomenon to speed up the computing time. The proposed implementation method of PC based immersive virtual environment system is implemented to the example in which user move around inside of and interact with virtual office environment wearing data glove, behavior recognition devices, and HMD.

Biocompatibility and Surface Characteristics of PEO-treated Ti-40Ta-xZr Alloys for Dental Implant Materials

  • Yu, Ji-Min;Cho, Han-Cheol
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.23-23
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    • 2018
  • In this study, new titanium alloys were prepared by adding elements such as tantalum (Ta), zirconium (Zr) and the like to complement the biological, chemical and mechanical properties of titanium alloys. The Ti-40Ta-xZr ternary alloy was formed on the basis of Ti-40Ta alloy with the contents of Zr in the contents of 0, 3, 7 and 15 wt. %. Plasma electrolytic oxidation (PEO), which combines high-voltage sparks and electrochemical oxidation, is a novel method to form ceramic coatings on light metals such as Ti and its alloys. These oxide film produced by the electrochemical surface treatment is a thick and uniform porous form. It is also composed of hydroxyapatite and calcium phosphate-based phases, so it has the characteristics of bone inorganic, non-toxic and very high bioactivity and biocompatibility. Ti-40Ta-xZr alloys were homogenized in an Ar atmosphere at $1050^{\circ}C$ for 1 hour and then quenched in ice water. The electrochemical oxide film was applied by using a power supply of 280 V for 3 minutes in 0.15 M calcium acetate monohydrate ($Ca(CH_3COO)_2{\cdot}H_2O$) and 0.02 M calcium glycerophosphate ($C_3H_7CaO_6P$) electrolyte. A small amount of 0.0075M zinc acetate and magnesium acetate were added to the electrolyte to enhance the bioactivity. The mechanical properties of the coated surface of Ti-40Ta-xZr alloys were evaluated by Vickers hardness, roughness test, and elastic modulus using nano-indentation, and the surface wettability was evaluated by measuring the contact angle of the coated surface. In addition, cell activation and differentiation were examined by cell culture of HEK 293 (Human embryonic kidney 293) cell proliferation. Surface properties of the alloys were analyzed by scanning electron microscopy(FE-SEM), EDS, and X-ray diffraction analysis (XRD).

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Real-Time Recognition Method of Counting Fingers for Natural User Interface

  • Lee, Doyeob;Shin, Dongkyoo;Shin, Dongil
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.10 no.5
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    • pp.2363-2374
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    • 2016
  • Communication occurs through verbal elements, which usually involve language, as well as non-verbal elements such as facial expressions, eye contact, and gestures. In particular, among these non-verbal elements, gestures are symbolic representations of physical, vocal, and emotional behaviors. This means that gestures can be signals toward a target or expressions of internal psychological processes, rather than simply movements of the body or hands. Moreover, gestures with such properties have been the focus of much research for a new interface in the NUI/NUX field. In this paper, we propose a method for recognizing the number of fingers and detecting the hand region based on the depth information and geometric features of the hand for application to an NUI/NUX. The hand region is detected by using depth information provided by the Kinect system, and the number of fingers is identified by comparing the distance between the contour and the center of the hand region. The contour is detected using the Suzuki85 algorithm, and the number of fingers is calculated by detecting the finger tips in a location at the maximum distance to compare the distances between three consecutive dots in the contour and the center point of the hand. The average recognition rate for the number of fingers is 98.6%, and the execution time is 0.065 ms for the algorithm used in the proposed method. Although this method is fast and its complexity is low, it shows a higher recognition rate and faster recognition speed than other methods. As an application example of the proposed method, this paper explains a Secret Door that recognizes a password by recognizing the number of fingers held up by a user.

Pressure Sensitive Adhesion Performances of SIS/SBS based UV-curable Pressure Sensitive Adhesives using Thiol-ene Reaction (Thiol-ene 반응을 이용한 UV경화형 SIS/SBS계 점착제의 점착물성)

  • Lim, Dong-Hyuk;Do, Hyun-Sung;Kim, Hyun-Joong;Yoon, Goan-Hee;Bang, Jung-Suk
    • Journal of Adhesion and Interface
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    • v.6 no.3
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    • pp.19-25
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    • 2005
  • Synthetic rubber based pressure-sensitive adhesives (PSAs) usually containing SIS or SBS block copolymer, tackifier, plasticizer, and other additives are now widely used on various applications. As these PSAs are physically crosslinked and can be applied without the use of solvent, they are thermally processable and environmentally friendly. However these PSAs cannot be used in high temperature applications and in applications where solvent and chemical resistance properties are required. We developed the PSA adding UV curable system, such as thiol-ene system, to increase adhesion properties at elevated temperature. The adhesion properties such as probe tack, peel strength, shear adhesion failure temperature (SAFT) were evaluated. The probe tack test was conducted with varying probe materials and coating thickness of PSAs. Using the contact angle, the surface property of the cured PSAs was also observed.

