• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.122.1-122.1
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• 2011

Phosphorus is known to pile-up at the silicon surface when it is thermally oxidized. A thin layer, about 40nm thick from the silicon surface, is created containing more phosphorus than the bulk of the emitter. This layer has a gaussian profile with the peak at the surface of the silicon. In this study the pile-up effect was studied if this layer can act as a front surface field for solar cells. The effect was also tested if its high dose of phosphorus at the silicon surface can lower the contact resistance with the front metal contact. P-type wafers were first doped with phosphorus to create an n-type emitter. The doping was done using either a furnace or ion implantation. The wafers were then oxidized using dry thermal oxidation. The effect of the pile-up as a front surface field was checked by measuring the minority carrier lifetime using a QSSPC. The contact resistance of the wafers were also measured to see if the pile-up effect can lower the series resistance.

• Geomechanics and Engineering
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• v.21 no.6
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• pp.571-582
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• 2020

Aiming at the mechanical and structural characteristics of the contact zone composite rock, the uniaxial compression tests and numerical studies were carried out. The interaction forms and formation mechanisms at the contact interfaces of different materials were analyzed to reveal the effect of interaction on the mechanical behavior of composite samples. The research demonstrated that there are three types of interactions between the two materials at the contact interface: constraint parallel to the interface, squeezing perpendicular to the interface, and shear stress on the interface. The interaction is mainly affected by the differences in Poisson's ratio and elastic modulus of the two materials, stronger interface adhesion, and larger interface inclination. The interaction weakens the strength and stiffness of the composite sample, and the magnitude of weakening is positively correlated with the degree of difference in the mechanical properties of the materials. The tensile-shear stress derived from the interaction results in the axial tensile fracture perpendicular to the interface and the interfacial shear facture. Tensile cracks in stronger material will propagation into the weaker material through the bonded interface. The larger inclination angle of the interface enhances the effect of composite tensile/shear failure on the overall sample.

• The Korean Journal of Coaching Psychology
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• v.7 no.3
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• pp.57-80
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• 2023

This study aimed to examine the influence of intergenerational contact on work meaning through knowledge sharing. Additionally, based on the socioemotional selectivity theory, this study investigated whether age moderates the mediating path. We collected data from 588 full-time employees in South Korea, and analyzed the data using the latent moderated structural equation method. The results showed that knowledge sharing fully mediated the relationship between intergenerational contact and work meaning. Furthermore, age was found to moderate the relationship between intergenerational contact and work meaning via knowledge sharing. Particularly, the mediation effect was strengthened as age increased. This study holds a significant theoretical value by shedding light on the specific mechanisms underlying knowledge sharing. Moreover, the results suggest the potential for enhancing the impact of coaching programs by tailoring them to individual characteristics.

• Journal of Adhesion and Interface
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• v.21 no.3
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• pp.86-92
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• 2020

We confirmed the effects on the device performances and the charge injection characteristics of organic field-effect transistor (OFET) by selectively differently controlling the surface energies on the contact region of the substrate where the source/drain electrodes are located and the channel region between the two electrodes. When the surface energies of the channel and contact regions were kept low and increased, respectively, the field-effect mobility of the OFET devices was 0.063 ㎠/V·s, the contact resistance was 132.2 kΩ·cm, and the subthreshold swing was 0.6 V/dec. They are the results of twice and 30 times improvements compared to the pristine FET device, respectively. As the results of analyzing the interfacial trap density according to the channel length, a major reason of the improved device performances could be anticipated that the pi-pi overlapping direction of polymer semiconductor molecules and the charge injection pathway from electrode is coincided by selective surface treatment in the contact region, which finally induces the decreases of the charge trap density in the polymer semiconducting film. The selective surface treatment method for the contact region between the electrode and the polymer semiconductor used in this study has the potential to maximize the electrical performances of organic electronics by being utilized with various existing processes to lower the interface resistance.

• Journal of Korean Society of Water and Wastewater
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• v.26 no.2
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• pp.257-264
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• 2012

The concept of a non-contact type of UV disinfection system was introduced in this study. UV lamps and their quartz sleeves hang over the water surface and there is no interface between the sleeve and water. Obviously, there is no fouling. Based on optical laws and other UV distribution models, a detail mathematical model for a non-contact type UV disinfection system was developed in this study. Pathway length of UV light in a non-contact type photoreactor is longer than that in a submerged type photoreactor because the light is more refractive while passing through 3 interfaces of medium. But the pathway length passing through the water media is not significantly longer than that in a submerged type photoreactor so, the absorption of UV light by water is not significantly different from the other system. Due to the reflection effect, UV intensity is rapidly decreased as the horizontal distance from the light source is increased. The reflective attenuation in a non-contact type photoreactor is higher than that in a submerged type photoreactor. These mean that the short photoreactor is advantageous than the narrow-long photoreactor for the non-contact type photoreactor in an optical point of view.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.1120-1124
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• 2007

