• Title/Summary/Keyword: contact interface

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A study of microstructure of Ni-monosilicide fabricated with a thermal evaporator (열증착법으로 제조된 니켈 모노실리사이드의 미세구조 연구)

  • 안영숙;송오성;양철웅
    • Journal of Surface Science and Engineering
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    • v.32 no.6
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    • pp.703-708
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    • 1999
  • Silicides have been used extensively in ULSI logic device fabrication as contact materials for the active areas as well as the poly- Si gates. NiSi is a promising candidate for submicron device application due to less volume expansion, low formation temperature, little silicon consumption, and large stable processing temperature window. In this report, the microstructure of nickel silicides fabricated with a thermal evaporator has been investigated. We observed systematic transformation of Ni silicides of $Ni_2$Si, NiSi, $NiSi_2$, as annealing temperature increases. All the silicides have been identified by a X-ray diffractometer (XRD). The cross-sectional microstructure of silicides was examined by a transmission electron microscope (TEM) equipped with a energy dispersive spectrometer(EDS). The surface roughness of silicides was measured by scanning probe microscope(SPM). Although we observed thin oxide layer existed at the $Ni/NiSi_{x}$ interface, we fabricated successfully $550\AA$-thick planar Ni-monosilicide at the temperature range of$ 400~700^{\circ}C$.

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Hertzian Crack Suppression and Damage Tolerance of Silicon Nitride Bilayer

  • Lee, Kee-Sung;Kim, Do-Kyung;Lee, Seung-Kun;Lawn, Brian R.
    • The Korean Journal of Ceramics
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    • v.4 no.4
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    • pp.356-362
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    • 1998
  • Hertzian crack suppression phenomena and relatively high damage tolerance were investigated in hard/soft silicon nitride ($Si_3N_4$) bilayers. Coarse $\alpha}-Si_3N_4$ powder was wsed for the hard coating layer and fine $\alpha}-Si_3N_4$ powder was used for the soft substrate layer. The two layers were designed with a strong interface. Hertzian indentation was used to investigate contact fracture and damage tolerance property. Hertzian crack suppression has occurred with increasing applied load and decreasing coating thickness. The crack suppression contributed strength improvement, especially in the bilayers with thinner coatings. Ultimately, the combination of hard coating with soft but tough underlayer improved the damage tolerance of brittle $Si_3N_4$ ceramics.

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Joining Behavior of Ceramics to Metal by Using Lead-bismate Heavy Metal Glass Frit (중금속 창연산화납계 저온유리 분말을 이용한 세라믹스/금속의 접합거동)

  • Choi, Jin Sam
    • Journal of the Korean Ceramic Society
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    • v.51 no.4
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    • pp.312-316
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    • 2014
  • The joining behavior of forsterite ceramics to SUS304 alloy using $8PbO-78Bi_2O_3-8B_2O_3-4ZnO-2SiO_2$ (wt%) system glass frit was investigated. The contact angle was smaller than $90^{\circ}$ at a temperature of $460^{\circ}C$. Redox reaction at the interface between forsterite and SUS304 was found to appear when the electrons in the metal part moved toward the glass part and the oxygen ions in glass moved to the metal side. The decrease of the surface tension due to the PbO solubility on the forsterite side contributed to the better wetting behavior at low temperature.

Effects of MgO Addition on Densification and Microstructural Development during Liquid-Phase Sintering of Alumina-Anorthite System (알루미나-anorthite 계의 액상소결에서 MgO의 첨가가 치밀화 및 미세구조에 미치는 영향)

  • 김호양;이정아;김정주
    • Journal of the Korean Ceramic Society
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    • v.36 no.11
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    • pp.1243-1251
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    • 1999
  • Densification behavior and microstructural evolution during the liquid-phase sintering of alumina-anorhite system were investigated as a function of MgO addition. When MgO component was added in either alumina or anorthite glass powder the aspect ratio of alumina grains decreased and concurrently the are of flat interface which was formed as a result of contact solid alumina gains rather increased. Consequently addition of MgO component in the Al2O3-amorthite system brought about suppression of the rearrangement of solid grains during the liquid phase sintering and then densification of specimens was also retarded.

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Applications of Interface Elements to Contact Problems in Reinforced Concrete Structures (경계면 요소를 이용한 철근콘크리트 접촉면의 응력해석)

  • 최완철;정일영
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 1992.10a
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    • pp.90-96
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    • 1992
  • 경계면 요소를 이용하여 철근콘크리트 구조물의 접촉면 문제를 유한 요소법으로 해석하는 기법에 대하여 연구한다. 본 연구에서는 경계면 요소의 수치해석의 이론과정을 전개하고, 실험 관찰된 부착 시험체에 적용하여 이형철근과 콘크리트 부착기구의 접촉면을 해석한다. 경계면은 특별한 연결요소를 이용하여 재현하며 Mohr-Coulomb의 마찰 이론을 응응한다. 해석의 주요점으로 하중상태에 따라 변화되는 경계면의 접촉상태, 즉 고정(stick), 미끄러짐(slide), 분리(separation)를 묘사하여 경계면 재료의 비선형 거동을 관찰한다. 부착모델의 해석결과는 실험실의 결과와 대체로 일치되며 따라서 철근콘크리트 접촉면의 응력해석을 위해 경계면 요소가 활용될 수 있음을 보여준다.

