• 제목/요약/키워드: contact failure

검색결과 539건 처리시간 0.027초

Speckle Interferometric Detection of Defects on the backside of steel plate (스페클 간섭계를 이용한 평판 이면결함의 검출 특성)

  • 김동한;장석원;장경영
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.195-198
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    • 2001
  • Backside defect of plate structure may grow due to fatigue or overload to cause critical failure during operation, so it is important to detect this kind of defect in line. For this purpose, nondestructive, non-contact and highly sensitive method is required. ESPI and Shearography are considered as useful method to satisfy these requirements. In this paper, the possibility of application of ESPI and Shearography to detect the backside defect of steel plate and to quantify the defect size was tested. For the experiment, some steel plates with defect on the backside were prepared. Experimental results for these plates showed that location and size of defect could be detected correctly by both of ESPI and Shearography.

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The Evaluation of Thin Pressure Vessel′s Internal Defects by Laser Shearography (레이저 전단 간섭계를 이용한 압력용기의 내부 결함 평가)

  • 장경영;장석원;현민관
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.929-933
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    • 2003
  • Internal defects of thin pressure vessel used in the power plants or the chemical plants may be created and grow due to corrosion or creep fatigue to reduce the strength and cause critical failure during operation. Therefore it is very important to detect this defect at the early stage. For this purpose, non-destructive, non-contact and highly sensitive method should be considered for on-line application. In this paper, a laser shearographic interferometer is applied to inspect circular defects and notch defects existed inside of thin pressure vessel under the presence of pressure up to 3 times of atmospheric pressure. The influences of the defect shape and size as well as the internal pressure to the characteristic pattern in the shearography fringe are investigated, and the quantitative evaluation of the defect size is tried. Also the experimental results are compared with the destructive test results to show the applicability of this method to the quantitative evaluation of internal defects in the thin pressure vessel.

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Die design on the Precision Cold Forging of Spur Gear (평기어의 정밀 냉간단조 금형설계)

  • 권혁홍
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 한국공작기계학회 1998년도 추계학술대회 논문집
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    • pp.242-247
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    • 1998
  • The conventional closed-die forging processes had been applied to forging of the spur gears. But this type process requires high pressure. The commercial finite element analysis code ANSYS for the stress and elastic deformation of non-axisymmetric die was adopted in this study. In the non-axisymmetric die such as gear forging, maximum stresses were imposed on the tip of the gear tooth. When the stress exceeds yield strength of insert die, many approaches were attemped to prevent the die failure. Good shaped products are forged successfully. This type process could by used as an advanced technique to replace conventional hobbing process of gear.

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Nonlinear finite element analysis of effective CFRP bonding length and strain distribution along concrete-CFRP interface

  • Dogan, Ali Baran;Anil, Ozgur
    • Computers and Concrete
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    • 제7권5호
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    • pp.437-453
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    • 2010
  • CFRP has been widely used for strengthening reinforced concrete members in last decade. The strain transfer mechanism from concrete face to CFRP is a key factor for rigidity, ductility, energy dissipation and failure modes of concrete members. For these reasons, determination of the effective CFRP bonding length is the most crucial step to achieve effective and economical strengthening. In this paper, generalizations are made on effective bonding length by increasing the amount of test data. For this purpose, ANSYS software is employed, and an experimentally verified nonlinear finite element model is prepared. Special contact elements are utilized along the concrete-CFRP strip interface for investigating stress distribution, load-displacement behavior, and effective bonding length. Then results are compared with the experimental results. The finite element model found consistent results with the experimental findings.

The supporting effect of pipe wing rib designed to achieve early contact between ground and steel arch tunnel support

  • Kinoshita Yasunori;Shinji Masato;Nakagawa Koji;Yamamoto Minoru
    • 한국지구물리탐사학회:학술대회논문집
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    • 한국지구물리탐사학회 2003년도 Proceedings of the international symposium on the fusion technology
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    • pp.103-108
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    • 2003
  • In the construction of mountain tunnels, reaction forces of the legs of steel arch supports against the ground are often expected to support the ground being excavated. In these cases, a stress concentration occurs in the ground directly under the support legs. If the bearing capacity of the ground is insufficient or displacement is not effectively constrained, the local failure of the ground under the support legs or settlement of the tunnel supports due to large deformation could result. It is therefore necessary to reinforce the support legs to reduce settlement. As a means of reducing settlement, wing-ribbed steel arch supports are well used. In this study, with the aim of finding a way to quickly reduce the settlement of steel arch support legs, effectiveness of a new type of wing ribs to reinforce steel arch supports was investigated through laboratory testing.