Recently in the automotive brake industry brake squeal noise has become one of the top automotive quality warranty issues. The contact pressure is used to predict friction coupling in the brake squeal analysis. The formulation of friction coupling has performed by nonlinear static analysis prior to the complex eigenvalue analysis. This paper proposes a validation methodology of squeal analysis using modal testing and contact analysis and examines the effect of predicted contact pressure that leads to the discrepancy between unstable complex mode and squeal frequency. This studies compose a three step validation process : examining the modal characteristics of component and assembly loaded contact pressure using modal testing and FEM analysis and verifying the contact pressure distribution using nonlinear static analysis and experiment. Finally, the unstable modes from complex eigenvalue analysis and realistic squeal frequency from the noise dynamometer are investigated.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.26 no.1
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• pp.32-37
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• 2014

The thermal contact resistance (TCR) is one of the important resistance components in cryogenic systems. Cryogenic measurement devices using a cryocooler can be affected by TCR because the device has to consist of several metal components that are in contact with each other for heat transfer to the specimen without a cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement devices using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as the roughness of the metal surface, the contact area and the contact pressure. In this study, we designed a TCR measurement system at variable temperature using a cryocooler as a heat sink. Copper was selected as a specimen in the experiment because it is widely used as a heat transfer medium in cryogenic measurement devices. We measured the TCR between Cu and Cu for various temperatures and contact pressures. The effect of the interfacial materials on the TCR was also investigated.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.6
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• pp.1008-1012
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• 2012

Injection molds are fabricated by assembling a number of plates in which mold core and cavity components are inserted. The assembled structure causes a number of contact interfaces between each component where the heat transfer is affected by the thermal contact resistance. However, the mold assembly has been treated as a one body in numerical analyses of injection molding, which has a limitation in predicting the mold temperature distribution during the molding cycle. In this study, a numerical approach that considers the thermal contact effect is proposed to predict the heat transfer characteristics of an injection mold assembly. To find the thermal contact conductance between the mold core and plate, a number of finite element (FE) simulations were performed with the design of experiment (DOE) and statistical analysis. Thus, the heat transfer analyses using the obtained conductance values can provide more reliable results than conventional one-body simulations.

• Journal of the Korean Society for Railway
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• v.10 no.4
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• pp.414-419
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• 2007

The contact characteristics of the current collection system are investigated by analyzing data collected during a test run of the Korean high speed rail vehicle. For the analysis, the signals from accelerometers and load cells attached to the various parts of the pantograph are analyzed in both the time and frequency domains. In the frequency domain, the pantograph response consists of low frequency components related to the rigid-body motion of the panhead assembly and high frequency components due to the structural vibration modes of the pantograph. The analysis shows that the inclusion of the high frequency structural vibration modes of the pantograph in the contact force calculation has a negligible effect on the predicted mean value of the contact force but significantly affects the magnitude of its fluctuations. This finding implies that numerical simulations using lumped element models of the pantograph may accurately predict the mean contact force but is limited in its capacity for predicting the fluctuation about the mean. Since the ratio of the fluctuation to the mean in the contact force increases with increased train speed, the limitation of the predictions based on numerical simulation results becomes more pronounced at higher train speed.

• Transactions on Electrical and Electronic Materials
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• v.16 no.3
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• pp.112-116
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• 2015

This work studied the thickness and contact angle of solder joints between SAC 305 lead-free solder alloy and a Copper (Cu) substrate. Intermetallic compound (IMC) thickness and contact angle of 3Sn-Ag-0.5Cu (SAC 305) leadfree solder were measured using varying aging times, at a fixed temperature at 30℃. The thickness of IMC and contact angle depend on the aging time. IMC thickness increases as the aging increases. The contact angle gradually decreased from 39.49° to 27.59° as aging time increased from zero to 24 hours for big solder sample. Meanwhile, for small solder sample, the contact angle increased from 32.00° to 40.53° from zero to 24 hours. The IMC thickness sharply increased from 0.007 mm to 0.011 mm from zero to 24 hours aging time for big solder. In spite of that, for small solder the IMC thickness gradually increased from 0.009 mm to 0.017 mm. XRD analysis was used to confirm the intermetallic formation inside the sample. Cu₆Sn₅, Cu₃Sn, Ni₃Sn and Ni₃Sn₂ IMC layers were formed between the solder and the copper substrate. As the aging time increased, the strength of the solder joint mproved due to reduced contact angle.