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Synthesis and Characterization of Water Repellent Materials Containing 2-(Perfluorooctyl) Ethyl Acrylate and m-Isopropenyl-α, α-Dimethylbenzyl Isocyanate (2-(Perfluorooctyl) Ethyl Acrylate (PFOEA) 및 m-Isopropenyl-α, α-Dimethylbenzyl Isocyanate (TMI)가 함유된 발수체 합성 및 특성연구)

  • Kang, Young Taec;Kwak, Eun Mi;Chung, Ildoo
    • Journal of Adhesion and Interface
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    • v.15 no.4
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    • pp.151-160
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    • 2014
  • A series of terpolymers based on stearyl methacrylate (SMA), n-methyol acrylamide (n-MAM), and 2-(perfluorooctyl) ethyl acrylate (PFOEA) were synthesized by changing PFOEA contents up to 8 wt% in order to obtain optimal water-repellent properties. In addition, various contents of m-isopropenyl-${\alpha}$,${\alpha}^{\prime}$-dimethylbenzyl isocyanate (TMI) from 1 to 4 wt% were added to the above terpolymers with 4 wt% of PFOEA content. The emulsion polymerization was carried out using tridecyl alcohol (EO)7 (TDA-7) as a nonionic surfactant, alkyl dimethyl amine derivatives (ADAD) as a cationic surfactant, and 2,2'-azobis(2-amidinopropane dihydrochoride) (AAPDL) as an initiator. The synthesized copolymers were characterized by FT-IR spectroscopies, contact angle, surface energy, and water-repellency. Surface and thermal properties were analyzed by SEM, TGA, and DSC. It was found that water repellency increased with increasing the contents of PFOEA and TMI.

Studies on Adhesion and Mechanical Properties of Casting Polyurethane Elastomer with Acid Groups (Acid Group이 도입된 Casting 폴리우레탄 탄성체의 접착 및 기계적 물성에 관한 연구)

  • Mok, Dong Youb;Shin, Hyun Deung;Kim, Dong Ho;Kim, Gu Ni;Moon, Hyung Suk;Kim, In-Soo
    • Journal of Adhesion and Interface
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    • v.14 no.2
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    • pp.68-74
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    • 2013
  • We synthesized polyurethane elastomer containing acid groups. We measured the adhesion, grip, tensile strength and mechanical properties. Casting polyurethane elastomers were prepared with the contents of acid. The adhesive strength and the wet slip were increased. Also, the tensile strength and abrasion properties were increased. We measured the properties with different acid contents. Increasing the acid content, the mechanical properties were increased. But the mechanical properties were decreased above 0.20 wt% of acid content. The wet slip was increased and the contact angle was decreased as the acid content increased.

Ga Distribution in Cu(In,Ga)Se2 Thin Film Prepared by Selenization of Co-Sputtered Cu-In-Ga Precursor with Ga2Se3 Layer (Ga2Se3 층을 Cu-In-Ga 전구체 위에 적용하여 제조된 Cu(In,Ga)Se2 박막의 Ga 분포 변화 연구)

  • Jung, Gwang-Sun;Shin, Young-Min;Cho, Yang-Hwi;Yun, Jae-Ho;Ahn, Byung-Tae
    • Korean Journal of Materials Research
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    • v.20 no.8
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    • pp.434-438
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    • 2010
  • The selenization process has been a promising method for low-cost and large-scale production of high quality CIGS film. However, there is the problem that most Ga in the CIGS film segregates near the Mo back contact. So the solar cell behaves like a $CuInSe_2$ and lacks the increased open-circuit voltage. In this study we investigated the Ga distribution in CIGS films by using the $Ga_2Se_3$ layer. The $Ga_2Se_3$ layer was applied on the Cu-In-Ga metal layer to increase Ga content at the surface of CIGS films and to restrict Ga diffusion to the CIGS/Mo interface with Ga and Se bonding. The layer made by thermal evaporation was showed to an amorphous $Ga_2Se_3$ layer in the result of AES depth profile, XPS and XRD measurement. As the thickness of $Ga_2Se_3$ layer increased, a small-grained CIGS film was developed and phase seperation was showed using SEM and XRD respectively. Ga distributions in CIGS films were investigated by means of AES depth profile. As a result, the [Ga]/[In+Ga] ratio was 0.2 at the surface and 0.5 near the CIGS/Mo interface when the $Ga_2Se_3$ thickness was 220 nm, suggesting that the $Ga_2Se_3$ layer on the top of metal layer is one of the possible methods for Ga redistribution and open circuit voltage increase.