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Characteristics on the distribution of salinity of airborne sea salt by height (높이에 따른 비래염분량의 감소 특성)

  • Lee Jong Suk;Choi Won Sung;Kim Do Gyeum;Moon Han Young
    • Proceedings of the Korea Concrete Institute Conference
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    • 2005.05b
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    • pp.261-264
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    • 2005
  • For concrete structures immersed in seawater, the concentration of chloride used to estimate the chloride diffusion coefficient can be defined as the seawater chloride concentration. However, for seashore concrete structures which are not coming into direct contact with seawater, establishing the interface concentration of chloride becomes delicate. In addition, concrete structures are greatly affected by salt attack primarily due to airborne sea salt like it can be seen through the corrosion of rebar. This study intends to investigate characteristics on the salinity of airborne sea salt by height. Salinity measurement devices were installed at height of 2, 10 and 19m on the seashore water tower located in the area of Samchuk in the Eastern coast. Analysis results of the decrease of salinity with respect to the height above the ground at a distance of 30m from the seashore showed that the reduction reached about 40$\%$ at a height of 10m and 60$\%$ at 20m.

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Optical Properties of Semiconductors Depending on the Contact Characteristic Between Different Groups (이종 물질의 접합계면에 의한 반도체 물질의 광학적 특성)

  • Oh, Teresa;Nho, Jong Ku
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.27 no.2
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    • pp.71-75
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    • 2014
  • To observe the optical characteristic of oxide semiconductor depending on the degree of bonding structures, SiOC, ZnO and IGZO were prepared by the RF magnetron sputter system and chemical vapor deposition. Generally, crystal ZnO, amorphous SiOC and IGZO changed the optical characteristics in according to the electro-chemical behavior due to the oxygen vacancy at an interface between different groups. Transmittance of SiOC and IGZO with amorphous structures was higher than that of ZnO with crystal structure, because of lowering the carrier concentration due to the recombination of electron and holes carriers as oxygen vacancies. Besides, the energy gap of amorphous SiOC and IGZO was higher than the energy gap of crystal ZnO. The diffusion mobility of holes is higher than the drift mobility of electrons.

Development of Highly Stable Organic Nonvolatile Memory

  • Baeg, Kang-Jun;Kim, Dong-Yu;You, In-Kyu;Noh, Yong-Young
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.904-906
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    • 2009
  • Organic field-effect transistor (OFET) memory is an emerging device for its potential to realize light-weight, low cost flexible charge storage media. Here we report on a solution-processed poly[9,9-dioctylfluorenyl-2,7-diyl]-co-(bithiophene)] (F8T2) nano floating-gate memory (NFGM) with top-gate/bottom-contact device configuration. A reversible shift in the threshold voltage ($V_{Th}$) and the reliable memory characteristics were achieved by incorporation of thin Au nanoparticles (NPs) as charge storage sites for negative electrons at the interface between polystyrene and cross-linked poly(4-vinylphenol).

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Study on the Improvement of the Reliability of Al-Cu Connections in Power Distribution Systems (송배전용 Al-Cu접속 금구의 신뢰도 향상일 관한 연구(I) 알루미늄 및 동의 부식 특성)

  • Ha, Yoon-Cheol;Bae, Jeong-Hyo;Kim, Dae-Kyeong;Ha, Tae-Hyun;Lee, Hyun-Goo
    • Proceedings of the KIEE Conference
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    • 2003.07a
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    • pp.488-490
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    • 2003
  • As aluminum becomes more widely used in power distribution systems, so the corrosion caused by bimetallic contacts of aluminum and copper becomes more serious problem. In particular, the poor contact of the commonly used compression type bimetal connections may bring about the disastrous interruption of the power supply resulted from the increased corrosion within the joints, which is accelerated by the permeation of water and electrolyte into the interface. In this paper, the corrosion characteristics of aluminum and copper are investigated to improve the reliability of Al-Cu connectons.

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Controlled Assembly of Gold Nanoprism and Hexagonal Nanoplate Films for Surface Enhanced Raman Scattering

  • Lee, Doo-Ri;Hong, Soon-Chang;Park, Sung-Ho
    • Bulletin of the Korean Chemical Society
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    • v.32 no.10
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    • pp.3575-3580
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    • 2011
  • This paper reports a methodology for preparing close-packed two dimensional gold nanoprism films and hexagonal nanoplate films at a hexane/water interface. By controlling the concentration of linker molecules in the hexane layer and the temperature of the colloid solution, highly ordered close-packed nanoplate arrays can be fabricated. These films were investigated to compare their corresponding surface enhanced Raman scattering (SERS) efficiencies. It was demonstrated that the Au nanoprism films resulted in a stronger SERS enhancement than the Au hexagonal nanoplate films. The difference in the SERS enhancement is attributed to the film array difference, demonstrating that Au nanoprism films have a higher line contact density than their Au hexagonal analogues.