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Scribing and cutting a sapphire wafer by laser-induced plasma-assisted ablation

  • Lee, Jong-Moo
    • Proceedings of the Optical Society of Korea Conference
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    • 한국광학회 2000년도 제11회 정기총회 및 00년 동계학술발표회 논문집
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    • pp.224-225
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    • 2000
  • Transparent and hard materials such as sapphire are used for many industrial applications as optical windows, hard materials on mechanical contact against abrasion, and substrate materials for opto-electronic semiconductor devices such as blue LED and blue LD etc. The materials should be cut along the proper shapes possible to be used for each application. In case of blue LED, the blue LED wafer should be cut to thousands of blue LED pieces at the final stage of the manufacturing process. The process of cutting the wafer is usually divided into two steps. The wafer is scribed along the proper shapes in the first step. It is inserted between transparent flexible sheets for easy handling. And then, it is broken and split in the next step. Harder materials such as diamonds are usually used to scribe the wafer, while it has a problem of low depth of scribing and abrasion of the harder material itself. The low depth of scribing can induce failure in breaking the wafer along the scribed line. It was also known that the expensive diamond tip should be replaced frequently for the abrasion. (omitted)

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Tool Design in a Multi-stage Rectangular Cup Drawing Process with the Large Aspect Ratio by the Finite Element Analysis - Part I. Tool Design (유한요소해석을 이용한 세장비가 큰 직사각컴 다단계 성형공정의 금형설계 - Part I. 금형설계)

  • Kim, S.H.;Kim, S.H.;Huh, H.
    • Transactions of Materials Processing
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    • 제10권2호
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    • pp.144-150
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    • 2001
  • Tool design is introduced in a multi-stage rectangular cup drawing process with the large aspect ratio. Finite element simulation is carried out to investigate deformation mechanisms with the initial tool design. The analysis reveals that the difference of the drawing ratio and the irregular contact condition produces non-uniform metal flow to cause wrinkling and severe extension. For remedy, the modification guideline is proposed in the design of the tool and process. Analysis results confirm that the modified tool design not only improves the quality of a deep-drawn product but also reduces the possibility of failure.

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3D Non-linear Analysis of Interlaminar Stress around the Hole Edge of Orthotropic Laminates (직교이방성 적층판의 Hole단부의 3D 비선형 층간응력 해석)

  • SONG KWAN-HYUNG
    • Journal of Ocean Engineering and Technology
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    • 제18권5호
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    • pp.36-42
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    • 2004
  • Orthotropic laminates, such as [$0^{\circ}6$/$90^{\circ}6$]s and [$90^{\circ}6$/$0^{\circ}6$]s, were performed, using a commercial nonlinear finite element method. Interlaminar stress distributions, around the hole curve free-edge, were calculated. The delamination bearing strengths of pin joints were predicted, using the modified delamination failure criterion. These stress distributions were presented along the radial lines and around the free-edge of the hole. Further, three-dimensional non-linear contact analysis of orthotropic laminates was conducted to investigate the effect of friction. In this paper, laminates with a circular hole were taken to study interlaminar stresses the curved edge. This study may assist in the design of a thick composite laminate with mechanically pin joints.

A Study on Improvement Plan on the Standard of Judgment of Electrical Code to Protect Against Electric Shock in the Water (수중감전예방을 위한 전기설비기술기준의 판단기준 개선방안 연구)

  • Kim, Han-Sang;Kim, Chong-Min
    • Journal of the Korean Society of Safety
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    • 제21권6호
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    • pp.33-37
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    • 2006
  • Underwater lighting is installed in water tanks, fountains and pools in waterparks, it has direct contact with water and in case of any electrical failure due to faults from electrical equipment, there is a lot of electrical shock risk. In this paper, we proposed an improvement plan of the standard of judgment of electrical code which is MOCIE (Ministry of Commerce, Industry and Energy) notification by fact finding survey and analysis of the domestic and foreign codes.

Lifetime Estimation for FPCB of Slide mobile phone (슬라이드형 휴대폰 FPCB(Flexible Printed Circuit Board)의 수명예측)

  • Choi, Jin-Young;Chang, Seog-Weon;Kwack, Kae-Dal
    • Proceedings of the KSME Conference
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1283-1288
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    • 2008
  • The FPCB is used as the important component of the sliding mechanism of mobile phones. FPCB have been used as jumper cables(fixed wiring) in various types of circuits because of their flexibility and bending property. The dominant failure mode of the FPCB is open that was caused by fatigue. The fatigue is repeated whenever the sliding is open, so it is a mainly cause of FPCB fatigue. We examined the bending-fatigue lifetime of FPCB. we focused on observing the contact resistance degradation of FPCB of mobile phones according to different test condition of bending strain. As a result, it has proved that lifetime decreased by increasing bending strain.

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